JP4030363B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4030363B2
JP4030363B2 JP2002184317A JP2002184317A JP4030363B2 JP 4030363 B2 JP4030363 B2 JP 4030363B2 JP 2002184317 A JP2002184317 A JP 2002184317A JP 2002184317 A JP2002184317 A JP 2002184317A JP 4030363 B2 JP4030363 B2 JP 4030363B2
Authority
JP
Japan
Prior art keywords
wiring
semiconductor chip
back surface
main surface
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002184317A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004031562A5 (https=
JP2004031562A (ja
Inventor
典之 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2002184317A priority Critical patent/JP4030363B2/ja
Publication of JP2004031562A publication Critical patent/JP2004031562A/ja
Publication of JP2004031562A5 publication Critical patent/JP2004031562A5/ja
Application granted granted Critical
Publication of JP4030363B2 publication Critical patent/JP4030363B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/537—Multiple bond wires having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2002184317A 2002-06-25 2002-06-25 半導体装置 Expired - Fee Related JP4030363B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002184317A JP4030363B2 (ja) 2002-06-25 2002-06-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002184317A JP4030363B2 (ja) 2002-06-25 2002-06-25 半導体装置

Publications (3)

Publication Number Publication Date
JP2004031562A JP2004031562A (ja) 2004-01-29
JP2004031562A5 JP2004031562A5 (https=) 2005-10-13
JP4030363B2 true JP4030363B2 (ja) 2008-01-09

Family

ID=31180265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002184317A Expired - Fee Related JP4030363B2 (ja) 2002-06-25 2002-06-25 半導体装置

Country Status (1)

Country Link
JP (1) JP4030363B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3918842B2 (ja) 2004-09-03 2007-05-23 ヤマハ株式会社 半導体素子及びそれを備えたワイヤボンディング・チップサイズ・パッケージ
JP5557439B2 (ja) 2008-10-24 2014-07-23 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
JP7020629B2 (ja) * 2020-12-04 2022-02-16 ラピスセミコンダクタ株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3250941B2 (ja) * 1995-05-12 2002-01-28 京セラ株式会社 配線基板
JP3658162B2 (ja) * 1997-11-28 2005-06-08 株式会社ルネサステクノロジ 半導体装置
JP2000236040A (ja) * 1999-02-15 2000-08-29 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JP2004031562A (ja) 2004-01-29

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