CN100565854C - 导热性硅氧烷放热用组合物及其使用方法 - Google Patents

导热性硅氧烷放热用组合物及其使用方法 Download PDF

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Publication number
CN100565854C
CN100565854C CNB2005100056135A CN200510005613A CN100565854C CN 100565854 C CN100565854 C CN 100565854C CN B2005100056135 A CNB2005100056135 A CN B2005100056135A CN 200510005613 A CN200510005613 A CN 200510005613A CN 100565854 C CN100565854 C CN 100565854C
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China
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component
composition
thermally conductive
group
heat
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Expired - Fee Related
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Chinese (zh)
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CN1649134A (zh
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朝稻雅弥
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB2005100056135A 2004-01-23 2005-01-21 导热性硅氧烷放热用组合物及其使用方法 Expired - Fee Related CN100565854C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004016155A JP4154605B2 (ja) 2004-01-23 2004-01-23 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法
JP2004016155 2004-01-23

Publications (2)

Publication Number Publication Date
CN1649134A CN1649134A (zh) 2005-08-03
CN100565854C true CN100565854C (zh) 2009-12-02

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ID=34879026

Family Applications (1)

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CNB2005100056135A Expired - Fee Related CN100565854C (zh) 2004-01-23 2005-01-21 导热性硅氧烷放热用组合物及其使用方法

Country Status (4)

Country Link
JP (1) JP4154605B2 (enExample)
KR (1) KR101127285B1 (enExample)
CN (1) CN100565854C (enExample)
TW (1) TW200536896A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803365B2 (ja) * 2006-02-22 2011-10-26 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5093488B2 (ja) * 2008-04-15 2012-12-12 信越化学工業株式会社 熱伝導性シリコーン組成物及び接着構造体並びに半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置
JP5740864B2 (ja) * 2010-08-03 2015-07-01 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
EP3643498B1 (en) * 2018-05-08 2021-06-02 Fuji Polymer Industries Co., Ltd. Heat-conductive sheet, mounting method using same and bonding method using same
KR20230161957A (ko) 2021-03-31 2023-11-28 세키수이 폴리머텍 가부시키가이샤 열전도성 조성물, 열전도성 부재, 배터리 모듈

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374967A (en) * 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
CN1102841A (zh) * 1993-08-26 1995-05-24 拜尔公司 用于制备防粘附有机聚硅氧烷膜的有机聚硅氧烷混合物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2819444B2 (ja) * 1993-11-08 1998-10-30 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
JP2001214063A (ja) * 2000-01-31 2001-08-07 Dow Corning Toray Silicone Co Ltd シリコーンゲル組成物およびシリコーンゲル
JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP2002363412A (ja) * 2001-06-11 2002-12-18 Three Bond Co Ltd 熱伝導性組成物
JP3803058B2 (ja) * 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374967A (en) * 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
CN1102841A (zh) * 1993-08-26 1995-05-24 拜尔公司 用于制备防粘附有机聚硅氧烷膜的有机聚硅氧烷混合物

Also Published As

Publication number Publication date
KR101127285B1 (ko) 2012-03-30
TW200536896A (en) 2005-11-16
TWI354005B (enExample) 2011-12-11
CN1649134A (zh) 2005-08-03
JP2005206733A (ja) 2005-08-04
JP4154605B2 (ja) 2008-09-24
KR20050076763A (ko) 2005-07-27

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