JP4028482B2 - トレンチゲート電極を有するパワーmosfet及びその製造方法 - Google Patents
トレンチゲート電極を有するパワーmosfet及びその製造方法 Download PDFInfo
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Description
他の実施形態においては、トレンチがエピタキシャル層を完全に貫通して基板内へと延在しており、ドレイン−ドリフト領域が不要となる。
(1)第1の導電型の基板を準備する工程と、
(2)該基板上に第1又は第1の導電型と電荷が反対の第2の導電型のエピタキシャル層を成長させる工程と、
(3)必要に応じて該エピタキシャル層に前記第2の導電型のドーパントを注入して、該エピタキシャル層に第2の導電型の本体領域を形成する工程(ただし、上記エピタキシャル層を成長させる工程により該本体領域が形成される場合には、この工程は行わない)と、
(4)該エピタキシャル層中にトレンチを形成する工程と、
(5)トレンチの底部の下側に第1の導電型のドーパントを含む埋込層を形成する工程と、
(6)該埋込層に含まれる第1の導電型のドーパントをトレンチの底部に達するまで上方へと拡散させ、トレンチの側壁を取り囲む前記エピタキシャル層には該埋込層のドーパントが拡散していない領域が残っている時点で該ドーパントの上方への拡散を停止することで、トレンチ底部と基板とを接続する第1の導電型のドレイン−ドリフト領域を形成する工程と、
(7)トレンチの底部および側壁に沿って絶縁層を形成する工程と、
(8)導電性のゲート材料をトレンチ内に導入する工程と、
(9)第1の導電型のドーパントを前記エピタキシャル層内に導入して、ソース領域を形成する工程を含み、
前記ソース領域と前記ドレイン−ドリフト領域とが、トレンチの側壁に隣接するエピタキシャル層のチャネル領域によって分離しており、且つ、前記エピタキシャル層の前記本体領域がドレイン−ドリフト領域の側方を取り囲むとともにドレイン−ドリフト領域の部分を除いて基板へと延在している構造を有するパワーMOSFETが製造されることを特徴とする、パワーMOSFETの製造方法を含む。また、トレンチは、エピタキシャル層を貫通して基板へと延在するように形成されていても良い。
また、軽くドープされたNまたはP−エピタキシャル層中に本体ドーパントを注入するとともに、エピタキシャル層と基板の間の境界面まで該本体ドーパントを到達させ(drive in)、これによって本体領域を形成しても良い。
1.一般に、トレンチ35から離れたN+基板32とP−エピタキシャル層34との間での境界面(例えば、図3に参照符号45で示された位置)でアバランシェブレークダウンが生じる。これにより、ブレークダウン領域で形成されるホットキャリアによるゲート酸化膜層の損傷が回避される。
2.電界が最大に達した場合でも、トレンチの角部にあるゲート酸化膜は、破壊されないように保護される。
3.所定の閾値電圧においてパンチスルーブレークダウンが得られる。Nドレイン−ドリフト領域とP−本体の間の接合部は、N+基板に向かって下方に延びている。図10に示されるように、MOSFETに逆バイアスがかけられる場合、接合部の全体にわたって空乏領域が延在する。その結果、チャネル領域における空乏領域は、ソース領域に向かって急速に広がらない(矢印参照)。これは、パンチスルーブレークダウンを引き起こす条件である。
4.所定の閾値電圧において、より高いパンチスルーブレークダウン電圧が得られる。図13Aに示されるように、拡散された本体を有する従来のMOSFETにおいて、本体のドーパント濃度は、N−エピタキシャル(ドリフト領域)に近付くにつれて徐々に低下する。閾値電圧は、ピークドーピング濃度NAピークによって決定される。パンチスルーブレークダウン電圧は、チャネル領域内の電荷Qchannelの総量(図13AのP−本体曲線の下側の領域によって示されている)によって決定される。本発明のMOSFETにおいて、図13Bに示されるドーピングプロファイル、P−エピタキシャル層のドーパントプロファイルは、比較的平坦である。したがって、NAピークが同じでありながら、チャネル内の総電荷は多く、そのため、大きなパンチスルーブレークダウン電圧を与えることができる。
5.各セルにおける深部本体拡散(Bulucea特許に開示される種類の拡散)が無いため、別のP型ドーパントがチャネル領域内に入り込んでMOSFETの閾値電圧を引き上げてしまうといったことを考慮せずに、セルのピッチを小さくすることができる。そのため、セル充填密度を高めることができる。これにより、デバイスのオン抵抗を下げることができる。
6.従来のトレンチMOSFETにおいて、軽くドープされた“ドリフト領域”は、多くの場合、チャネルと濃密にドープされた基板との間に形成される。ドリフト領域におけるドーピング濃度は、一定のレベル未満に維持されなければならない。これは、一定のレベル未満でないと、有効な空乏層が得られず、トレンチの角部における電界強度が大きくなりすぎるからである。ドリフト領域でのドーピング濃度を低く維持すると、デバイスのオン抵抗が高くなる。これに対し、本発明のNドレイン−ドリフト領域33は更に濃密にドープすることができる。これは、Nドレイン−ドリフト領域33の形状およびNドレイン−ドリフト領域33とP−本体34Aの間の接合部の長さによって、有効な空乏層がより多く形成されるためである。更に濃密にドープされたNドレイン−ドリフト領域33は、オン抵抗を下げる。
7.図11Aに示されるように、MOSFETの終端領域においては、別個のP型拡散が不要である。これは、Nドレイン領域が位置する場所を除き、P−エピタキシャル層がN+基板へと延在しているためである。図11Bは、P型拡散110を含む従来のMOSFETの終端領域を示している。P型終端拡散すなわちフィールドリングを排除すると、マスキング工程の数が減る。例えば、図5A〜図5Lに示されるプロセスにおいて、必要なマスキング工程は5つだけである。
製造工程はN+基板32(図5A)から始まり、このN+基板32上には、良く知られた工程(図5B)によってP−エピタキシャル層34が成長される。その後、約50分間1150℃で蒸気加熱することにより、P−エピタキシャル層34の表面上に薄い酸化膜層51が成長される(図5C)。酸化膜層51は、マスクで覆われることによりデバイスの活性領域(すなわち、活性なMOSFETセルが設けられる領域)から除去されるとともに、終端領域およびゲートパッド領域においては残される。
Claims (6)
- トレンチゲート電極を有するパワーMOSFETの製造方法であって、
(1)第1の導電型の基板を準備する工程と、
(2)該基板上に第1又は第1の導電型と電荷が反対の第2の導電型のエピタキシャル層を成長させる工程と、
(3)必要に応じて該エピタキシャル層に前記第2の導電型のドーパントを注入して、該エピタキシャル層に第2の導電型の本体領域を形成する工程(ただし、上記エピタキシャル層を成長させる工程により該本体領域が形成される場合には、この工程は行わない)と、
(4)該エピタキシャル層中にトレンチを形成する工程と、
(5)トレンチの底部の下側に第1の導電型のドーパントを含む埋込層を形成する工程と、
(6)該埋込層に含まれる第1の導電型のドーパントをトレンチの底部に達するまで上方へと拡散させ、トレンチの側壁を取り囲む前記エピタキシャル層には該埋込層のドーパントが拡散していない領域が残っている時点で該ドーパントの上方への拡散を停止することで、トレンチ底部と基板とを接続する第1の導電型のドレイン−ドリフト領域を形成する工程と、
(7)トレンチの底部および側壁に沿って絶縁層を形成する工程と、
(8)導電性のゲート材料をトレンチ内に導入する工程と、
(9)第1の導電型のドーパントを前記エピタキシャル層内に導入して、ソース領域を形成する工程を含み、
前記ソース領域と前記ドレイン−ドリフト領域とが、トレンチの側壁に隣接するエピタキシャル層のチャネル領域によって分離しており、且つ、前記エピタキシャル層の前記本体領域がドレイン−ドリフト領域の側方を取り囲むとともにドレイン−ドリフト領域の部分を除いて基板へと延在している構造を有するパワーMOSFETが製造されることを特徴とする、パワーMOSFETの製造方法。 - 前記工程(2)において、第2の導電型のエピタキシャル層を基板上で成長させることを特徴とする請求項1に記載の方法。
- 成長させた前記第2の導電型のエピタキシャル層に第2の導電型のドーパントを注入し、エピタキシャル層と基板の間の境界面まで該ドーパントを到達させることを特徴とする請求項2に記載の方法。
- 前記工程(2)において、第1の導電型のエピタキシャル層を基板上で成長させた後に、第2の導電型のドーパントを注入し、エピタキシャル層と基板の間の境界面まで該ドーパントを到達させることを特徴とする請求項1に記載の方法。
- 第1の導電型の半導体基板と、前記基板上を覆うとともに、トレンチが形成されたエピタキシャル層と、該トレンチ中に配置され、該トレンチの底部および側壁に沿って延在する絶縁層により該エピタキシャル層から電気的に絶縁されたゲートとを備え、
さらに該エピタキシャル層は、エピタキシャル層の上面と該トレンチの側壁とに隣接して位置する第1の導電型のソース領域と、第2の導電型の本体と、チャネル領域と、前記基板と該トレンチの底部の間を接続する第1の導電型のドレイン−ドリフト領域とを備え、
前記ソース領域と前記ドレイン−ドリフト領域とが、トレンチの側壁を取り囲むエピタキシャル層のチャネル領域によって分離しており、
該ドレイン−ドリフト領域のドーピング濃度は、前記トレンチから下側への距離が大きくなるにつれて単調に増加し、
エピタキシャル層の前記本体領域が、ドレイン−ドリフト領域の側方を取り囲むとともに、ドレイン−ドリフト領域の部分を除いて基板へと延在していることを特徴とする、トレンチゲート電極を有するパワーMOSFET。 - 請求項1乃至4のいずれかの方法で製造されたことを特徴とする、請求項 5に記載のパワーMOSFET。
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US09/898,652 US6569738B2 (en) | 2001-07-03 | 2001-07-03 | Process for manufacturing trench gated MOSFET having drain/drift region |
PCT/US2002/020301 WO2003005452A2 (en) | 2001-07-03 | 2002-06-21 | Power mosfet having a trench gate electrode and method of making the same |
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