JP4165647B2 - ハウジングを装着したチップを検査し、ボードにハウジングを装着する方法 - Google Patents
ハウジングを装着したチップを検査し、ボードにハウジングを装着する方法 Download PDFInfo
- Publication number
- JP4165647B2 JP4165647B2 JP2003518243A JP2003518243A JP4165647B2 JP 4165647 B2 JP4165647 B2 JP 4165647B2 JP 2003518243 A JP2003518243 A JP 2003518243A JP 2003518243 A JP2003518243 A JP 2003518243A JP 4165647 B2 JP4165647 B2 JP 4165647B2
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- Prior art keywords
- housing
- lead
- leads
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- Expired - Fee Related
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- 238000000034 method Methods 0.000 title claims description 19
- 238000005452 bending Methods 0.000 claims description 17
- 238000007689 inspection Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0439—Feeding one by one by other means than belts incorporating means for treating the terminal leads only before insertion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Description
図1は、本発明による方法のフローチャートとそれに付随する個々の工程段階を示す。
一直線上に位置するリード1をともなって製造されたハウジング2は、チップの検査のためテストソケット3に差し込まれる。必要であれば、ハウジング2またはチップの再加工が行われる。つづいてハウジング2は包装手段の中に、たとえばブレース4の中に包装される。そして、ボード5にハウジング2を装着する直前になって初めて、たとえばリードを1本おきに(12)、曲げ加工ツール6により内側に曲げる。残りのリード11は加工されないままとする。ここでリード11と12をボード5の穴7に差し込むが、これは曲げ加工ツール6により行うのが好ましい。
図3は、リード11および12を備え、曲げ加工ツール6をかぶせられたハウジング2の正面図を示す。リードは1本おきに(12)内側に曲げられているが、残りのリード11はハウジング2を製造したときと同じ状態で、外側に曲げられているかあるいはハウジング2に垂直に立っている。
ハウジングに対してリードから得られる垂線同士の間隔は19.05mmである。1本おきのリード12はこの垂線から0.4mm内側に、残りのリード11は0.87mm外側に曲げられている。
図5は、外側に曲げられたリード11のための穴71と、内側に曲げられたリード12のための穴72とを持つボード5の一部分である。穴71と72は、1.27mmたがいに変位している。穴71および72がそれぞれの一直線上で並ぶ間隔は2.54mmである。2つの向い合ってオフセットの位置にある穴71と72の間隔は、それぞれ1.8mmとした。
2 ハウジング
3 テストソケット
4 ブレース
5 ボード
6 曲げ加工ツール
7 穴
11 外側に曲げられたリード
12 内側に曲げられたリード
71 外側に曲げられたリードのための穴
72 内側に曲げられたリードのための穴
a リード
b リード
Claims (6)
- ハウジング(2)を備えるチップを検査し、ボード(5)にハウジング(2)を装着する方法であって、そのハウジング(2)の相並ぶリード(1)が一直線上に位置してなる場合において、
チップの検査のためには、一直線上に位置するリード(1)を持つハウジング(2)をテストソケット(3)に差し込むことと、
ハウジング(2)のリード(1)をボード(5)の穴(7)に差し込む直前になって初めて、曲げ加工ツール(6)を用いて、隣り合うリード(11、12)がたがいちがいとなるように、リードを1本おきに(12)内側に曲げることを特徴とする、上記の方法。 - 曲げられなかったリードと曲げられたリード(11、12)が、ハウジング(2)の長手中心軸および横手中心軸に対して対称的に配置されることを特徴とする、請求項1に記載の方法。
- 一直線上に位置していたときのリード(11)の間隔は1.27mmであり、そしてボード(5)上の穴(71、72)の間隔は少なくとも1.8mmであることを特徴とする、請求項1または2に記載の方法。
- リード(71、72)がたがいに1.27mm変位されていることを特徴とする、前記請求項1〜3のいずれかに記載の方法。
- 前記隣り合うリードのうち内側に曲げられない方のリード(11)を指定可能な第一の角度相当分外側へ曲げ、前記隣り合うリードのうち内側に曲げられる方のリード(12)を指定可能な第二の角度相当分内側に曲げることを特徴とする、前記請求項1〜4のいずれかに記載の方法。
- 前記曲げ加工ツール(6)を用いて、ハウジング(2)をボード(5)に取り付けることを特徴とする、前記請求項1〜5のいずれかに記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10136578A DE10136578B4 (de) | 2001-07-27 | 2001-07-27 | Verfahren zum Prüfen eines Chips mit einem Gehäuse und zum Bestücken einer Platine mit dem Gehäuse sowie Chip mit einem Gehäuse |
PCT/EP2002/008369 WO2003013210A1 (de) | 2001-07-27 | 2002-07-26 | Verfahren zum prüfen eines chips mit einem gehäuse und zum bestücken einer platine mit dem gehäuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004522322A JP2004522322A (ja) | 2004-07-22 |
JP4165647B2 true JP4165647B2 (ja) | 2008-10-15 |
Family
ID=7693270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003518243A Expired - Fee Related JP4165647B2 (ja) | 2001-07-27 | 2002-07-26 | ハウジングを装着したチップを検査し、ボードにハウジングを装着する方法 |
Country Status (5)
Country | Link |
---|---|
US (3) | US7053480B2 (ja) |
EP (1) | EP1413184B1 (ja) |
JP (1) | JP4165647B2 (ja) |
DE (2) | DE10136578B4 (ja) |
WO (1) | WO2003013210A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG165981A1 (en) * | 2000-10-27 | 2010-11-29 | Chiron Srl | Nucleic acids and proteins from streptococcus groups a & b |
DE102004057007B4 (de) * | 2003-12-23 | 2020-03-19 | BSH Hausgeräte GmbH | Haushaltsgerät mit programmierbarem Steuerungsmodul |
US7501839B2 (en) * | 2005-04-21 | 2009-03-10 | Endicott Interconnect Technologies, Inc. | Interposer and test assembly for testing electronic devices |
US8769812B2 (en) | 2007-03-22 | 2014-07-08 | International Business Machines Corporation | Propagating pin corrections through physically mating devices |
US8283772B1 (en) | 2007-03-30 | 2012-10-09 | Cypress Semiconductor Corporation | Flip-flop semiconductor device packaging using bent leadfingers |
US7939371B1 (en) * | 2007-03-30 | 2011-05-10 | Cypress Semiconductor Corporation | Flip-flop semiconductor device packaging using an interposer |
US7939372B1 (en) * | 2007-03-30 | 2011-05-10 | Cypress Semiconductor Corporation | Semiconductor device packaging using etched leadfingers |
DE112014003944B4 (de) * | 2013-08-30 | 2018-08-02 | Yazaki Corporation | Verbindungsstruktur eines elektronischen Bauelements und von Metallanschlussstücken |
JP6582678B2 (ja) * | 2015-07-27 | 2019-10-02 | 三菱電機株式会社 | 半導体装置 |
NL2022759B1 (en) | 2019-03-18 | 2020-09-25 | Ampleon Netherlands Bv | Electronic package, electronic device, and lead frame |
WO2022259424A1 (ja) * | 2021-06-09 | 2022-12-15 | 三菱電機株式会社 | 光半導体装置の検査装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3441853A (en) * | 1966-06-21 | 1969-04-29 | Signetics Corp | Plug-in integrated circuit package and carrier assembly and including a test fixture therefor |
US3416348A (en) * | 1966-09-30 | 1968-12-17 | Westinghouse Electric Corp | Flat-pack lead bending device |
US3573617A (en) * | 1967-10-27 | 1971-04-06 | Aai Corp | Method and apparatus for testing packaged integrated circuits |
US3550238A (en) * | 1968-03-28 | 1970-12-29 | Usm Corp | Multi-lead component inserter |
US3564691A (en) * | 1968-09-20 | 1971-02-23 | Universal Instruments Corp | Unit carrier fed electronic component insertion machine |
US3701077A (en) * | 1969-12-29 | 1972-10-24 | Tech Inc K | Electronic components |
US3688393A (en) * | 1970-09-17 | 1972-09-05 | William M Halstead | Method and device for straightening and aligning leads of a module insertable in a circuit board |
JPS5534461A (en) * | 1978-08-31 | 1980-03-11 | Matsushita Electric Ind Co Ltd | Device for automatically inserting electric part |
US4367584A (en) * | 1980-09-15 | 1983-01-11 | Universal Instruments Corporation | Method and apparatus for straightening leads and verifying the orientation and functionality of components |
US4498047A (en) * | 1982-11-29 | 1985-02-05 | Custom Automation Designs, Inc. | Integrated circuit mounting apparatus |
US4557043A (en) * | 1983-12-05 | 1985-12-10 | Rca Corporation | Component lead processing apparatus |
JPS61269345A (ja) * | 1985-05-24 | 1986-11-28 | Hitachi Ltd | 半導体装置 |
DE3738164A1 (de) * | 1987-11-10 | 1989-05-18 | Siemens Ag | Vorrichtung zur bearbeitung und bereitstellung von tapepaks fuer bestueckautomaten |
JPH06104374A (ja) * | 1991-01-04 | 1994-04-15 | Internatl Business Mach Corp <Ibm> | 電子回路パッケージ並びにその導体の成形加工装置及び成形加工方法 |
US5585281A (en) * | 1995-02-03 | 1996-12-17 | Motorola, Inc. | Process and apparatus for forming and testing semiconductor package leads |
US5889658A (en) * | 1997-11-25 | 1999-03-30 | Motorola, Inc. | Package assembly for an electronic component |
US6134111A (en) * | 1998-04-15 | 2000-10-17 | Micron Technology, Inc. | Vertical surface mount apparatus with thermal carrier |
US6562641B1 (en) * | 2000-08-22 | 2003-05-13 | Micron Technology, Inc. | Apparatus and methods of semiconductor packages having circuit-bearing interconnect components |
-
2001
- 2001-07-27 DE DE10136578A patent/DE10136578B4/de not_active Expired - Fee Related
-
2002
- 2002-07-26 JP JP2003518243A patent/JP4165647B2/ja not_active Expired - Fee Related
- 2002-07-26 US US10/485,139 patent/US7053480B2/en not_active Expired - Fee Related
- 2002-07-26 EP EP02767264A patent/EP1413184B1/de not_active Expired - Lifetime
- 2002-07-26 WO PCT/EP2002/008369 patent/WO2003013210A1/de active IP Right Grant
- 2002-07-26 DE DE50204336T patent/DE50204336D1/de not_active Expired - Lifetime
-
2005
- 2005-05-17 US US11/130,709 patent/US7284321B2/en not_active Expired - Fee Related
- 2005-12-07 US US11/297,047 patent/US7414308B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7284321B2 (en) | 2007-10-23 |
EP1413184A1 (de) | 2004-04-28 |
DE50204336D1 (de) | 2005-10-27 |
US20050009216A1 (en) | 2005-01-13 |
DE10136578B4 (de) | 2005-05-04 |
JP2004522322A (ja) | 2004-07-22 |
US20060108679A1 (en) | 2006-05-25 |
US20050258849A1 (en) | 2005-11-24 |
WO2003013210A1 (de) | 2003-02-13 |
US7053480B2 (en) | 2006-05-30 |
US7414308B2 (en) | 2008-08-19 |
DE10136578A1 (de) | 2003-02-20 |
EP1413184B1 (de) | 2005-09-21 |
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