JP4197951B2 - ニッケルの酸化特性を抑制する方法 - Google Patents

ニッケルの酸化特性を抑制する方法 Download PDF

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Publication number
JP4197951B2
JP4197951B2 JP2002575343A JP2002575343A JP4197951B2 JP 4197951 B2 JP4197951 B2 JP 4197951B2 JP 2002575343 A JP2002575343 A JP 2002575343A JP 2002575343 A JP2002575343 A JP 2002575343A JP 4197951 B2 JP4197951 B2 JP 4197951B2
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JP
Japan
Prior art keywords
oxidation
alloy
resinate
suppressing
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002575343A
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English (en)
Japanese (ja)
Other versions
JP2005505096A5 (enExample
JP2005505096A (ja
Inventor
コッポーラ，ヴィトー，エイ．
Original Assignee
ヴィシェイ インターテクノロジー，インコーポレーティッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/824,321 external-priority patent/US20020139457A1/en
Application filed by ヴィシェイ インターテクノロジー，インコーポレーティッド filed Critical ヴィシェイ インターテクノロジー，インコーポレーティッド
Publication of JP2005505096A publication Critical patent/JP2005505096A/ja
Publication of JP2005505096A5 publication Critical patent/JP2005505096A5/ja
Application granted granted Critical
Publication of JP4197951B2 publication Critical patent/JP4197951B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0433—Nickel- or cobalt-based alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Powder Metallurgy (AREA)
JP2002575343A 2001-03-21 2001-04-04 ニッケルの酸化特性を抑制する方法 Expired - Fee Related JP4197951B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US27746501P 2001-03-21 2001-03-21
US09/824,321 US20020139457A1 (en) 2001-04-02 2001-04-02 Method of suppressing the oxidation characteristics of nickel
PCT/US2001/010897 WO2002077306A1 (en) 2001-03-21 2001-04-04 Method of suppressing the oxidation characteristics of nickel

Publications (3)

Publication Number Publication Date
JP2005505096A JP2005505096A (ja) 2005-02-17
JP2005505096A5 JP2005505096A5 (enExample) 2008-03-21
JP4197951B2 true JP4197951B2 (ja) 2008-12-17

Family

ID=26958500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002575343A Expired - Fee Related JP4197951B2 (ja) 2001-03-21 2001-04-04 ニッケルの酸化特性を抑制する方法

Country Status (4)

Country Link
US (1) US7208218B2 (enExample)
EP (1) EP1370701A1 (enExample)
JP (1) JP4197951B2 (enExample)
WO (1) WO2002077306A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100550231C (zh) * 2003-02-05 2009-10-14 Tdk株式会社 电子器件及其制造方法
JP4548392B2 (ja) * 2003-02-05 2010-09-22 Ｔｄｋ株式会社 電子部品の内部電極層形成用合金粉、導電性粒子、導電性ペーストおよびそれを用いた電子部品の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3855612A (en) * 1972-01-03 1974-12-17 Signetics Corp Schottky barrier diode semiconductor structure and method
US3872360A (en) * 1973-01-08 1975-03-18 Du Pont Capacitors with nickel containing electrodes
US3757177A (en) * 1973-01-15 1973-09-04 Johanson Mfg Monolithic base metal electrode capacitor
GB1507031A (en) * 1974-08-01 1978-04-12 Standard Telephones Cables Ltd Preparation of alloys
US4097911A (en) * 1975-10-06 1978-06-27 Erie Technological Products, Inc. Base metal electrode capacitor and method of making the same
US4055850A (en) * 1975-12-23 1977-10-25 Union Carbide Corporation Capacitor with electrode containing nickel
US4241378A (en) * 1978-06-12 1980-12-23 Erie Technological Products, Inc. Base metal electrode capacitor and method of making the same
JPS57153253A (en) 1981-03-17 1982-09-21 Ngk Spark Plug Co Ltd Gas sensing element
US4604676A (en) * 1984-10-02 1986-08-05 Murata Manufacturing Co., Ltd. Ceramic capacitor
JPS6333563A (ja) * 1986-07-25 1988-02-13 Tanaka Kikinzoku Kogyo Kk スパツタリング用Ｐｔ−Ｎｉ合金タ−ゲツトの製造方法
JPH01210035A (ja) * 1988-02-18 1989-08-23 Tanaka Kikinzoku Kogyo Kk 白金触媒とその製造方法
GB2242203A (en) * 1990-03-21 1991-09-25 Johnson Matthey Plc Catalyst material comprising platinum alloy supported on carbon
JP2885886B2 (ja) * 1990-06-07 1999-04-26 田中貴金属工業株式会社 耐熱基材への金属薄膜形成方法
JPH06103285B2 (ja) * 1992-01-16 1994-12-14 新コスモス電機株式会社 半導体ガス検出素子
JPH08115851A (ja) * 1994-10-14 1996-05-07 Ngk Spark Plug Co Ltd 薄膜コンデンサ付きセラミック基板および その製造方法
CA2280865C (en) * 1997-02-24 2008-08-12 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JP3484983B2 (ja) * 1998-07-28 2004-01-06 株式会社村田製作所 導電性ペースト及びガラス回路基板
JP4136113B2 (ja) * 1998-09-18 2008-08-20 Ｔｄｋ株式会社 チップ型積層電子部品
WO2001033589A1 (en) * 1999-11-01 2001-05-10 Tdk Corporation Multilayer ceramic electronic component
US20020139457A1 (en) * 2001-04-02 2002-10-03 Coppola Vito A. Method of suppressing the oxidation characteristics of nickel
TWI260657B (en) * 2002-04-15 2006-08-21 Avx Corp Plated terminations
US7054137B1 (en) * 2004-11-29 2006-05-30 Kemet Electronic Corporation Refractory metal nickel electrodes for capacitors

Also Published As

Publication number Publication date
US20060039821A1 (en) 2006-02-23
WO2002077306A1 (en) 2002-10-03
US7208218B2 (en) 2007-04-24
EP1370701A1 (en) 2003-12-17
JP2005505096A (ja) 2005-02-17

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