JP4034932B2 - 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法 - Google Patents

半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法 Download PDF

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JP4034932B2
JP4034932B2 JP2000382222A JP2000382222A JP4034932B2 JP 4034932 B2 JP4034932 B2 JP 4034932B2 JP 2000382222 A JP2000382222 A JP 2000382222A JP 2000382222 A JP2000382222 A JP 2000382222A JP 4034932 B2 JP4034932 B2 JP 4034932B2
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bonding
bonding pad
width
pads
led array
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JP2002184805A (ja
JP2002184805A5 (enExample
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昭夫 川村
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株式会社沖データ
株式会社沖デジタルイメージング
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    • H—ELECTRICITY
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2000382222A 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法 Expired - Fee Related JP4034932B2 (ja)

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JP2000382222A JP4034932B2 (ja) 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法

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JP2000382222A JP4034932B2 (ja) 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法

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JP2002184805A JP2002184805A (ja) 2002-06-28
JP2002184805A5 JP2002184805A5 (enExample) 2006-10-12
JP4034932B2 true JP4034932B2 (ja) 2008-01-16

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4522079B2 (ja) * 2003-11-20 2010-08-11 イビデン株式会社 Ｉｃチップ実装用基板
KR101475314B1 (ko) * 2009-03-30 2014-12-23 엘지디스플레이 주식회사 엘이디 백라이트 유닛 및 이를 이용한 액정표시장치모듈
JP6196092B2 (ja) * 2013-07-30 2017-09-13 ルネサスエレクトロニクス株式会社 半導体装置
JP6982224B1 (ja) * 2020-03-19 2021-12-17 京セラ株式会社 発光素子アレイおよびこれを備える光プリントヘッドならびに画像形成装置
JP7249302B2 (ja) * 2020-03-19 2023-03-30 株式会社東芝 半導体装置

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