JP4034932B2 - 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法 - Google Patents

半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法 Download PDF

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JP4034932B2
JP4034932B2 JP2000382222A JP2000382222A JP4034932B2 JP 4034932 B2 JP4034932 B2 JP 4034932B2 JP 2000382222 A JP2000382222 A JP 2000382222A JP 2000382222 A JP2000382222 A JP 2000382222A JP 4034932 B2 JP4034932 B2 JP 4034932B2
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bonding
bonding pad
width
pads
led array
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JP2002184805A5 (enExample
JP2002184805A (ja
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昭夫 川村
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株式会社沖データ
株式会社沖デジタルイメージング
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    • H10W72/90—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07553—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/537—
    • H10W72/5445—
    • H10W72/547—
    • H10W72/59—
    • H10W72/926—
    • H10W72/932—
    • H10W72/9445—
    • H10W90/753—

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JP2000382222A 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法 Expired - Fee Related JP4034932B2 (ja)

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JP2000382222A JP4034932B2 (ja) 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法

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JP2000382222A JP4034932B2 (ja) 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法

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JP2002184805A JP2002184805A (ja) 2002-06-28
JP2002184805A5 JP2002184805A5 (enExample) 2006-10-12
JP4034932B2 true JP4034932B2 (ja) 2008-01-16

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JP2000382222A Expired - Fee Related JP4034932B2 (ja) 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4522079B2 (ja) * 2003-11-20 2010-08-11 イビデン株式会社 Ｉｃチップ実装用基板
KR101475314B1 (ko) * 2009-03-30 2014-12-23 엘지디스플레이 주식회사 엘이디 백라이트 유닛 및 이를 이용한 액정표시장치모듈
JP6196092B2 (ja) * 2013-07-30 2017-09-13 ルネサスエレクトロニクス株式会社 半導体装置
JP7249302B2 (ja) * 2020-03-19 2023-03-30 株式会社東芝 半導体装置
EP4122710A4 (en) * 2020-03-19 2024-03-13 Kyocera Corporation ARRANGEMENT OF LIGHT-EMITTING ELEMENTS AND LIGHT PRINT HEAD AND IMAGE PRODUCING DEVICE EQUIPPED THEREFROM

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JP2002184805A (ja) 2002-06-28

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