JP4121396B2 - ポジ型レジスト組成物 - Google Patents
ポジ型レジスト組成物 Download PDFInfo
- Publication number
- JP4121396B2 JP4121396B2 JP2003058732A JP2003058732A JP4121396B2 JP 4121396 B2 JP4121396 B2 JP 4121396B2 JP 2003058732 A JP2003058732 A JP 2003058732A JP 2003058732 A JP2003058732 A JP 2003058732A JP 4121396 B2 JP4121396 B2 JP 4121396B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- carbon atoms
- resist composition
- resin
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 0 C*CC(*C)c(cc1)ccc1O Chemical compound C*CC(*C)c(cc1)ccc1O 0.000 description 11
- IQUBASWXDDUPNZ-UHFFFAOYSA-N CCC(C)c(cc1)ccc1OC(C)OCCOC(CC1)=CC=C1Oc1ccccc1 Chemical compound CCC(C)c(cc1)ccc1OC(C)OCCOC(CC1)=CC=C1Oc1ccccc1 IQUBASWXDDUPNZ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003058732A JP4121396B2 (ja) | 2003-03-05 | 2003-03-05 | ポジ型レジスト組成物 |
| US10/791,559 US7326513B2 (en) | 2003-03-05 | 2004-03-03 | Positive working resist composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003058732A JP4121396B2 (ja) | 2003-03-05 | 2003-03-05 | ポジ型レジスト組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004271629A JP2004271629A (ja) | 2004-09-30 |
| JP2004271629A5 JP2004271629A5 (enExample) | 2005-09-22 |
| JP4121396B2 true JP4121396B2 (ja) | 2008-07-23 |
Family
ID=32923568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003058732A Expired - Lifetime JP4121396B2 (ja) | 2003-03-05 | 2003-03-05 | ポジ型レジスト組成物 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7326513B2 (enExample) |
| JP (1) | JP4121396B2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4557159B2 (ja) * | 2004-04-15 | 2010-10-06 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材料及びこれを用いたパターン形成方法 |
| JP4452563B2 (ja) * | 2004-06-14 | 2010-04-21 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
| JP4448767B2 (ja) * | 2004-10-08 | 2010-04-14 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
| JP4533831B2 (ja) * | 2005-09-29 | 2010-09-01 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
| JP5183903B2 (ja) * | 2006-10-13 | 2013-04-17 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びこれを用いたパターン形成方法 |
| JP5039410B2 (ja) * | 2007-03-29 | 2012-10-03 | 富士フイルム株式会社 | ポジ型レジスト組成物およびこれを用いたパターン形成方法 |
| JP4982228B2 (ja) * | 2007-03-30 | 2012-07-25 | 富士フイルム株式会社 | ポジ型レジスト組成物及びこれを用いたパターン形成方法 |
| JP2009080162A (ja) * | 2007-09-25 | 2009-04-16 | Fujifilm Corp | 感光性組成物及びそれを用いたパターン形成方法 |
| JP5150296B2 (ja) | 2008-02-13 | 2013-02-20 | 富士フイルム株式会社 | 電子線、x線またはeuv用ポジ型レジスト組成物及びこれを用いたパターン形成方法 |
| US20100136477A1 (en) * | 2008-12-01 | 2010-06-03 | Ng Edward W | Photosensitive Composition |
| JP5514583B2 (ja) * | 2009-03-13 | 2014-06-04 | 富士フイルム株式会社 | 感活性光線性または感放射線性樹脂組成物及び該組成物を用いたパターン形成方法 |
| JP5377172B2 (ja) | 2009-03-31 | 2013-12-25 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物及びそれを用いたパターン形成方法 |
| JP5544130B2 (ja) | 2009-09-01 | 2014-07-09 | 富士フイルム株式会社 | 感活性光線性または感放射線性樹脂組成物及びそれを用いたパターン形成方法 |
| JP5844613B2 (ja) * | 2010-11-17 | 2016-01-20 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 感光性コポリマーおよびフォトレジスト組成物 |
| JP5703247B2 (ja) * | 2012-03-02 | 2015-04-15 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、フォトマスクブランクス、及び、パターン形成方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0780732B1 (en) * | 1995-12-21 | 2003-07-09 | Wako Pure Chemical Industries Ltd | Polymer composition and resist material |
| JP3650980B2 (ja) | 1996-05-16 | 2005-05-25 | Jsr株式会社 | 感放射線性樹脂組成物 |
| JP3679205B2 (ja) * | 1996-09-20 | 2005-08-03 | 富士写真フイルム株式会社 | ポジ型感光性組成物 |
| JP4062713B2 (ja) | 1998-03-02 | 2008-03-19 | Jsr株式会社 | ポジ型感放射線性樹脂組成物 |
| JP3916188B2 (ja) | 1998-04-14 | 2007-05-16 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JP3832786B2 (ja) | 1998-04-24 | 2006-10-11 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JP3972469B2 (ja) | 1998-06-12 | 2007-09-05 | Jsr株式会社 | ジアゾジスルホン化合物および感放射線性樹脂組成物 |
| JP3991466B2 (ja) | 1998-08-21 | 2007-10-17 | Jsr株式会社 | 感放射線性樹脂組成物 |
| JP2000075487A (ja) | 1998-08-26 | 2000-03-14 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| JP2001075284A (ja) * | 1998-12-03 | 2001-03-23 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
| JP4161358B2 (ja) | 1998-12-22 | 2008-10-08 | Jsr株式会社 | 感放射線性樹脂組成物 |
| TWI277830B (en) * | 1999-01-28 | 2007-04-01 | Sumitomo Chemical Co | Resist composition |
| JP3757731B2 (ja) | 1999-01-28 | 2006-03-22 | 住友化学株式会社 | レジスト組成物 |
| JP2000267282A (ja) | 1999-03-18 | 2000-09-29 | Fuji Photo Film Co Ltd | ポジ型感光性組成物 |
| JP4240663B2 (ja) | 1999-07-22 | 2009-03-18 | Jsr株式会社 | 感放射線性樹脂組成物 |
| US6727036B2 (en) * | 1999-12-27 | 2004-04-27 | Fuji Photo Film Co., Ltd. | Positive-working radiation-sensitive composition |
| TWI224713B (en) * | 2000-01-27 | 2004-12-01 | Fuji Photo Film Co Ltd | Positive photoresist composition |
| JP4562240B2 (ja) * | 2000-05-10 | 2010-10-13 | 富士フイルム株式会社 | ポジ型感放射線性組成物及びそれを用いたパターン形成方法 |
| US20020051932A1 (en) | 2000-05-31 | 2002-05-02 | Shipley Company, L.L.C. | Photoresists for imaging with high energy radiation |
| JP4190138B2 (ja) | 2000-08-02 | 2008-12-03 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
| US6924323B2 (en) * | 2000-08-30 | 2005-08-02 | Wako Pure Chemical Industries, Ltd. | Sulfonium salt compound |
| JP2002131898A (ja) * | 2000-10-26 | 2002-05-09 | Fuji Photo Film Co Ltd | ポジ型感放射線組成物 |
| JP4190146B2 (ja) * | 2000-12-28 | 2008-12-03 | 富士フイルム株式会社 | 電子線またはx線用ポジ型レジスト組成物 |
| JP3992993B2 (ja) | 2001-02-21 | 2007-10-17 | 富士フイルム株式会社 | ポジ型電子線、x線又はeuv用レジスト組成物 |
| JP2002278054A (ja) | 2001-03-16 | 2002-09-27 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| JP2003057827A (ja) | 2001-04-13 | 2003-02-28 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
| JP2002341538A (ja) * | 2001-05-11 | 2002-11-27 | Fuji Photo Film Co Ltd | 電子線またはx線用ポジ型レジスト組成物 |
| TW565748B (en) | 2001-05-17 | 2003-12-11 | Fuji Photo Film Co Ltd | Positive radiation-sensitive composition |
-
2003
- 2003-03-05 JP JP2003058732A patent/JP4121396B2/ja not_active Expired - Lifetime
-
2004
- 2004-03-03 US US10/791,559 patent/US7326513B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20040175654A1 (en) | 2004-09-09 |
| US7326513B2 (en) | 2008-02-05 |
| JP2004271629A (ja) | 2004-09-30 |
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