JP4061137B2 - 積層樹脂配線基板及びその製造方法 - Google Patents
積層樹脂配線基板及びその製造方法 Download PDFInfo
- Publication number
- JP4061137B2 JP4061137B2 JP2002187256A JP2002187256A JP4061137B2 JP 4061137 B2 JP4061137 B2 JP 4061137B2 JP 2002187256 A JP2002187256 A JP 2002187256A JP 2002187256 A JP2002187256 A JP 2002187256A JP 4061137 B2 JP4061137 B2 JP 4061137B2
- Authority
- JP
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- Prior art keywords
- metal plate
- resin
- wiring
- layer
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 title claims description 146
- 239000011347 resin Substances 0.000 title claims description 146
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 182
- 239000002184 metal Substances 0.000 claims description 182
- 239000000956 alloy Substances 0.000 claims description 83
- 229910045601 alloy Inorganic materials 0.000 claims description 82
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 66
- 239000004020 conductor Substances 0.000 claims description 66
- 239000011888 foil Substances 0.000 claims description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 238000009413 insulation Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 31
- 238000007747 plating Methods 0.000 claims description 29
- 239000007769 metal material Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 2
- 239000000945 filler Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 239000011162 core material Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000805 composite resin Substances 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002187256A JP4061137B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002187256A JP4061137B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004031731A JP2004031731A (ja) | 2004-01-29 |
| JP2004031731A5 JP2004031731A5 (enExample) | 2005-06-02 |
| JP4061137B2 true JP4061137B2 (ja) | 2008-03-12 |
Family
ID=31182344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002187256A Expired - Fee Related JP4061137B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4061137B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100885900B1 (ko) * | 2007-08-24 | 2009-02-26 | 삼성전기주식회사 | 다층 인쇄회로기판 및 그 제조방법 |
| JP2009290124A (ja) | 2008-05-30 | 2009-12-10 | Fujitsu Ltd | プリント配線板 |
| JP5217640B2 (ja) | 2008-05-30 | 2013-06-19 | 富士通株式会社 | プリント配線板の製造方法およびプリント基板ユニットの製造方法 |
| JP5217639B2 (ja) | 2008-05-30 | 2013-06-19 | 富士通株式会社 | コア基板およびプリント配線板 |
| KR101411584B1 (ko) * | 2013-04-12 | 2014-06-24 | 김영대 | 배터리 보호 장치 제조 방법 및 배터리 보호 장치 |
| WO2015099156A1 (ja) | 2013-12-27 | 2015-07-02 | 三井金属鉱業株式会社 | 複合金属箔、キャリア付複合金属箔、これらを用いて得られる金属張積層板及びプリント配線板 |
| JP7381323B2 (ja) * | 2019-12-17 | 2023-11-15 | 日東電工株式会社 | 両面配線回路基板の製造方法および両面配線回路基板 |
| CN113613390A (zh) * | 2021-07-28 | 2021-11-05 | 深圳市普林电路有限公司 | 一种选择性真空树脂塞孔工艺 |
| CN113693878A (zh) * | 2021-08-17 | 2021-11-26 | 迈族智能科技(上海)有限公司 | 一种垂直震幅辅助平台 |
| JP2023150247A (ja) | 2022-03-31 | 2023-10-16 | 東洋鋼鈑株式会社 | 合金電解箔 |
-
2002
- 2002-06-27 JP JP2002187256A patent/JP4061137B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004031731A (ja) | 2004-01-29 |
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