JP4152375B2 - 電子部品の印刷装置 - Google Patents
電子部品の印刷装置 Download PDFInfo
- Publication number
- JP4152375B2 JP4152375B2 JP2004329980A JP2004329980A JP4152375B2 JP 4152375 B2 JP4152375 B2 JP 4152375B2 JP 2004329980 A JP2004329980 A JP 2004329980A JP 2004329980 A JP2004329980 A JP 2004329980A JP 4152375 B2 JP4152375 B2 JP 4152375B2
- Authority
- JP
- Japan
- Prior art keywords
- roller
- workpiece
- squeegee
- plastic material
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/44—Squeegees or doctors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
Description
101:一面
102:他面
103:通孔パターン(開口部)
2:ワークピース(回路基板、表面実装部)
21:一面
3:ローラ
31:両端部
32:周面
33:先端
34:支軸
35:支持片
36:直動案内軸受
37:ガイドレール
38:ブラケット
4:移動手段
40:ボールナット
41:送りネジ
5:回転手段
50:回転機
501,502:タイミングプーリ
503:タイミングベルト
51:ステータ
52:ロータ
53:インナケーシング
54:空隙
55:アウタケーシング
57:通気孔
58:内孔
6:スキージ
601:スキージ
7:印圧発生手段
70,72:滑節
71:作動ロッド
8:減速機
9:リンク部材
91:セクタギア
92:プラネタリギア
93:連結軸
94:ピン
95:スキージ支持バー
10:ピニオン
11:ラック
12:アライメントテーブル
121:調整機構
13:上部密封室
14:下部密封室
15:差圧発生手段
151:真空ポンプ
152,153:リーク弁
154,155:ストップ弁
17:バンドブレーキ
18:枠体
230:基盤
231:凹部
232:架台
233:蓋体
234:挿通孔
E1:印刷装置
E2:製造装置
m:可塑性材料
P1,P3:位置
P2,P4:接点位置
X:軸方向
Y,Z:矢印、移動方向
Claims (8)
- 一面を上向きにして水平に位置決めされるワークピースに、可塑性材料を押込充填する電子部品の印刷装置であって、
前記ワークピースの近傍に軸方向の端部が支持され周面を前記ワークピースの一面に近接するローラと、該ローラを前記ワークピースの一面に沿って移動させる移動手段と、該移動手段が前記ローラを移動する移動方向に対して前転する方向に前記ローラを回転させる回転手段と、前記ローラに近接又は接触して前記ローラの周面に沿って旋回可能に支持されるスキージと、前記回転手段が前記ローラを回転させるトルクの反力により前記スキージを前記ワークピースの一面に押し付ける印圧発生手段とを備えることを特徴とする電子部品の印刷装置。 - 前記回転手段は、前記ローラに内装され相対的に回転可能なロータ及びステータを有する回転機と、前記ローラの軸方向に延び前記ローラの端部を貫いて先端を前記ローラの外部へ突出する支軸と、該支軸に前記回転機のロータを接続する減速機と、前記支軸の先端付近から前記ローラの径方向へ延出して前記スキージを支持するリンク部材とを備え、前記ロータが回転駆動する反力を前記スキージが受けると共に、前記ロータの回転を前記減速機で減速しつつ前記支軸へ伝達する請求項1に記載の電子部品の印刷装置。
- 前記印圧発生手段は、前記ローラの回転を制動するブレーキ装置を備え、前記回転機が前記ローラを前記ブレーキ装置の制動に抗して回転させるトルクの反力にて、前記リンク部材を、前記ローラの回転する方向と反対方向へ旋回させることにより、前記スキージを前記ワークピースの一面に押し付けるようにしてある請求項2に記載の電子部品の印刷装置。
- 前記ローラが、前記回転機を収納するインナケーシングと、該インナケーシングの周りに配置され且つゴムライニングされた筒状アウタケーシングとを備え、前記インナケーシングと前記筒状アウタケーシングとの間に、空気を誘引するための空隙を設けてある請求項2又は3に記載の電子部品の印刷装置。
- 前記支軸が、一端を真空引きされ他端を前記ローラ内に連通した中空軸から成り、前記ローラ内の空気を前記支軸を介して真空引きすることにより、前記ローラを強制冷却する請求項2乃至4の何れかに記載の電子部品の印刷装置。
- 前記移動手段は、前記ローラの端部に結合したローラ径以下の直径を有するピニオンと、前記ワークピースの側方に敷設され前記移動方向へ延びるラックと、前記ローラの内部で回転可能なロータを有する回転機とを備え、前記ラックを前記ピニオンに噛み合わせ、前記回転機のロータの回転に従わせて前記ローラと共に前記ピニオンを回転することにより、前記ローラを前記移動方向へ移動させる請求項1乃至5の何れかに記載の電子部品の印刷装置。
- 前記移動手段は、前記ローラを回転自在に支持するブラケットを、前記ローラの外部に設けられた駆動源により、前記移動方向へ移動させる請求項1乃至5の何れかに記載の電子部品の印刷装置。
- 前記可塑性材料を通過させる通孔パターンを有する孔版を、前記ワークピースの一面に重ね合わせた請求項1乃至7の何れかに記載の電子部品の印刷装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004329980A JP4152375B2 (ja) | 2004-01-14 | 2004-11-15 | 電子部品の印刷装置 |
TW094100863A TW200531236A (en) | 2004-01-14 | 2005-01-12 | Printing device, production unit, and production method of electronic parts |
KR1020050003778A KR100696213B1 (ko) | 2004-01-14 | 2005-01-14 | 전자부품의 인쇄장치, 제조장치, 및 제조방법 |
US11/036,820 US7383770B2 (en) | 2004-01-14 | 2005-01-14 | Printing device for electronic parts having a roller and a squeegee arrangement |
US11/959,776 US7762184B2 (en) | 2004-01-14 | 2007-12-19 | Production unit including a printing device and upper and lower sealed chambers |
US11/962,059 US20090014909A1 (en) | 2004-01-14 | 2007-12-20 | Printing device, production unit, and production method of electronic parts |
US11/962,064 US8033218B2 (en) | 2004-01-14 | 2007-12-20 | Printing device, production unit, and production method of electronic parts |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004007002 | 2004-01-14 | ||
JP2004329980A JP4152375B2 (ja) | 2004-01-14 | 2004-11-15 | 電子部品の印刷装置 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008074930A Division JP4644264B2 (ja) | 2004-01-14 | 2008-03-24 | 電子部品の製造装置 |
JP2008074937A Division JP4644266B2 (ja) | 2004-01-14 | 2008-03-24 | 電子部品の製造方法 |
JP2008074933A Division JP4644265B2 (ja) | 2004-01-14 | 2008-03-24 | 電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005229094A JP2005229094A (ja) | 2005-08-25 |
JP4152375B2 true JP4152375B2 (ja) | 2008-09-17 |
Family
ID=34742187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004329980A Active JP4152375B2 (ja) | 2004-01-14 | 2004-11-15 | 電子部品の印刷装置 |
Country Status (4)
Country | Link |
---|---|
US (4) | US7383770B2 (ja) |
JP (1) | JP4152375B2 (ja) |
KR (1) | KR100696213B1 (ja) |
TW (1) | TW200531236A (ja) |
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-
2004
- 2004-11-15 JP JP2004329980A patent/JP4152375B2/ja active Active
-
2005
- 2005-01-12 TW TW094100863A patent/TW200531236A/zh unknown
- 2005-01-14 US US11/036,820 patent/US7383770B2/en not_active Expired - Fee Related
- 2005-01-14 KR KR1020050003778A patent/KR100696213B1/ko active IP Right Grant
-
2007
- 2007-12-19 US US11/959,776 patent/US7762184B2/en not_active Expired - Fee Related
- 2007-12-20 US US11/962,064 patent/US8033218B2/en not_active Expired - Fee Related
- 2007-12-20 US US11/962,059 patent/US20090014909A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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US20050150402A1 (en) | 2005-07-14 |
US20090000498A1 (en) | 2009-01-01 |
KR20050074929A (ko) | 2005-07-19 |
KR100696213B1 (ko) | 2007-03-20 |
TW200531236A (en) | 2005-09-16 |
US20080206929A1 (en) | 2008-08-28 |
US7762184B2 (en) | 2010-07-27 |
TWI357134B (ja) | 2012-01-21 |
US7383770B2 (en) | 2008-06-10 |
JP2005229094A (ja) | 2005-08-25 |
US20090014909A1 (en) | 2009-01-15 |
US8033218B2 (en) | 2011-10-11 |
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