JP4035242B2 - 回路パターンの検査方法及び検査装置 - Google Patents

回路パターンの検査方法及び検査装置 Download PDF

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Publication number
JP4035242B2
JP4035242B2 JP34029798A JP34029798A JP4035242B2 JP 4035242 B2 JP4035242 B2 JP 4035242B2 JP 34029798 A JP34029798 A JP 34029798A JP 34029798 A JP34029798 A JP 34029798A JP 4035242 B2 JP4035242 B2 JP 4035242B2
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JP
Japan
Prior art keywords
inspection
screen
wafer
image
conditions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP34029798A
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English (en)
Japanese (ja)
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JP2000161932A5 (enExample
JP2000161932A (ja
Inventor
真理 野副
和久 町田
真紀 伊藤
康継 宇佐見
高志 広井
洋 森岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP34029798A priority Critical patent/JP4035242B2/ja
Priority to US09/450,856 priority patent/US6476913B1/en
Publication of JP2000161932A publication Critical patent/JP2000161932A/ja
Priority to US09/832,218 priority patent/US6567168B2/en
Priority to US09/832,220 priority patent/US6759655B2/en
Priority to US09/832,219 priority patent/US6421122B2/en
Priority to US09/832,217 priority patent/US6480279B2/en
Priority to US09/832,222 priority patent/US6388747B2/en
Priority to US10/115,079 priority patent/US6504609B2/en
Priority to US10/116,059 priority patent/US6919564B2/en
Priority to US10/116,134 priority patent/US6493082B2/en
Priority to US10/287,706 priority patent/US6903821B2/en
Publication of JP2000161932A5 publication Critical patent/JP2000161932A5/ja
Priority to US11/931,856 priority patent/US7957579B2/en
Application granted granted Critical
Publication of JP4035242B2 publication Critical patent/JP4035242B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP34029798A 1998-11-30 1998-11-30 回路パターンの検査方法及び検査装置 Expired - Fee Related JP4035242B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP34029798A JP4035242B2 (ja) 1998-11-30 1998-11-30 回路パターンの検査方法及び検査装置
US09/450,856 US6476913B1 (en) 1998-11-30 1999-11-29 Inspection method, apparatus and system for circuit pattern
US09/832,222 US6388747B2 (en) 1998-11-30 2001-04-11 Inspection method, apparatus and system for circuit pattern
US09/832,220 US6759655B2 (en) 1998-11-30 2001-04-11 Inspection method, apparatus and system for circuit pattern
US09/832,219 US6421122B2 (en) 1998-11-30 2001-04-11 Inspection method, apparatus and system for circuit pattern
US09/832,217 US6480279B2 (en) 1998-11-30 2001-04-11 Inspection method, apparatus and system for circuit pattern
US09/832,218 US6567168B2 (en) 1998-11-30 2001-04-11 Inspection method, apparatus and system for circuit pattern
US10/115,079 US6504609B2 (en) 1998-11-30 2002-04-04 Inspection method, apparatus and system for circuit pattern
US10/116,134 US6493082B2 (en) 1998-11-30 2002-04-05 Inspection method, apparatus and system for circuit pattern
US10/116,059 US6919564B2 (en) 1998-11-30 2002-04-05 Inspection method, apparatus and system for circuit pattern
US10/287,706 US6903821B2 (en) 1998-11-30 2002-11-05 Inspection method, apparatus and system for circuit pattern
US11/931,856 US7957579B2 (en) 1998-11-30 2007-10-31 Pattern inspection method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34029798A JP4035242B2 (ja) 1998-11-30 1998-11-30 回路パターンの検査方法及び検査装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005346042A Division JP4177375B2 (ja) 2005-11-30 2005-11-30 回路パターンの検査方法及び検査装置

Publications (3)

Publication Number Publication Date
JP2000161932A JP2000161932A (ja) 2000-06-16
JP2000161932A5 JP2000161932A5 (enExample) 2006-03-02
JP4035242B2 true JP4035242B2 (ja) 2008-01-16

Family

ID=18335603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34029798A Expired - Fee Related JP4035242B2 (ja) 1998-11-30 1998-11-30 回路パターンの検査方法及び検査装置

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JP (1) JP4035242B2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4526661B2 (ja) * 2000-06-28 2010-08-18 株式会社日立製作所 検査装置および検査方法
EP1179841A3 (de) * 2000-07-07 2004-10-06 Leica Microsystems Jena GmbH Verfahren und Vorrichtung zur Benutzerführung bei der optischen Vermessung von Schichten und Substraten und Software
WO2002065544A1 (fr) * 2001-02-16 2002-08-22 Syuji Miyazaki Interface utilisateur d'evaluateur de semi-conducteur
JP2002303586A (ja) 2001-04-03 2002-10-18 Hitachi Ltd 欠陥検査方法及び欠陥検査装置
JP2004349515A (ja) 2003-05-23 2004-12-09 Hitachi High-Technologies Corp Ｓｅｍ式外観検査装置，レビュー装置、およびアライメント座標設定方法
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
JP5180428B2 (ja) * 2005-06-21 2013-04-10 株式会社日立ハイテクノロジーズ 走査型電子顕微鏡用撮像レシピ作成装置及びその方法並びに半導体パターンの形状評価装置
JP4654093B2 (ja) 2005-08-31 2011-03-16 株式会社日立ハイテクノロジーズ 回路パターン検査方法及びその装置
JP4953427B2 (ja) * 2006-06-21 2012-06-13 東京エレクトロン株式会社 基板処理装置、表示方法、記録媒体及びプログラム
JP5090725B2 (ja) * 2006-12-20 2012-12-05 株式会社日立ハイテクノロジーズ 異物検査装置
US7898653B2 (en) 2006-12-20 2011-03-01 Hitachi High-Technologies Corporation Foreign matter inspection apparatus
JP2009175001A (ja) * 2008-01-24 2009-08-06 Fuji Electric Systems Co Ltd 欠陥検査装置
JP2009300426A (ja) * 2008-05-16 2009-12-24 Nuflare Technology Inc レチクル欠陥検査装置およびレチクル欠陥検査方法
JP5286004B2 (ja) * 2008-09-12 2013-09-11 株式会社日立ハイテクノロジーズ 基板の検査装置、および、基板の検査方法
JP5154527B2 (ja) * 2009-09-16 2013-02-27 株式会社日立ハイテクノロジーズ 異物検査装置
JP5520135B2 (ja) * 2010-05-21 2014-06-11 パナソニック デバイスＳｕｎｘ株式会社 画像処理装置
JP5163731B2 (ja) * 2010-12-06 2013-03-13 株式会社日立製作所 欠陥候補の画像表示方法
JP5710314B2 (ja) * 2011-02-25 2015-04-30 株式会社東芝 マスク検査方法およびその装置
JP6579682B2 (ja) * 2014-07-18 2019-09-25 株式会社ミツトヨ 画像測定装置
JP2019145304A (ja) * 2018-02-20 2019-08-29 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置、荷電粒子ビーム装置のステージ駆動範囲制限方法およびプログラム

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Publication number Publication date
JP2000161932A (ja) 2000-06-16

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