JP4163004B2 - 光取り出し手段を持つ電界発光素子 - Google Patents

光取り出し手段を持つ電界発光素子 Download PDF

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Publication number
JP4163004B2
JP4163004B2 JP2002586411A JP2002586411A JP4163004B2 JP 4163004 B2 JP4163004 B2 JP 4163004B2 JP 2002586411 A JP2002586411 A JP 2002586411A JP 2002586411 A JP2002586411 A JP 2002586411A JP 4163004 B2 JP4163004 B2 JP 4163004B2
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Japan
Prior art keywords
layer
mirror
tiling
photons
generation layer
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Expired - Fee Related
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JP2002586411A
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Japanese (ja)
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JP2004521509A (ja
JP2004521509A5 (enExample
Inventor
ラッティエル、マクスィム
ベニスティ、アンリ
ベイスビュシュ、クロード
Original Assignee
サントル・ナショナル・ドゥ・ラ・レシェルシュ・サイエンティフィーク−セ・エン・エール・エス−
エコール・ポリテクニク（イーピー）
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Integrated Circuits (AREA)
  • Radiation-Therapy Devices (AREA)
  • Control Of El Displays (AREA)
JP2002586411A 2001-04-26 2002-04-18 光取り出し手段を持つ電界発光素子 Expired - Fee Related JP4163004B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0105652A FR2824228B1 (fr) 2001-04-26 2001-04-26 Dispositif electroluminescent a extracteur de lumiere
PCT/FR2002/001341 WO2002089218A2 (fr) 2001-04-26 2002-04-18 Dispositif electroluminescent a extracteur de lumiere

Publications (3)

Publication Number Publication Date
JP2004521509A JP2004521509A (ja) 2004-07-15
JP2004521509A5 JP2004521509A5 (enExample) 2008-07-17
JP4163004B2 true JP4163004B2 (ja) 2008-10-08

Family

ID=8862739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002586411A Expired - Fee Related JP4163004B2 (ja) 2001-04-26 2002-04-18 光取り出し手段を持つ電界発光素子

Country Status (9)

Country Link
US (1) US6987288B2 (enExample)
EP (1) EP1382074B1 (enExample)
JP (1) JP4163004B2 (enExample)
AT (1) ATE488027T1 (enExample)
AU (1) AU2002256752A1 (enExample)
CA (1) CA2444338C (enExample)
DE (1) DE60238245D1 (enExample)
FR (1) FR2824228B1 (enExample)
WO (1) WO2002089218A2 (enExample)

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JP2004172506A (ja) * 2002-11-22 2004-06-17 Sony Corp 半導体レーザ素子
JP4610863B2 (ja) * 2003-03-19 2011-01-12 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー フォトニック結晶構造を使用するｌｅｄ効率の改良
JP4263121B2 (ja) * 2003-03-27 2009-05-13 三洋電機株式会社 発光素子および照明装置
US7078735B2 (en) 2003-03-27 2006-07-18 Sanyo Electric Co., Ltd. Light-emitting device and illuminator
US7083993B2 (en) * 2003-04-15 2006-08-01 Luminus Devices, Inc. Methods of making multi-layer light emitting devices
US7098589B2 (en) * 2003-04-15 2006-08-29 Luminus Devices, Inc. Light emitting devices with high light collimation
US7262550B2 (en) * 2003-04-15 2007-08-28 Luminus Devices, Inc. Light emitting diode utilizing a physical pattern
US7166871B2 (en) * 2003-04-15 2007-01-23 Luminus Devices, Inc. Light emitting systems
US6831302B2 (en) * 2003-04-15 2004-12-14 Luminus Devices, Inc. Light emitting devices with improved extraction efficiency
US20050173714A1 (en) * 2004-02-06 2005-08-11 Ho-Shang Lee Lighting system with high and improved extraction efficiency
US7250635B2 (en) * 2004-02-06 2007-07-31 Dicon Fiberoptics, Inc. Light emitting system with high extraction efficency
US7582910B2 (en) * 2005-02-28 2009-09-01 The Regents Of The University Of California High efficiency light emitting diode (LED) with optimized photonic crystal extractor
US7442964B2 (en) 2004-08-04 2008-10-28 Philips Lumileds Lighting Company, Llc Photonic crystal light emitting device with multiple lattices
JP2006059864A (ja) * 2004-08-17 2006-03-02 Yokohama National Univ 発光素子
US7509012B2 (en) * 2004-09-22 2009-03-24 Luxtaltek Corporation Light emitting diode structures
JP4410123B2 (ja) 2005-02-10 2010-02-03 株式会社東芝 有機ｅｌディスプレイ
JP2008311687A (ja) * 2005-03-28 2008-12-25 Stanley Electric Co Ltd 自発光デバイス
KR100706796B1 (ko) * 2005-08-19 2007-04-12 삼성전자주식회사 질화물계 탑에미트형 발광소자 및 그 제조 방법
JP4843284B2 (ja) * 2005-09-22 2011-12-21 パナソニック電工株式会社 半導体発光素子およびその製造方法
JP2007088273A (ja) * 2005-09-22 2007-04-05 Matsushita Electric Works Ltd 半導体発光素子およびその製造方法
US7717343B2 (en) * 2006-01-12 2010-05-18 Hand Held Products, Inc. High-efficiency illumination in data collection devices
DE102006017573A1 (de) * 2006-04-13 2007-10-18 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zu dessen Herstellung
KR100736623B1 (ko) 2006-05-08 2007-07-09 엘지전자 주식회사 수직형 발광 소자 및 그 제조방법
KR101113878B1 (ko) 2006-06-23 2012-03-09 엘지이노텍 주식회사 수직형 발광 소자 및 그 제조방법
JP5168890B2 (ja) * 2006-11-24 2013-03-27 日亜化学工業株式会社 半導体発光素子及び半導体発光素子の製造方法
EP2122695A4 (en) * 2007-03-08 2013-09-11 3M Innovative Properties Co NETWORK OF LUMINESCENT ELEMENTS
JP5242975B2 (ja) * 2007-09-03 2013-07-24 独立行政法人科学技術振興機構 回折格子型発光ダイオード
JP2009170508A (ja) * 2008-01-11 2009-07-30 Furukawa Electric Co Ltd:The 面発光半導体レーザ及びその製造方法
WO2009148717A2 (en) * 2008-06-05 2009-12-10 3M Innovative Properties Company Light emitting diode with bonded semiconductor wavelength converter
US20110101402A1 (en) * 2008-06-26 2011-05-05 Jun-Ying Zhang Semiconductor light converting construction
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US9053959B2 (en) * 2008-06-26 2015-06-09 3M Innovative Properties Company Semiconductor light converting construction
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JP2011187616A (ja) * 2010-03-08 2011-09-22 Toshiba Corp 半導体発光素子およびその製造方法
DE102014110069A1 (de) * 2014-07-17 2016-01-21 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Strukturierungsmaske und einer Oberflächenstrukturierung
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FR3059787B1 (fr) * 2016-12-02 2019-01-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoelectronique a diode electroluminescente a extraction augmentee
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CN117316564B (zh) * 2023-09-26 2025-04-04 南京大学 一种CoMnSi基磁致伸缩复合材料及其制备方法
CN118352450A (zh) * 2024-04-03 2024-07-16 江苏宜兴德融科技有限公司 一种红光led结构及其制备方法

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Also Published As

Publication number Publication date
JP2004521509A (ja) 2004-07-15
EP1382074A2 (fr) 2004-01-21
EP1382074B1 (fr) 2010-11-10
FR2824228A1 (fr) 2002-10-31
US6987288B2 (en) 2006-01-17
CA2444338A1 (fr) 2002-11-07
US20040141333A1 (en) 2004-07-22
CA2444338C (fr) 2012-10-30
AU2002256752A1 (en) 2002-11-11
ATE488027T1 (de) 2010-11-15
WO2002089218A2 (fr) 2002-11-07
DE60238245D1 (de) 2010-12-23
FR2824228B1 (fr) 2003-08-01
WO2002089218A3 (fr) 2003-01-09

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