JP4108243B2 - 感光性樹脂積層体 - Google Patents

感光性樹脂積層体 Download PDF

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Publication number
JP4108243B2
JP4108243B2 JP2000019857A JP2000019857A JP4108243B2 JP 4108243 B2 JP4108243 B2 JP 4108243B2 JP 2000019857 A JP2000019857 A JP 2000019857A JP 2000019857 A JP2000019857 A JP 2000019857A JP 4108243 B2 JP4108243 B2 JP 4108243B2
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JP
Japan
Prior art keywords
photosensitive resin
acrylate
resin layer
meth
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000019857A
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English (en)
Japanese (ja)
Other versions
JP2000356852A (ja
JP2000356852A5 (enExample
Inventor
徹 森
輝彦 足立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei EMD Corp filed Critical Asahi Kasei EMD Corp
Priority to JP2000019857A priority Critical patent/JP4108243B2/ja
Publication of JP2000356852A publication Critical patent/JP2000356852A/ja
Publication of JP2000356852A5 publication Critical patent/JP2000356852A5/ja
Application granted granted Critical
Publication of JP4108243B2 publication Critical patent/JP4108243B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Materials For Photolithography (AREA)
JP2000019857A 1999-04-14 2000-01-28 感光性樹脂積層体 Expired - Lifetime JP4108243B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000019857A JP4108243B2 (ja) 1999-04-14 2000-01-28 感光性樹脂積層体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-107200 1999-04-14
JP10720099 1999-04-14
JP2000019857A JP4108243B2 (ja) 1999-04-14 2000-01-28 感光性樹脂積層体

Publications (3)

Publication Number Publication Date
JP2000356852A JP2000356852A (ja) 2000-12-26
JP2000356852A5 JP2000356852A5 (enExample) 2007-02-08
JP4108243B2 true JP4108243B2 (ja) 2008-06-25

Family

ID=26447250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000019857A Expired - Lifetime JP4108243B2 (ja) 1999-04-14 2000-01-28 感光性樹脂積層体

Country Status (1)

Country Link
JP (1) JP4108243B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057821A (ja) * 2001-08-13 2003-02-28 Showa Highpolymer Co Ltd 感光性樹脂および感光性樹脂組成物
WO2003042758A1 (fr) * 2001-11-12 2003-05-22 Asahi Kasei Emd Corporation Composition de resine photosensible et applications correspondantes
KR100521999B1 (ko) * 2002-09-03 2005-10-18 주식회사 코오롱 샌드블래스트 레지스트용 감광성수지 조성물
JP2005031639A (ja) * 2003-06-16 2005-02-03 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法、プリント配線板の製造法、並びにプリント配線板、及びそれを用いた電子部品
JP4632117B2 (ja) * 2004-07-27 2011-02-16 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
MY207705A (en) * 2019-10-16 2025-03-13 Resonac Corp Photosensitive resin film, resist pattern forming method, and wiring pattern forming method
JPWO2022201432A1 (enExample) 2021-03-25 2022-09-29
WO2023238202A1 (ja) 2022-06-06 2023-12-14 株式会社レゾナック 感光性エレメント、及び、レジストパターンの形成方法
JP2024087194A (ja) 2022-12-19 2024-07-01 株式会社レゾナック 感光性エレメント、及び、レジストパターンの形成方法

Also Published As

Publication number Publication date
JP2000356852A (ja) 2000-12-26

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