JP4144795B2 - 低誘電率層間絶縁膜のドライエッチング方法 - Google Patents
低誘電率層間絶縁膜のドライエッチング方法 Download PDFInfo
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- JP4144795B2 JP4144795B2 JP2003271060A JP2003271060A JP4144795B2 JP 4144795 B2 JP4144795 B2 JP 4144795B2 JP 2003271060 A JP2003271060 A JP 2003271060A JP 2003271060 A JP2003271060 A JP 2003271060A JP 4144795 B2 JP4144795 B2 JP 4144795B2
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- insulating film
- interlayer insulating
- etching
- gas
- dielectric constant
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Description
11 真空チャンバ
12 プラズマ発生部
13 基板電極部
S 基板
Claims (2)
- SiOCH或いはSiOC系材料からなる低誘電率層間絶縁膜をエッチングし、配線用のホール、トレンチを微細加工する低誘電率層間絶縁膜のドライエッチング方法において、
C 2 F 6 ガスまたはC 3 F 8 ガスに、総流量に対して20〜50%の比率でCH 3 CHF 2 ガスを添加した混合ガスをエッチングガスとし、1Pa以下の作動圧力下でこのエッチングガスを導入してエッチングすることを特徴とする低誘電率層間絶縁膜のドライエッチング方法。 - 前記混合ガスに希ガスを添加することを特徴とする請求項1記載の低誘電率層間絶縁膜のドライエッチング方法。
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JP2003271060A JP4144795B2 (ja) | 2003-07-04 | 2003-07-04 | 低誘電率層間絶縁膜のドライエッチング方法 |
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JP2003271060A JP4144795B2 (ja) | 2003-07-04 | 2003-07-04 | 低誘電率層間絶縁膜のドライエッチング方法 |
Publications (2)
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JP2005033016A JP2005033016A (ja) | 2005-02-03 |
JP4144795B2 true JP4144795B2 (ja) | 2008-09-03 |
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JP2003271060A Expired - Fee Related JP4144795B2 (ja) | 2003-07-04 | 2003-07-04 | 低誘電率層間絶縁膜のドライエッチング方法 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006278517A (ja) * | 2005-03-28 | 2006-10-12 | Tokyo Electron Ltd | プラズマエッチング方法、プラズマエッチング装置、制御プログラム及びコンピュータ記憶媒体 |
KR100737009B1 (ko) * | 2005-12-13 | 2007-07-09 | 현대자동차주식회사 | 수동댐퍼와 댐핑 보상제어를 통한 스티어 바이 와이어시스템의 반력 제어 시스템 및 그의 방법 |
KR101973077B1 (ko) | 2012-01-18 | 2019-04-29 | 삼성디스플레이 주식회사 | 트렌치 형성 방법, 금속 배선 형성 방법, 및 박막 트랜지스터 표시판의 제조 방법 |
JP6621882B2 (ja) * | 2018-08-08 | 2019-12-18 | 東京エレクトロン株式会社 | エッチング装置 |
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