KR101127285B1 - 열전도성 실리콘 방열용 조성물 및 방열 구조의 제조 방법 - Google Patents

열전도성 실리콘 방열용 조성물 및 방열 구조의 제조 방법 Download PDF

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KR101127285B1
KR101127285B1 KR1020050005903A KR20050005903A KR101127285B1 KR 101127285 B1 KR101127285 B1 KR 101127285B1 KR 1020050005903 A KR1020050005903 A KR 1020050005903A KR 20050005903 A KR20050005903 A KR 20050005903A KR 101127285 B1 KR101127285 B1 KR 101127285B1
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South Korea
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component
heat
group
composition
heat dissipation
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Korean (ko)
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KR20050076763A (ko
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마사야 아사이네
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신에쓰 가가꾸 고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020050005903A 2004-01-23 2005-01-21 열전도성 실리콘 방열용 조성물 및 방열 구조의 제조 방법 Expired - Fee Related KR101127285B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004016155A JP4154605B2 (ja) 2004-01-23 2004-01-23 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法
JPJP-P-2004-00016155 2004-01-23

Publications (2)

Publication Number Publication Date
KR20050076763A KR20050076763A (ko) 2005-07-27
KR101127285B1 true KR101127285B1 (ko) 2012-03-30

Family

ID=34879026

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050005903A Expired - Fee Related KR101127285B1 (ko) 2004-01-23 2005-01-21 열전도성 실리콘 방열용 조성물 및 방열 구조의 제조 방법

Country Status (4)

Country Link
JP (1) JP4154605B2 (enExample)
KR (1) KR101127285B1 (enExample)
CN (1) CN100565854C (enExample)
TW (1) TW200536896A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803365B2 (ja) * 2006-02-22 2011-10-26 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5093488B2 (ja) * 2008-04-15 2012-12-12 信越化学工業株式会社 熱伝導性シリコーン組成物及び接着構造体並びに半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置
JP5740864B2 (ja) * 2010-08-03 2015-07-01 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
EP3643498B1 (en) * 2018-05-08 2021-06-02 Fuji Polymer Industries Co., Ltd. Heat-conductive sheet, mounting method using same and bonding method using same
KR20230161957A (ko) 2021-03-31 2023-11-28 세키수이 폴리머텍 가부시키가이샤 열전도성 조성물, 열전도성 부재, 배터리 모듈

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07133432A (ja) * 1993-11-08 1995-05-23 Toray Dow Corning Silicone Co Ltd 導電性シリコーンゴム組成物
JP2001214063A (ja) * 2000-01-31 2001-08-07 Dow Corning Toray Silicone Co Ltd シリコーンゲル組成物およびシリコーンゲル
JP2002327116A (ja) * 2001-05-01 2002-11-15 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置
JP2002363412A (ja) * 2001-06-11 2002-12-18 Three Bond Co Ltd 熱伝導性組成物
KR20030047839A (ko) * 2001-12-11 2003-06-18 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물, 그의 경화물 및 부설 방법 및이를 이용한 반도체 장치의 방열 구조체

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374967A (en) * 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
DE4328657A1 (de) * 1993-08-26 1995-03-02 Bayer Ag Organopolysiloxanmischung zur Herstellung von klebstoffabweisenden Organopolysiloxanfilmen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07133432A (ja) * 1993-11-08 1995-05-23 Toray Dow Corning Silicone Co Ltd 導電性シリコーンゴム組成物
JP2001214063A (ja) * 2000-01-31 2001-08-07 Dow Corning Toray Silicone Co Ltd シリコーンゲル組成物およびシリコーンゲル
JP2002327116A (ja) * 2001-05-01 2002-11-15 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置
JP2002363412A (ja) * 2001-06-11 2002-12-18 Three Bond Co Ltd 熱伝導性組成物
KR20030047839A (ko) * 2001-12-11 2003-06-18 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물, 그의 경화물 및 부설 방법 및이를 이용한 반도체 장치의 방열 구조체

Also Published As

Publication number Publication date
CN100565854C (zh) 2009-12-02
TW200536896A (en) 2005-11-16
TWI354005B (enExample) 2011-12-11
CN1649134A (zh) 2005-08-03
JP2005206733A (ja) 2005-08-04
JP4154605B2 (ja) 2008-09-24
KR20050076763A (ko) 2005-07-27

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