JP4154605B2 - 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法 - Google Patents

熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法 Download PDF

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JP4154605B2
JP4154605B2 JP2004016155A JP2004016155A JP4154605B2 JP 4154605 B2 JP4154605 B2 JP 4154605B2 JP 2004016155 A JP2004016155 A JP 2004016155A JP 2004016155 A JP2004016155 A JP 2004016155A JP 4154605 B2 JP4154605 B2 JP 4154605B2
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heat
component
group
dissipating
composition
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Expired - Fee Related
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JP2004016155A
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Japanese (ja)
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JP2005206733A (ja
Inventor
雅弥 朝稲
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2004016155A priority Critical patent/JP4154605B2/ja
Priority to TW094101892A priority patent/TW200536896A/zh
Priority to KR1020050005903A priority patent/KR101127285B1/ko
Priority to CNB2005100056135A priority patent/CN100565854C/zh
Publication of JP2005206733A publication Critical patent/JP2005206733A/ja
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Publication of JP4154605B2 publication Critical patent/JP4154605B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004016155A 2004-01-23 2004-01-23 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法 Expired - Fee Related JP4154605B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004016155A JP4154605B2 (ja) 2004-01-23 2004-01-23 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法
TW094101892A TW200536896A (en) 2004-01-23 2005-01-21 Composition for heat conductive siloxanes heat release and its using method
KR1020050005903A KR101127285B1 (ko) 2004-01-23 2005-01-21 열전도성 실리콘 방열용 조성물 및 방열 구조의 제조 방법
CNB2005100056135A CN100565854C (zh) 2004-01-23 2005-01-21 导热性硅氧烷放热用组合物及其使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004016155A JP4154605B2 (ja) 2004-01-23 2004-01-23 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法

Publications (2)

Publication Number Publication Date
JP2005206733A JP2005206733A (ja) 2005-08-04
JP4154605B2 true JP4154605B2 (ja) 2008-09-24

Family

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JP2004016155A Expired - Fee Related JP4154605B2 (ja) 2004-01-23 2004-01-23 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法

Country Status (4)

Country Link
JP (1) JP4154605B2 (enExample)
KR (1) KR101127285B1 (enExample)
CN (1) CN100565854C (enExample)
TW (1) TW200536896A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803365B2 (ja) * 2006-02-22 2011-10-26 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5093488B2 (ja) * 2008-04-15 2012-12-12 信越化学工業株式会社 熱伝導性シリコーン組成物及び接着構造体並びに半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置
JP5740864B2 (ja) * 2010-08-03 2015-07-01 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
EP3643498B1 (en) * 2018-05-08 2021-06-02 Fuji Polymer Industries Co., Ltd. Heat-conductive sheet, mounting method using same and bonding method using same
KR20230161957A (ko) 2021-03-31 2023-11-28 세키수이 폴리머텍 가부시키가이샤 열전도성 조성물, 열전도성 부재, 배터리 모듈

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374967A (en) * 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
DE4328657A1 (de) * 1993-08-26 1995-03-02 Bayer Ag Organopolysiloxanmischung zur Herstellung von klebstoffabweisenden Organopolysiloxanfilmen
JP2819444B2 (ja) * 1993-11-08 1998-10-30 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
JP2001214063A (ja) * 2000-01-31 2001-08-07 Dow Corning Toray Silicone Co Ltd シリコーンゲル組成物およびシリコーンゲル
JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP2002363412A (ja) * 2001-06-11 2002-12-18 Three Bond Co Ltd 熱伝導性組成物
JP3803058B2 (ja) * 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体

Also Published As

Publication number Publication date
KR101127285B1 (ko) 2012-03-30
CN100565854C (zh) 2009-12-02
TW200536896A (en) 2005-11-16
TWI354005B (enExample) 2011-12-11
CN1649134A (zh) 2005-08-03
JP2005206733A (ja) 2005-08-04
KR20050076763A (ko) 2005-07-27

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