JP4062805B2 - 焼成用感光性導電ペーストおよび微細電極パターン形成方法 - Google Patents

焼成用感光性導電ペーストおよび微細電極パターン形成方法 Download PDF

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Publication number
JP4062805B2
JP4062805B2 JP116599A JP116599A JP4062805B2 JP 4062805 B2 JP4062805 B2 JP 4062805B2 JP 116599 A JP116599 A JP 116599A JP 116599 A JP116599 A JP 116599A JP 4062805 B2 JP4062805 B2 JP 4062805B2
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Japan
Prior art keywords
conductive paste
photosensitive conductive
firing
polymer
pattern
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Expired - Fee Related
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JP116599A
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English (en)
Japanese (ja)
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JP2000199954A5 (https=
JP2000199954A (ja
Inventor
宣夫 松村
武則 上岡
元太郎 大林
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP116599A priority Critical patent/JP4062805B2/ja
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Publication of JP2000199954A5 publication Critical patent/JP2000199954A5/ja
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  • Materials For Photolithography (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
JP116599A 1999-01-06 1999-01-06 焼成用感光性導電ペーストおよび微細電極パターン形成方法 Expired - Fee Related JP4062805B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP116599A JP4062805B2 (ja) 1999-01-06 1999-01-06 焼成用感光性導電ペーストおよび微細電極パターン形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP116599A JP4062805B2 (ja) 1999-01-06 1999-01-06 焼成用感光性導電ペーストおよび微細電極パターン形成方法

Publications (3)

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JP2000199954A JP2000199954A (ja) 2000-07-18
JP2000199954A5 JP2000199954A5 (https=) 2006-02-02
JP4062805B2 true JP4062805B2 (ja) 2008-03-19

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JP116599A Expired - Fee Related JP4062805B2 (ja) 1999-01-06 1999-01-06 焼成用感光性導電ペーストおよび微細電極パターン形成方法

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060163989A1 (en) * 2002-07-10 2006-07-27 Koji Kawaguchi Blue color filter, and organic electroluminescent device using the same
JP5447691B2 (ja) * 2010-12-07 2014-03-19 株式会社村田製作所 光反応性樹脂組成物
JP5828851B2 (ja) * 2013-03-01 2015-12-09 株式会社ノリタケカンパニーリミテド 感光性ペースト
KR102074712B1 (ko) 2014-04-16 2020-03-17 도레이 카부시키가이샤 감광성 수지 조성물, 도전성 패턴의 제조 방법, 기판, 소자 및 터치패널
CN107407870B (zh) * 2015-04-01 2018-12-14 东丽株式会社 感光性树脂组合物、导电性图案的制造方法、基板、触摸面板及显示器
JPWO2017057544A1 (ja) * 2015-09-30 2018-07-19 東レ株式会社 感光性導電ペースト及びそれを用いた導電パターンの製造方法
JP6841233B2 (ja) 2016-09-30 2021-03-10 東レ株式会社 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネル及びディスプレイ
CN109891375B (zh) * 2016-11-01 2022-04-12 东丽株式会社 触摸面板、触摸面板的制造方法
WO2019065234A1 (ja) 2017-09-26 2019-04-04 東レ株式会社 電極付き基板の製造方法
JP6814237B2 (ja) 2018-03-23 2021-01-13 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
JP7113779B2 (ja) 2019-03-28 2022-08-05 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
CN115210322B (zh) 2020-03-27 2023-10-20 东丽株式会社 树脂组合物、布线基板及导电性图案的制造方法
US20240045331A1 (en) 2020-09-28 2024-02-08 Toray Industries, Inc. Photosensitive resin composition, board with conductive pattern, antenna element, production method for image display device, and production method for touch panel
JP7108778B1 (ja) * 2021-03-16 2022-07-28 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用

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JP2000199954A (ja) 2000-07-18

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