JP2004031731A5 - - Google Patents

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Publication number
JP2004031731A5
JP2004031731A5 JP2002187256A JP2002187256A JP2004031731A5 JP 2004031731 A5 JP2004031731 A5 JP 2004031731A5 JP 2002187256 A JP2002187256 A JP 2002187256A JP 2002187256 A JP2002187256 A JP 2002187256A JP 2004031731 A5 JP2004031731 A5 JP 2004031731A5
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JP
Japan
Prior art keywords
pattern formation
etching
manufactured
laminated
short time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002187256A
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Japanese (ja)
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JP4061137B2 (en
JP2004031731A (en
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Publication date
Application filed filed Critical
Priority to JP2002187256A priority Critical patent/JP4061137B2/en
Priority claimed from JP2002187256A external-priority patent/JP4061137B2/en
Publication of JP2004031731A publication Critical patent/JP2004031731A/en
Publication of JP2004031731A5 publication Critical patent/JP2004031731A5/ja
Application granted granted Critical
Publication of JP4061137B2 publication Critical patent/JP4061137B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

（２）また、本実施形態の製造方法では、積層された金属箔８３，８４のエッチング（即ちサブトラクティブ法）により、配線層３１，３２，５１，５２のパターン形成を行うようにしている。よって、アディティブ法によりパターン形成を行う場合に比べて、短時間かつ低コストで上記構成の積層樹脂配線基板１１を製造することができる。 (2) Further, in the manufacturing method of the present embodiment, the pattern formation of the wiring layers 31, 32, 51, 52 is performed by etching the laminated metal foils 83 , 84 (that is, subtractive method). Therefore, the laminated resin wiring substrate 11 having the above configuration can be manufactured in a short time and at a low cost as compared with the case where the pattern formation is performed by the additive method.

JP2002187256A 2002-06-27 2002-06-27 Multilayer resin wiring board and manufacturing method thereof Expired - Fee Related JP4061137B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002187256A JP4061137B2 (en) 2002-06-27 2002-06-27 Multilayer resin wiring board and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002187256A JP4061137B2 (en) 2002-06-27 2002-06-27 Multilayer resin wiring board and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2004031731A JP2004031731A (en) 2004-01-29
JP2004031731A5 true JP2004031731A5 (en) 2005-06-02
JP4061137B2 JP4061137B2 (en) 2008-03-12

Family

ID=31182344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002187256A Expired - Fee Related JP4061137B2 (en) 2002-06-27 2002-06-27 Multilayer resin wiring board and manufacturing method thereof

Country Status (1)

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JP (1) JP4061137B2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100885900B1 (en) * 2007-08-24 2009-02-26 삼성전기주식회사 Multilayered printed circuit board and fabricating method therefof
JP2009290124A (en) 2008-05-30 2009-12-10 Fujitsu Ltd Printed wiring board
JP5217639B2 (en) 2008-05-30 2013-06-19 富士通株式会社 Core substrate and printed wiring board
JP5217640B2 (en) 2008-05-30 2013-06-19 富士通株式会社 Method for manufacturing printed wiring board and method for manufacturing printed circuit board unit
KR101411584B1 (en) * 2013-04-12 2014-06-24 김영대 method for manufacturing battery protection apparatus and the battery protection apparatus
JP6526558B2 (en) 2013-12-27 2019-06-05 三井金属鉱業株式会社 Composite metal foil for printed wiring board, composite metal foil with carrier for printed wiring board, metal-clad laminate for printed wiring board obtained using these, and printed wiring board
JP7381323B2 (en) * 2019-12-17 2023-11-15 日東電工株式会社 Method for manufacturing double-sided printed circuit board and double-sided printed circuit board
CN113613390A (en) * 2021-07-28 2021-11-05 深圳市普林电路有限公司 Selective vacuum resin hole plugging process
CN113693878A (en) * 2021-08-17 2021-11-26 迈族智能科技(上海)有限公司 Vertical vibration amplitude auxiliary platform
JP2023150247A (en) 2022-03-31 2023-10-16 東洋鋼鈑株式会社 alloy electrolytic foil

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