JP4033882B2 - 半導体レーザ装置 - Google Patents
半導体レーザ装置 Download PDFInfo
- Publication number
- JP4033882B2 JP4033882B2 JP2005514749A JP2005514749A JP4033882B2 JP 4033882 B2 JP4033882 B2 JP 4033882B2 JP 2005514749 A JP2005514749 A JP 2005514749A JP 2005514749 A JP2005514749 A JP 2005514749A JP 4033882 B2 JP4033882 B2 JP 4033882B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- frame
- laser device
- resin molding
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0232—Lead-frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Description
前記フレームの表面側は、前記樹脂成形部により前記半導体レーザ素子の周囲が囲まれるとともに前記樹脂成形部の前方を開放したレーザ出射窓を有し、
前記フレームの裏面側は、前方を開放した前記樹脂成形部により周囲を囲まれて前記フレームが露出する露出部を有し、前記露出部は、前記レーザ素子が配置される1つのフレームの範囲に形成されていることを特徴としている。
12、82 フレーム
13、83 サブマウント
14、84 半導体レーザ素子
15、85 樹脂成形部
15b、15d、85b 枠部
16、86 主フレーム
16a、86a 素子配置部
16b、86b リード部
16e 露出部
17、18、87、88 副フレーム
19〜21 ワイヤー
22 テーパ部
23 ゲートマーク
25 光学部品取付補助材
26 光学部品
Claims (10)
- 半導体レーザ素子と、表面に前記半導体レーザ素子が配置されるフレームと、前記フレームの表面と裏面とを覆う樹脂成形部とを備えた半導体レーザ装置において、
前記フレームの表面側は、前記樹脂成形部により前記半導体レーザ素子の周囲が囲まれるとともに前記樹脂成形部の前方を開放したレーザ出射窓を有し、
前記フレームの裏面側は、前方を開放した前記樹脂成形部により周囲を囲まれて前記フレームが露出する露出部を有し、前記露出部は、前記レーザ素子が配置される1つのフレームの範囲に形成されていることを特徴とする半導体レーザ装置。 - 前記フレームの裏面側に設けられる前記樹脂成形部は、前記露出部の両側部が前記半導体レーザ素子の光軸と平行になっていることを特徴とする請求項1に記載の半導体レーザ装置。
- 前記フレームの裏面側に設けられる前記樹脂成形部をコ字状に形成したことを特徴とする請求項2に記載の半導体レーザ装置。
- 前記フレームの前端が前記樹脂成形部よりも突出することを特徴とする請求項1に記載の半導体レーザ装置。
- 前記フレームは、前記半導体レーザ素子を配置する素子配置部と、前記素子配置部と一体に形成されるとともにワイヤー接続して電流通路となるリード部と、前記素子配置部と前記リード部との間に設けられるとともに前記素子配置部から前記リード部に向かって漸次幅が小さくなったテーパ部とを有することを特徴とする請求項1〜請求項4のいずれかに記載の半導体レーザ装置。
- 前記テーパ部上から成形用樹脂を注入して前記樹脂成形部を形成したことを特徴とする請求項5に記載の半導体レーザ装置。
- 前記フレームは、前記半導体レーザ素子を配置する素子配置部と、前記素子配置部と一体に形成されるとともにワイヤー接続して電流通路となるリード部とを有し、前記リード部の幅を0.4mm以上にしたことを特徴とする請求項1〜請求項4のいずれかに記載の半導体レーザ装置。
- 前記リード部上から成形用樹脂を注入して前記樹脂成形部を形成したことを特徴とする請求項7に記載の半導体レーザ装置。
- 前記フレームは、前記半導体レーザ素子を配置する素子配置部と、前記素子配置部と一体に形成されるとともにワイヤー接続して電流通路となるリード部と、前記リード部の両側に並設して前記樹脂成形部により前記リード部と一体化されるとともにワイヤー接続して電流通路となる副フレームとを有し、前記副フレームよりも前記リード部の幅を広くしたことを特徴とする請求項1〜請求項4のいずれかに記載の半導体レーザ装置。
- 前記リード部上から成形用樹脂を注入して前記樹脂成形部を形成したことを特徴とする請求項9に記載の半導体レーザ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003355479 | 2003-10-15 | ||
JP2003355479 | 2003-10-15 | ||
PCT/JP2004/015010 WO2005039000A1 (ja) | 2003-10-15 | 2004-10-12 | 半導体レーザ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2005039000A1 JPWO2005039000A1 (ja) | 2007-11-22 |
JP4033882B2 true JP4033882B2 (ja) | 2008-01-16 |
Family
ID=34463170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005514749A Expired - Fee Related JP4033882B2 (ja) | 2003-10-15 | 2004-10-12 | 半導体レーザ装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7339194B2 (ja) |
JP (1) | JP4033882B2 (ja) |
CN (1) | CN100416952C (ja) |
TW (1) | TWI271013B (ja) |
WO (1) | WO2005039000A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005136171A (ja) * | 2003-10-30 | 2005-05-26 | Sankyo Seiki Mfg Co Ltd | 半導体レーザ装置および光ヘッド装置 |
JP2007005505A (ja) * | 2005-06-23 | 2007-01-11 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置 |
JP4970924B2 (ja) * | 2006-03-28 | 2012-07-11 | 三菱電機株式会社 | 光素子用パッケージとこれを用いた光半導体装置 |
JP2008016715A (ja) * | 2006-07-07 | 2008-01-24 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
JP2008016714A (ja) * | 2006-07-07 | 2008-01-24 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
JP2008021754A (ja) * | 2006-07-12 | 2008-01-31 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
US20080303127A1 (en) * | 2007-06-05 | 2008-12-11 | Mitsubishi Electric Corporation | Cap-less package and manufacturing method thereof |
JP2009152330A (ja) * | 2007-12-20 | 2009-07-09 | Panasonic Corp | 半導体装置、半導体装置の製造方法、半導体装置の製造装置および光ピックアップ装置ならびに光ディスクドライブ装置 |
JP2009200463A (ja) * | 2008-01-23 | 2009-09-03 | Panasonic Corp | 半導体装置 |
WO2010092853A1 (ja) * | 2009-02-10 | 2010-08-19 | 三洋電機株式会社 | フレームパッケージの製造方法 |
WO2015056404A1 (ja) * | 2013-10-15 | 2015-04-23 | パナソニックIpマネジメント株式会社 | 温度センサおよびその製造方法 |
US9300112B2 (en) * | 2013-12-18 | 2016-03-29 | Lumentum Operations Llc | Packaged laser diode and method of packaging a laser diode |
KR20160050341A (ko) * | 2014-10-29 | 2016-05-11 | (주)라이타이저코리아 | 발광 소자 패키지 및 그의 제조 방법 |
CN113410750B (zh) * | 2020-03-17 | 2022-07-12 | 潍坊华光光电子有限公司 | 一种双光束半导体激光器及制作方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0523563U (ja) * | 1991-07-17 | 1993-03-26 | ソニー株式会社 | 半導体レーザ装置 |
JP3186684B2 (ja) * | 1997-12-29 | 2001-07-11 | ソニー株式会社 | 半導体レーザ装置 |
JPH11307871A (ja) * | 1998-04-23 | 1999-11-05 | Nec Corp | 半導体レーザ装置 |
JP4010679B2 (ja) * | 1998-11-30 | 2007-11-21 | 三洋電機株式会社 | 半導体レーザ装置及びその製造方法 |
JP2001053372A (ja) * | 1999-08-05 | 2001-02-23 | Mitsumi Electric Co Ltd | レーザモジュール |
JP2001332799A (ja) * | 2000-05-19 | 2001-11-30 | Rohm Co Ltd | モールド型半導体レーザ |
JP3723426B2 (ja) | 2000-07-28 | 2005-12-07 | 三洋電機株式会社 | 半導体レーザ装置 |
WO2002007275A1 (fr) | 2000-07-17 | 2002-01-24 | Sanyo Electric Co., Ltd. | Dispositif laser a semi-conducteur |
-
2004
- 2004-10-12 JP JP2005514749A patent/JP4033882B2/ja not_active Expired - Fee Related
- 2004-10-12 CN CNB2004800303507A patent/CN100416952C/zh not_active Expired - Fee Related
- 2004-10-12 US US10/575,899 patent/US7339194B2/en not_active Expired - Fee Related
- 2004-10-12 WO PCT/JP2004/015010 patent/WO2005039000A1/ja active Application Filing
- 2004-10-12 TW TW093130852A patent/TWI271013B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2005039000A1 (ja) | 2005-04-28 |
JPWO2005039000A1 (ja) | 2007-11-22 |
TW200515661A (en) | 2005-05-01 |
CN100416952C (zh) | 2008-09-03 |
TWI271013B (en) | 2007-01-11 |
US20070063212A1 (en) | 2007-03-22 |
CN1868098A (zh) | 2006-11-22 |
US7339194B2 (en) | 2008-03-04 |
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