JP4015754B2 - 冷却装置および冷却装置を有する電子機器 - Google Patents

冷却装置および冷却装置を有する電子機器 Download PDF

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Publication number
JP4015754B2
JP4015754B2 JP17597098A JP17597098A JP4015754B2 JP 4015754 B2 JP4015754 B2 JP 4015754B2 JP 17597098 A JP17597098 A JP 17597098A JP 17597098 A JP17597098 A JP 17597098A JP 4015754 B2 JP4015754 B2 JP 4015754B2
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JP
Japan
Prior art keywords
fan
heat
casing
heat sink
mpu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17597098A
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English (en)
Japanese (ja)
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JP2000013070A5 (enExample
JP2000013070A (ja
Inventor
博 中村
勝彦 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Home Technology Corp
Original Assignee
Toshiba Corp
Toshiba Home Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Home Technology Corp filed Critical Toshiba Corp
Priority to JP17597098A priority Critical patent/JP4015754B2/ja
Priority to US09/337,752 priority patent/US6049455A/en
Publication of JP2000013070A publication Critical patent/JP2000013070A/ja
Publication of JP2000013070A5 publication Critical patent/JP2000013070A5/ja
Application granted granted Critical
Publication of JP4015754B2 publication Critical patent/JP4015754B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
    • F04D29/4226—Fan casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/44—Fluid-guiding means, e.g. diffusers
    • F04D29/441—Fluid-guiding means, e.g. diffusers especially adapted for elastic fluid pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP17597098A 1998-06-23 1998-06-23 冷却装置および冷却装置を有する電子機器 Expired - Lifetime JP4015754B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP17597098A JP4015754B2 (ja) 1998-06-23 1998-06-23 冷却装置および冷却装置を有する電子機器
US09/337,752 US6049455A (en) 1998-06-23 1999-06-22 Cooling unit for cooling a heat-generating components and electronic apparatus having the cooling unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17597098A JP4015754B2 (ja) 1998-06-23 1998-06-23 冷却装置および冷却装置を有する電子機器

Publications (3)

Publication Number Publication Date
JP2000013070A JP2000013070A (ja) 2000-01-14
JP2000013070A5 JP2000013070A5 (enExample) 2005-10-20
JP4015754B2 true JP4015754B2 (ja) 2007-11-28

Family

ID=16005440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17597098A Expired - Lifetime JP4015754B2 (ja) 1998-06-23 1998-06-23 冷却装置および冷却装置を有する電子機器

Country Status (2)

Country Link
US (1) US6049455A (enExample)
JP (1) JP4015754B2 (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4119008B2 (ja) * 1998-06-23 2008-07-16 株式会社東芝 回路部品の冷却装置および電子機器
JP2000216575A (ja) * 1999-01-22 2000-08-04 Toshiba Corp 冷却装置及び冷却装置を内蔵した電子機器
JP3959495B2 (ja) * 1999-08-31 2007-08-15 富士通株式会社 情報処理装置
US6414844B1 (en) * 1999-09-03 2002-07-02 Matsushita Electric Industrial Co., Ltd. Portable information processing apparatus
US6362956B2 (en) * 1999-10-04 2002-03-26 Apple Computer, Inc. Thermal management system
US6972953B1 (en) 1999-10-04 2005-12-06 Apple Computer, Inc. Thermal management system
US6238181B1 (en) * 1999-10-05 2001-05-29 Andy Chen Heat dissipating device for portable apparatus
US6411505B1 (en) * 1999-11-12 2002-06-25 Apple Computer, Inc. Computer housing for a portable computer
JP4327320B2 (ja) * 2000-01-07 2009-09-09 株式会社東芝 電子機器
GB2358521A (en) * 2000-01-24 2001-07-25 Chen Yang Shiau Heat sink structure adapted for use in a computer housing
JP2001267771A (ja) * 2000-03-17 2001-09-28 Hitachi Ltd 電子装置
JP4386219B2 (ja) * 2000-03-31 2009-12-16 富士通株式会社 放熱機構及び当該放熱機構を有する電子機器
JP3602771B2 (ja) * 2000-05-12 2004-12-15 富士通株式会社 携帯型電子機器
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6704199B2 (en) 2000-07-05 2004-03-09 Network Engines, Inc. Low profile equipment housing with angular fan
US6512673B1 (en) * 2000-07-05 2003-01-28 Network Engines, Inc. Low profile equipment housing with angular fan
US6585485B2 (en) * 2001-05-23 2003-07-01 Sen-Yung Lee Air flow guide device on heat dispensing fan
TW547702U (en) * 2001-07-11 2003-08-11 Quanta Comp Inc Heat dissipating module and its fixing device
US6798647B2 (en) 2001-07-16 2004-09-28 Hewlett-Packard Development Company, L.P. Portable computer with integrated PDA I/O docking cradle
US6754072B2 (en) 2001-09-24 2004-06-22 International Business Machines Corporation Portable device for cooling a laptop computer
JP4167700B2 (ja) * 2006-05-31 2008-10-15 株式会社東芝 電子機器
JP4796457B2 (ja) * 2006-08-16 2011-10-19 富士通株式会社 機器、演算装置および放熱部材
JP2008071855A (ja) * 2006-09-13 2008-03-27 Fujitsu Ltd 電子機器およびプリント基板ユニット
JP5113363B2 (ja) * 2006-09-28 2013-01-09 富士通株式会社 電子機器
US8282492B2 (en) * 2006-11-08 2012-10-09 Wms Gaming Inc. Gaming machine ventilation system
JP2008140058A (ja) * 2006-11-30 2008-06-19 Toshiba Corp 電子機器
CN101435438B (zh) * 2007-11-16 2012-06-13 富准精密工业(深圳)有限公司 风扇底座和采用该风扇底座的散热风扇
US8888450B2 (en) * 2011-09-23 2014-11-18 Brett W. Degner Sculpted fan housing
KR101487147B1 (ko) * 2011-11-15 2015-01-28 헨켈 아이피 앤드 홀딩 게엠베하 단열 층을 구비하여 조립된 전자 장치
JP5991125B2 (ja) * 2012-09-28 2016-09-14 富士通株式会社 電子機器
CN104684309A (zh) * 2013-11-29 2015-06-03 英业达科技有限公司 电子装置
JP6519985B2 (ja) * 2014-05-07 2019-05-29 日本電産株式会社 ケーシングおよび送風機
US9690324B2 (en) * 2014-05-19 2017-06-27 Lenovo (Beijing) Co., Ltd. Electronic device and a switching method
CN106462201B (zh) * 2014-05-20 2020-06-05 雷蛇(亚太)私人有限公司 用于计算机系统的机壳、其零件以及其中增强气流的方法
WO2022111452A1 (zh) * 2020-11-27 2022-06-02 深圳市蓝禾技术有限公司 便携风扇
US11320876B1 (en) 2020-12-07 2022-05-03 Dell Products L.P. Information handling system handle with integrated thermal rejection system
US11733742B2 (en) 2020-12-07 2023-08-22 Dell Products L.P. Information handling system integrated speaker with variable volume sound chamber
US11262821B1 (en) * 2020-12-07 2022-03-01 Dell Products L.P. Information handling system with articulated cooling fins between interleaved and separated positions
US11675401B2 (en) * 2021-06-01 2023-06-13 Dell Products L.P. Thermal venting in a portable information handling system

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0887348A (ja) * 1994-09-14 1996-04-02 Toshiba Corp 携帯形電子機器
JP3786446B2 (ja) * 1995-03-31 2006-06-14 松下電器産業株式会社 送風装置
US5896917A (en) * 1996-02-22 1999-04-27 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
JP3127821B2 (ja) * 1996-04-04 2001-01-29 松下電器産業株式会社 ヒートシンク装置
US5966286A (en) * 1996-05-31 1999-10-12 Intel Corporation Cooling system for thin profile electronic and computer devices
JP3099740B2 (ja) * 1996-07-12 2000-10-16 ティアック株式会社 内蔵装置及び電子装置
JP3637176B2 (ja) * 1997-03-28 2005-04-13 株式会社東芝 電子機器
US5959836A (en) * 1997-04-23 1999-09-28 Intel Corporation Airflow heat exchanger for a portable computing device and docking station
US5898569A (en) * 1997-04-25 1999-04-27 Intel Corporation Power cable heat exchanger for a computing device
US5946190A (en) * 1997-08-29 1999-08-31 Hewlett-Packard Company Ducted high aspect ratio heatsink assembly
US5917699A (en) * 1997-12-09 1999-06-29 Compal Electronics Inc. Heat-radiating device
DE29806082U1 (de) * 1998-04-02 1998-06-18 Ideal Electronics Inc., San Chung, Taipei Kühleinrichtung für eine zentrale Recheneinheit

Also Published As

Publication number Publication date
US6049455A (en) 2000-04-11
JP2000013070A (ja) 2000-01-14

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