JP2004031731A5 - - Google Patents

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Publication number
JP2004031731A5
JP2004031731A5 JP2002187256A JP2002187256A JP2004031731A5 JP 2004031731 A5 JP2004031731 A5 JP 2004031731A5 JP 2002187256 A JP2002187256 A JP 2002187256A JP 2002187256 A JP2002187256 A JP 2002187256A JP 2004031731 A5 JP2004031731 A5 JP 2004031731A5
Authority
JP
Japan
Prior art keywords
pattern formation
etching
manufactured
laminated
short time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002187256A
Other languages
English (en)
Japanese (ja)
Other versions
JP4061137B2 (ja
JP2004031731A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002187256A priority Critical patent/JP4061137B2/ja
Priority claimed from JP2002187256A external-priority patent/JP4061137B2/ja
Publication of JP2004031731A publication Critical patent/JP2004031731A/ja
Publication of JP2004031731A5 publication Critical patent/JP2004031731A5/ja
Application granted granted Critical
Publication of JP4061137B2 publication Critical patent/JP4061137B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002187256A 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法 Expired - Fee Related JP4061137B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002187256A JP4061137B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002187256A JP4061137B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2004031731A JP2004031731A (ja) 2004-01-29
JP2004031731A5 true JP2004031731A5 (enExample) 2005-06-02
JP4061137B2 JP4061137B2 (ja) 2008-03-12

Family

ID=31182344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002187256A Expired - Fee Related JP4061137B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP4061137B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100885900B1 (ko) * 2007-08-24 2009-02-26 삼성전기주식회사 다층 인쇄회로기판 및 그 제조방법
JP2009290124A (ja) 2008-05-30 2009-12-10 Fujitsu Ltd プリント配線板
JP5217640B2 (ja) 2008-05-30 2013-06-19 富士通株式会社 プリント配線板の製造方法およびプリント基板ユニットの製造方法
JP5217639B2 (ja) 2008-05-30 2013-06-19 富士通株式会社 コア基板およびプリント配線板
KR101411584B1 (ko) * 2013-04-12 2014-06-24 김영대 배터리 보호 장치 제조 방법 및 배터리 보호 장치
WO2015099156A1 (ja) 2013-12-27 2015-07-02 三井金属鉱業株式会社 複合金属箔、キャリア付複合金属箔、これらを用いて得られる金属張積層板及びプリント配線板
JP7381323B2 (ja) * 2019-12-17 2023-11-15 日東電工株式会社 両面配線回路基板の製造方法および両面配線回路基板
CN113613390A (zh) * 2021-07-28 2021-11-05 深圳市普林电路有限公司 一种选择性真空树脂塞孔工艺
CN113693878A (zh) * 2021-08-17 2021-11-26 迈族智能科技(上海)有限公司 一种垂直震幅辅助平台
JP2023150247A (ja) 2022-03-31 2023-10-16 東洋鋼鈑株式会社 合金電解箔

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