JP4157693B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP4157693B2
JP4157693B2 JP2001307902A JP2001307902A JP4157693B2 JP 4157693 B2 JP4157693 B2 JP 4157693B2 JP 2001307902 A JP2001307902 A JP 2001307902A JP 2001307902 A JP2001307902 A JP 2001307902A JP 4157693 B2 JP4157693 B2 JP 4157693B2
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Japan
Prior art keywords
electroless
plating layer
plating
semiconductor device
copper
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Expired - Fee Related
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JP2001307902A
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English (en)
Japanese (ja)
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JP2003115489A (ja
JP2003115489A5 (cg-RX-API-DMAC7.html
Inventor
豊 牧野
哲也 藤沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
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Fujitsu Ltd
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Publication date
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Priority to JP2001307902A priority Critical patent/JP4157693B2/ja
Publication of JP2003115489A publication Critical patent/JP2003115489A/ja
Publication of JP2003115489A5 publication Critical patent/JP2003115489A5/ja
Application granted granted Critical
Publication of JP4157693B2 publication Critical patent/JP4157693B2/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2001307902A 2001-10-03 2001-10-03 半導体装置及びその製造方法 Expired - Fee Related JP4157693B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001307902A JP4157693B2 (ja) 2001-10-03 2001-10-03 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001307902A JP4157693B2 (ja) 2001-10-03 2001-10-03 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2003115489A JP2003115489A (ja) 2003-04-18
JP2003115489A5 JP2003115489A5 (cg-RX-API-DMAC7.html) 2005-06-16
JP4157693B2 true JP4157693B2 (ja) 2008-10-01

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ID=19127287

Family Applications (1)

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JP2001307902A Expired - Fee Related JP4157693B2 (ja) 2001-10-03 2001-10-03 半導体装置及びその製造方法

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JP (1) JP4157693B2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220384104A1 (en) * 2021-05-31 2022-12-01 Murata Manufacturing Co., Ltd. Electronic component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240309511A1 (en) 2021-02-03 2024-09-19 Tokyo Electron Limited Plating method and plating apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129377A (ja) * 1991-10-31 1993-05-25 Sumitomo Metal Mining Co Ltd 銅ポリイミド基板の製造方法
JP2003023009A (ja) * 2001-07-10 2003-01-24 Toppan Printing Co Ltd 半導体装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220384104A1 (en) * 2021-05-31 2022-12-01 Murata Manufacturing Co., Ltd. Electronic component
US11869716B2 (en) * 2021-05-31 2024-01-09 Murata Manufacturing Co., Ltd. Electronic component
US20240105386A1 (en) * 2021-05-31 2024-03-28 Murata Manufacturing Co., Ltd. Electronic component
US12237110B2 (en) * 2021-05-31 2025-02-25 Murata Manufacturing Co., Ltd. Electronic component

Also Published As

Publication number Publication date
JP2003115489A (ja) 2003-04-18

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