JP4061137B2 - 積層樹脂配線基板及びその製造方法 - Google Patents

積層樹脂配線基板及びその製造方法 Download PDF

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Publication number
JP4061137B2
JP4061137B2 JP2002187256A JP2002187256A JP4061137B2 JP 4061137 B2 JP4061137 B2 JP 4061137B2 JP 2002187256 A JP2002187256 A JP 2002187256A JP 2002187256 A JP2002187256 A JP 2002187256A JP 4061137 B2 JP4061137 B2 JP 4061137B2
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Japan
Prior art keywords
metal plate
resin
wiring
layer
alloy
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Expired - Fee Related
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JP2002187256A
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Japanese (ja)
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JP2004031731A (ja
JP2004031731A5 (https=
Inventor
伸治 由利
友恵 鈴木
和久 佐藤
耕三 山崎
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Priority to JP2002187256A priority Critical patent/JP4061137B2/ja
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Publication of JP2004031731A5 publication Critical patent/JP2004031731A5/ja
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Publication of JP4061137B2 publication Critical patent/JP4061137B2/ja
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  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2002187256A 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法 Expired - Fee Related JP4061137B2 (ja)

Priority Applications (1)

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JP2002187256A JP4061137B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002187256A JP4061137B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

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JP2004031731A JP2004031731A (ja) 2004-01-29
JP2004031731A5 JP2004031731A5 (https=) 2005-06-02
JP4061137B2 true JP4061137B2 (ja) 2008-03-12

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JP2002187256A Expired - Fee Related JP4061137B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100885900B1 (ko) * 2007-08-24 2009-02-26 삼성전기주식회사 다층 인쇄회로기판 및 그 제조방법
JP5217639B2 (ja) 2008-05-30 2013-06-19 富士通株式会社 コア基板およびプリント配線板
JP2009290124A (ja) 2008-05-30 2009-12-10 Fujitsu Ltd プリント配線板
JP5217640B2 (ja) 2008-05-30 2013-06-19 富士通株式会社 プリント配線板の製造方法およびプリント基板ユニットの製造方法
KR101411584B1 (ko) * 2013-04-12 2014-06-24 김영대 배터리 보호 장치 제조 방법 및 배터리 보호 장치
JP6526558B2 (ja) 2013-12-27 2019-06-05 三井金属鉱業株式会社 プリント配線板用の複合金属箔、プリント配線板用のキャリア付複合金属箔、これらを用いて得られるプリント配線板用の金属張積層板及びプリント配線板
JP7381323B2 (ja) * 2019-12-17 2023-11-15 日東電工株式会社 両面配線回路基板の製造方法および両面配線回路基板
CN113613390A (zh) * 2021-07-28 2021-11-05 深圳市普林电路有限公司 一种选择性真空树脂塞孔工艺
CN113693878A (zh) * 2021-08-17 2021-11-26 迈族智能科技(上海)有限公司 一种垂直震幅辅助平台
JP2023150247A (ja) 2022-03-31 2023-10-16 東洋鋼鈑株式会社 合金電解箔

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