JP4110533B2 - Mo系ターゲット材の製造方法 - Google Patents

Mo系ターゲット材の製造方法 Download PDF

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Publication number
JP4110533B2
JP4110533B2 JP2004055021A JP2004055021A JP4110533B2 JP 4110533 B2 JP4110533 B2 JP 4110533B2 JP 2004055021 A JP2004055021 A JP 2004055021A JP 2004055021 A JP2004055021 A JP 2004055021A JP 4110533 B2 JP4110533 B2 JP 4110533B2
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JP
Japan
Prior art keywords
powder
target material
producing
raw material
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004055021A
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English (en)
Japanese (ja)
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JP2005240160A (ja
JP2005240160A5 (zh
Inventor
克典 岩崎
惠介 井上
典夫 植村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2004055021A priority Critical patent/JP4110533B2/ja
Priority to CNB2005100095854A priority patent/CN1314504C/zh
Priority to US11/066,228 priority patent/US20050191202A1/en
Publication of JP2005240160A publication Critical patent/JP2005240160A/ja
Publication of JP2005240160A5 publication Critical patent/JP2005240160A5/ja
Application granted granted Critical
Publication of JP4110533B2 publication Critical patent/JP4110533B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/16Both compacting and sintering in successive or repeated steps
    • B22F3/162Machining, working after consolidation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/1208Containers or coating used therefor
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/045Alloys based on refractory metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • B22F2003/248Thermal after-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
JP2004055021A 2004-02-27 2004-02-27 Mo系ターゲット材の製造方法 Expired - Lifetime JP4110533B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004055021A JP4110533B2 (ja) 2004-02-27 2004-02-27 Mo系ターゲット材の製造方法
CNB2005100095854A CN1314504C (zh) 2004-02-27 2005-02-24 制备Mo合金制靶材料的方法
US11/066,228 US20050191202A1 (en) 2004-02-27 2005-02-25 Method of producing target material of Mo alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004055021A JP4110533B2 (ja) 2004-02-27 2004-02-27 Mo系ターゲット材の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008023911A Division JP4706980B2 (ja) 2008-02-04 2008-02-04 Moターゲット材の製造方法

Publications (3)

Publication Number Publication Date
JP2005240160A JP2005240160A (ja) 2005-09-08
JP2005240160A5 JP2005240160A5 (zh) 2006-08-24
JP4110533B2 true JP4110533B2 (ja) 2008-07-02

Family

ID=34879772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004055021A Expired - Lifetime JP4110533B2 (ja) 2004-02-27 2004-02-27 Mo系ターゲット材の製造方法

Country Status (3)

Country Link
US (1) US20050191202A1 (zh)
JP (1) JP4110533B2 (zh)
CN (1) CN1314504C (zh)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385139B (zh) 2005-02-01 2013-02-11 Tosoh Corp A sintered body, a sputtering target and a forming die, and a sintered body manufacturing method using the same
AT8697U1 (de) 2005-10-14 2006-11-15 Plansee Se Rohrtarget
JP4831468B2 (ja) * 2005-10-18 2011-12-07 日立金属株式会社 Moターゲット材の製造方法
US7837929B2 (en) * 2005-10-20 2010-11-23 H.C. Starck Inc. Methods of making molybdenum titanium sputtering plates and targets
JP2007277671A (ja) * 2006-04-11 2007-10-25 Hitachi Metals Ltd Mo合金粉末の製造方法およびスパッタリングターゲット材の製造方法
US20080087866A1 (en) * 2006-10-13 2008-04-17 H.C. Stark Inc. Titanium oxide-based sputtering target for transparent conductive film, method for producing such film and composition for use therein
WO2008084863A1 (ja) * 2007-01-12 2008-07-17 Nippon Steel Materials Co., Ltd. Mo系スパッタリングターゲット板,および,その製造方法
JP2008255440A (ja) * 2007-04-06 2008-10-23 Hitachi Metals Ltd MoTi合金スパッタリングターゲット材
CN101977711B (zh) * 2008-03-27 2013-03-13 日立金属株式会社 被覆金属微粒及其制造方法
CN101648320B (zh) * 2009-05-08 2012-06-27 宁波江丰电子材料有限公司 靶材与背板的焊接方法
JP2011089188A (ja) * 2009-10-26 2011-05-06 Ulvac Japan Ltd チタン含有スパッタリングターゲットの製造方法
JP5550328B2 (ja) * 2009-12-22 2014-07-16 株式会社東芝 Moスパッタリングターゲットおよびその製造方法
EP2555287B1 (en) * 2010-04-01 2018-05-02 Mitsubishi Chemical Corporation Positive electrode material for lithium secondary battery, positive electrode for lithium secondary battery, and lithium secondary battery
US8449817B2 (en) * 2010-06-30 2013-05-28 H.C. Stark, Inc. Molybdenum-containing targets comprising three metal elements
US8449818B2 (en) 2010-06-30 2013-05-28 H. C. Starck, Inc. Molybdenum containing targets
US9689067B2 (en) 2010-09-30 2017-06-27 Hitachi Metals, Ltd. Method for producing molybdenum target
JP5808066B2 (ja) 2011-05-10 2015-11-10 エイチ.シー.スターク インク. 複合ターゲット
CN102321871B (zh) * 2011-09-19 2013-03-20 基迈克材料科技(苏州)有限公司 热等静压生产平板显示器用钼合金溅射靶材的方法
TWI572725B (zh) * 2011-09-26 2017-03-01 日立金屬股份有限公司 MoTi靶材的製造方法
CN103182508B (zh) * 2011-12-27 2014-12-10 北京有色金属研究总院 一种用于大电流密度m型阴极敷膜的合金靶材制备方法
CN102560383B (zh) * 2012-01-12 2013-10-23 宝鸡市科迪普有色金属加工有限公司 钼铌合金板靶材加工工艺
US9334565B2 (en) 2012-05-09 2016-05-10 H.C. Starck Inc. Multi-block sputtering target with interface portions and associated methods and articles
CN103060762B (zh) * 2013-01-11 2018-02-23 江西科泰新材料有限公司 钼铌合金靶材的生产工艺
CN103182507B (zh) * 2013-03-19 2015-04-15 昆山海普电子材料有限公司 一种铬铝合金靶材的生产方法
CN103205721B (zh) * 2013-03-19 2015-10-28 昆山海普电子材料有限公司 一种钛铝合金靶材的生产方法
CN103143710B (zh) * 2013-03-27 2015-12-23 宁夏东方钽业股份有限公司 一种钼合金靶材的制作方法
AT13602U3 (de) * 2013-10-29 2014-08-15 Plansee Se Sputtering Target und Verfahren zur Herstellung
CN104439236B (zh) * 2014-12-23 2016-08-17 金堆城钼业股份有限公司 一种氧化锆钼合金电极的制备方法
CN105714253B (zh) * 2016-03-10 2017-11-24 洛阳爱科麦钨钼科技股份有限公司 大尺寸、细晶钼钽合金溅射靶材的制备方法
AT15356U1 (de) 2016-09-29 2017-07-15 Plansee Se Sputtering Target
CN106567048B (zh) * 2016-11-10 2018-11-27 洛阳科威钨钼有限公司 一种大型高纯钼合金旋转靶材的制造方法
JP7205213B2 (ja) * 2018-03-27 2023-01-17 日立金属株式会社 TiW合金ターゲットおよびその製造方法
JP7419886B2 (ja) * 2019-03-20 2024-01-23 株式会社プロテリアル Mo合金ターゲット材およびその製造方法
JP7419885B2 (ja) * 2019-03-20 2024-01-23 株式会社プロテリアル Mo合金ターゲット材およびその製造方法
CN112975102B (zh) * 2021-03-04 2023-06-23 宁波江丰电子材料股份有限公司 一种钴靶材与铜背板的扩散焊接方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69430439T2 (de) * 1993-12-14 2003-02-06 Kabushiki Kaisha Toshiba, Kawasaki Molybdän-wolfram-material zum verdrahten, molybdän-wolfram-target zum verdrahten, verfahren zu deren herstellung und dünne molybdän-wolfram verdrahtung
JP3863204B2 (ja) * 1995-08-25 2006-12-27 株式会社アライドマテリアル スパッタリングターゲット材及びその製造方法
US6797137B2 (en) * 2001-04-11 2004-09-28 Heraeus, Inc. Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metal
JP3748221B2 (ja) * 2001-10-23 2006-02-22 日立金属株式会社 Mo系スパッタリング用ターゲットおよびその製造方法

Also Published As

Publication number Publication date
CN1314504C (zh) 2007-05-09
JP2005240160A (ja) 2005-09-08
US20050191202A1 (en) 2005-09-01
CN1660526A (zh) 2005-08-31

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