ATE492907T1 - Leistungs-mosfet mit graben-gateelektrode und verfahren zu dessen herstellung - Google Patents
Leistungs-mosfet mit graben-gateelektrode und verfahren zu dessen herstellungInfo
- Publication number
- ATE492907T1 ATE492907T1 AT02737592T AT02737592T ATE492907T1 AT E492907 T1 ATE492907 T1 AT E492907T1 AT 02737592 T AT02737592 T AT 02737592T AT 02737592 T AT02737592 T AT 02737592T AT E492907 T1 ATE492907 T1 AT E492907T1
- Authority
- AT
- Austria
- Prior art keywords
- trench
- epitaxial layer
- gate electrode
- type
- power mosfet
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002019 doping agent Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 210000000746 body region Anatomy 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2252—Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase
- H01L21/2253—Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase by ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/063—Reduced surface field [RESURF] pn-junction structures
- H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/898,652 US6569738B2 (en) | 2001-07-03 | 2001-07-03 | Process for manufacturing trench gated MOSFET having drain/drift region |
PCT/US2002/020301 WO2003005452A2 (en) | 2001-07-03 | 2002-06-21 | Power mosfet having a trench gate electrode and method of making the same |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE492907T1 true ATE492907T1 (de) | 2011-01-15 |
Family
ID=25409818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02737592T ATE492907T1 (de) | 2001-07-03 | 2002-06-21 | Leistungs-mosfet mit graben-gateelektrode und verfahren zu dessen herstellung |
Country Status (8)
Country | Link |
---|---|
US (2) | US6569738B2 (de) |
EP (1) | EP1425802B1 (de) |
JP (1) | JP4028482B2 (de) |
AT (1) | ATE492907T1 (de) |
AU (1) | AU2002310514A1 (de) |
DE (1) | DE60238693D1 (de) |
TW (1) | TW544913B (de) |
WO (1) | WO2003005452A2 (de) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6777745B2 (en) * | 2001-06-14 | 2004-08-17 | General Semiconductor, Inc. | Symmetric trench MOSFET device and method of making same |
US6764906B2 (en) * | 2001-07-03 | 2004-07-20 | Siliconix Incorporated | Method for making trench mosfet having implanted drain-drift region |
US7033876B2 (en) * | 2001-07-03 | 2006-04-25 | Siliconix Incorporated | Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same |
US6849898B2 (en) * | 2001-08-10 | 2005-02-01 | Siliconix Incorporated | Trench MIS device with active trench corners and thick bottom oxide |
US7291884B2 (en) * | 2001-07-03 | 2007-11-06 | Siliconix Incorporated | Trench MIS device having implanted drain-drift region and thick bottom oxide |
US20060038223A1 (en) * | 2001-07-03 | 2006-02-23 | Siliconix Incorporated | Trench MOSFET having drain-drift region comprising stack of implanted regions |
US7009247B2 (en) | 2001-07-03 | 2006-03-07 | Siliconix Incorporated | Trench MIS device with thick oxide layer in bottom of gate contact trench |
JP4024503B2 (ja) * | 2001-09-19 | 2007-12-19 | 株式会社東芝 | 半導体装置及びその製造方法 |
US6979862B2 (en) * | 2003-01-23 | 2005-12-27 | International Rectifier Corporation | Trench MOSFET superjunction structure and method to manufacture |
JP3954541B2 (ja) * | 2003-08-05 | 2007-08-08 | 株式会社東芝 | 半導体装置及びその製造方法 |
US7279743B2 (en) * | 2003-12-02 | 2007-10-09 | Vishay-Siliconix | Closed cell trench metal-oxide-semiconductor field effect transistor |
DE10361135B4 (de) * | 2003-12-23 | 2006-07-27 | Infineon Technologies Ag | Trenchtransistor und Verfahren zur Herstellung eines Trenchtransistors mit hochenergieimplantiertem Drain |
US7405452B2 (en) * | 2004-02-02 | 2008-07-29 | Hamza Yilmaz | Semiconductor device containing dielectrically isolated PN junction for enhanced breakdown characteristics |
JP4091921B2 (ja) | 2004-02-16 | 2008-05-28 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
US8183629B2 (en) * | 2004-05-13 | 2012-05-22 | Vishay-Siliconix | Stacked trench metal-oxide-semiconductor field effect transistor device |
JP4899405B2 (ja) * | 2004-11-08 | 2012-03-21 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
JP4907862B2 (ja) * | 2004-12-10 | 2012-04-04 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US20070029573A1 (en) * | 2005-08-08 | 2007-02-08 | Lin Cheng | Vertical-channel junction field-effect transistors having buried gates and methods of making |
US8471390B2 (en) * | 2006-05-12 | 2013-06-25 | Vishay-Siliconix | Power MOSFET contact metallization |
US8368126B2 (en) | 2007-04-19 | 2013-02-05 | Vishay-Siliconix | Trench metal oxide semiconductor with recessed trench material and remote contacts |
KR20100098147A (ko) * | 2009-02-27 | 2010-09-06 | 삼성전자주식회사 | 한 쌍의 채널이 게이트 양 측면에서 수직으로 형성되는 트렌치형 셀 구조와, 상기 채널을 셸로우 이온주입으로 코딩하는 마스크롬 셀 제조방법 |
US20120004281A1 (en) | 2009-03-27 | 2012-01-05 | Merck Sharp & Dohme Corp | RNA Interference Mediated Inhibition of the Nerve Growth Factor Beta Chain (NGFB) Gene Expression Using Short Interfering Nucleic Acid (siNA) |
US9306056B2 (en) * | 2009-10-30 | 2016-04-05 | Vishay-Siliconix | Semiconductor device with trench-like feed-throughs |
US8604525B2 (en) | 2009-11-02 | 2013-12-10 | Vishay-Siliconix | Transistor structure with feed-through source-to-substrate contact |
US20110198689A1 (en) * | 2010-02-17 | 2011-08-18 | Suku Kim | Semiconductor devices containing trench mosfets with superjunctions |
US8378392B2 (en) * | 2010-04-07 | 2013-02-19 | Force Mos Technology Co., Ltd. | Trench MOSFET with body region having concave-arc shape |
US20120018800A1 (en) * | 2010-07-22 | 2012-01-26 | Suku Kim | Trench Superjunction MOSFET with Thin EPI Process |
JP2012204636A (ja) | 2011-03-25 | 2012-10-22 | Toshiba Corp | 半導体装置およびその製造方法 |
JP5729331B2 (ja) * | 2011-04-12 | 2015-06-03 | 株式会社デンソー | 半導体装置の製造方法及び半導体装置 |
US8587059B2 (en) * | 2011-04-22 | 2013-11-19 | Infineon Technologies Austria Ag | Transistor arrangement with a MOSFET |
TWI520337B (zh) | 2012-12-19 | 2016-02-01 | 財團法人工業技術研究院 | 階梯溝渠式金氧半場效電晶體及其製造方法 |
US20150162411A1 (en) * | 2013-12-10 | 2015-06-11 | Infineon Technologies Ag | Method of manufacturing a semiconductor structure and semiconductor structure |
JP6237408B2 (ja) * | 2014-03-28 | 2017-11-29 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
US9425304B2 (en) | 2014-08-21 | 2016-08-23 | Vishay-Siliconix | Transistor structure with improved unclamped inductive switching immunity |
US9406750B2 (en) * | 2014-11-19 | 2016-08-02 | Empire Technology Development Llc | Output capacitance reduction in power transistors |
JP6115678B1 (ja) | 2016-02-01 | 2017-04-19 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
JP6781667B2 (ja) * | 2017-06-08 | 2020-11-04 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
WO2020162620A1 (ja) * | 2019-02-07 | 2020-08-13 | ローム株式会社 | 半導体装置 |
TWI732182B (zh) * | 2019-02-23 | 2021-07-01 | 世界先進積體電路股份有限公司 | 半導體裝置及其形成方法 |
CN110047757A (zh) * | 2019-04-24 | 2019-07-23 | 贵州芯长征科技有限公司 | 低成本的沟槽型功率半导体器件的制备方法 |
CN110071043A (zh) * | 2019-04-24 | 2019-07-30 | 贵州芯长征科技有限公司 | 一种功率半导体器件的制备方法 |
CN110047758A (zh) * | 2019-04-24 | 2019-07-23 | 贵州芯长征科技有限公司 | 一种低成本沟槽型功率半导体器件的制备工艺 |
US10892320B2 (en) | 2019-04-30 | 2021-01-12 | Vanguard International Semiconductor Corporation | Semiconductor devices having stacked trench gate electrodes overlapping a well region |
CN112531026B (zh) * | 2019-09-17 | 2022-06-21 | 无锡华润上华科技有限公司 | 横向扩散金属氧化物半导体器件及其制造方法 |
TWI739252B (zh) * | 2019-12-25 | 2021-09-11 | 杰力科技股份有限公司 | 溝槽式mosfet元件及其製造方法 |
US11527618B2 (en) | 2020-07-18 | 2022-12-13 | Semiconductor Components Industries, Llc | Up-diffusion suppression in a power MOSFET |
CN116666435A (zh) * | 2023-07-18 | 2023-08-29 | 华羿微电子股份有限公司 | 一种线性功率mosfet器件及制备方法 |
Family Cites Families (16)
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US4689871A (en) * | 1985-09-24 | 1987-09-01 | Texas Instruments Incorporated | Method of forming vertically integrated current source |
US4767722A (en) * | 1986-03-24 | 1988-08-30 | Siliconix Incorporated | Method for making planar vertical channel DMOS structures |
US5021355A (en) * | 1989-05-22 | 1991-06-04 | International Business Machines Corporation | Method of fabricating cross-point lightly-doped drain-source trench transistor |
CN1019720B (zh) * | 1991-03-19 | 1992-12-30 | 电子科技大学 | 半导体功率器件 |
US5250450A (en) * | 1991-04-08 | 1993-10-05 | Micron Technology, Inc. | Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance |
US5571738A (en) * | 1992-09-21 | 1996-11-05 | Advanced Micro Devices, Inc. | Method of making poly LDD self-aligned channel transistors |
US5424231A (en) * | 1994-08-09 | 1995-06-13 | United Microelectronics Corp. | Method for manufacturing a VDMOS transistor |
US5719409A (en) * | 1996-06-06 | 1998-02-17 | Cree Research, Inc. | Silicon carbide metal-insulator semiconductor field effect transistor |
DE19720193C2 (de) * | 1997-05-14 | 2002-10-17 | Infineon Technologies Ag | Integrierte Schaltungsanordnung mit mindestens zwei vertikalen MOS-Transistoren und Verfahren zu deren Herstellung |
US6191446B1 (en) * | 1998-03-04 | 2001-02-20 | Advanced Micro Devices, Inc. | Formation and control of a vertically oriented transistor channel length |
US6614074B2 (en) * | 1998-06-05 | 2003-09-02 | International Business Machines Corporation | Grooved planar DRAM transfer device using buried pocket |
US6194741B1 (en) * | 1998-11-03 | 2001-02-27 | International Rectifier Corp. | MOSgated trench type power semiconductor with silicon carbide substrate and increased gate breakdown voltage and reduced on-resistance |
US6084264A (en) * | 1998-11-25 | 2000-07-04 | Siliconix Incorporated | Trench MOSFET having improved breakdown and on-resistance characteristics |
US6297530B1 (en) * | 1998-12-28 | 2001-10-02 | Infineon Technologies North America Corp. | Self aligned channel implantation |
DE19913375B4 (de) * | 1999-03-24 | 2009-03-26 | Infineon Technologies Ag | Verfahren zur Herstellung einer MOS-Transistorstruktur |
US6380569B1 (en) * | 1999-08-10 | 2002-04-30 | Rockwell Science Center, Llc | High power unipolar FET switch |
-
2001
- 2001-07-03 US US09/898,652 patent/US6569738B2/en not_active Expired - Lifetime
-
2002
- 2002-06-21 WO PCT/US2002/020301 patent/WO2003005452A2/en active Application Filing
- 2002-06-21 AT AT02737592T patent/ATE492907T1/de not_active IP Right Cessation
- 2002-06-21 EP EP02737592A patent/EP1425802B1/de not_active Expired - Lifetime
- 2002-06-21 DE DE60238693T patent/DE60238693D1/de not_active Expired - Lifetime
- 2002-06-21 AU AU2002310514A patent/AU2002310514A1/en not_active Abandoned
- 2002-06-21 JP JP2003511317A patent/JP4028482B2/ja not_active Expired - Lifetime
- 2002-06-28 TW TW091114369A patent/TW544913B/zh not_active IP Right Cessation
- 2002-08-02 US US10/211,438 patent/US6600193B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1425802B1 (de) | 2010-12-22 |
WO2003005452A2 (en) | 2003-01-16 |
US6600193B2 (en) | 2003-07-29 |
WO2003005452A3 (en) | 2003-09-04 |
JP4028482B2 (ja) | 2007-12-26 |
DE60238693D1 (de) | 2011-02-03 |
AU2002310514A1 (en) | 2003-01-21 |
TW544913B (en) | 2003-08-01 |
US6569738B2 (en) | 2003-05-27 |
US20030006454A1 (en) | 2003-01-09 |
JP2004535067A (ja) | 2004-11-18 |
EP1425802A2 (de) | 2004-06-09 |
US20030008460A1 (en) | 2003-01-09 |
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