JP4006855B2 - 光学デバイスの製造方法 - Google Patents

光学デバイスの製造方法 Download PDF

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Publication number
JP4006855B2
JP4006855B2 JP31150698A JP31150698A JP4006855B2 JP 4006855 B2 JP4006855 B2 JP 4006855B2 JP 31150698 A JP31150698 A JP 31150698A JP 31150698 A JP31150698 A JP 31150698A JP 4006855 B2 JP4006855 B2 JP 4006855B2
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JP
Japan
Prior art keywords
laminated
cutting
temporary fixing
mirror
manufacturing
Prior art date
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Expired - Fee Related
Application number
JP31150698A
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English (en)
Japanese (ja)
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JP2000143264A (ja
JP2000143264A5 (enExample
Inventor
克己 菅
信芳 三島
政幸 中水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
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Epson Toyocom Corp
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Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP31150698A priority Critical patent/JP4006855B2/ja
Publication of JP2000143264A publication Critical patent/JP2000143264A/ja
Publication of JP2000143264A5 publication Critical patent/JP2000143264A5/ja
Application granted granted Critical
Publication of JP4006855B2 publication Critical patent/JP4006855B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Joining Of Glass To Other Materials (AREA)
JP31150698A 1998-10-30 1998-10-30 光学デバイスの製造方法 Expired - Fee Related JP4006855B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31150698A JP4006855B2 (ja) 1998-10-30 1998-10-30 光学デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31150698A JP4006855B2 (ja) 1998-10-30 1998-10-30 光学デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2000143264A JP2000143264A (ja) 2000-05-23
JP2000143264A5 JP2000143264A5 (enExample) 2005-02-24
JP4006855B2 true JP4006855B2 (ja) 2007-11-14

Family

ID=18018064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31150698A Expired - Fee Related JP4006855B2 (ja) 1998-10-30 1998-10-30 光学デバイスの製造方法

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JP (1) JP4006855B2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0495263A (ja) * 1990-08-10 1992-03-27 Teac Corp ヘッドキャリッジ装置
CN105152524A (zh) * 2015-08-05 2015-12-16 上海浩赞智能科技有限公司 触摸屏层叠切断的加工方法
TWI708971B (zh) * 2014-11-13 2020-11-01 新加坡商新加坡恒立私人有限公司 光學式光導件製造方法及光學式光導件

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6778341B2 (en) 2001-01-31 2004-08-17 Seiko Epson Corporation Method for manufacturing light-selective prism
US6542247B2 (en) * 2001-06-06 2003-04-01 Agilent Technologies, Inc. Multi-axis interferometer with integrated optical structure and method for manufacturing rhomboid assemblies
JP2005148182A (ja) 2003-11-12 2005-06-09 Sankyo Seiki Mfg Co Ltd プリズムの製造方法、プリズム、およびそれを用いた光ヘッド装置
JP2006220773A (ja) * 2005-02-08 2006-08-24 Konica Minolta Opto Inc 光学素子の製造方法
JP4637653B2 (ja) * 2005-06-01 2011-02-23 富士フイルム株式会社 プリズムの製造方法
JP2007249129A (ja) 2006-03-20 2007-09-27 Epson Toyocom Corp 波長分離素子、波長分離素子の製造方法及び光モジュール
JP4607810B2 (ja) * 2006-04-17 2011-01-05 富士フイルム株式会社 偏光フィルタ及び偏光フィルタの製造方法
JP4935230B2 (ja) * 2006-08-03 2012-05-23 セイコーエプソン株式会社 透光性基板の製造方法
JP5055961B2 (ja) 2006-11-07 2012-10-24 コニカミノルタアドバンストレイヤー株式会社 光学素子の製造方法
WO2008136243A1 (ja) * 2007-04-27 2008-11-13 Konica Minolta Opto, Inc. 光学素子の製造方法および接合治具
JP4471038B2 (ja) * 2007-05-07 2010-06-02 コニカミノルタオプト株式会社 光学素子の製造方法
WO2009040969A1 (ja) * 2007-09-25 2009-04-02 Sharp Kabushiki Kaisha 偏光板、それを備えた液晶表示パネル及びそれらの製造方法
JP4577450B2 (ja) * 2009-11-12 2010-11-10 エプソントヨコム株式会社 光学デバイス及び光ピックアップ
JP2011170092A (ja) * 2010-02-18 2011-09-01 Fujifilm Corp 光学素子及び光学素子製造方法
JPWO2013172353A1 (ja) * 2012-05-15 2016-01-12 電気化学工業株式会社 積層体の加工装置及び加工方法
JP6315305B2 (ja) * 2013-02-19 2018-04-25 日本電気硝子株式会社 ガラス積層体及びこれを用いた光学結像部材
WO2015137142A1 (ja) * 2014-03-13 2015-09-17 日本電気硝子株式会社 ガラス積層体の製造方法及びガラス積層体
CN106737277A (zh) * 2016-12-07 2017-05-31 中山市光大光学仪器有限公司 用于胶合棱镜的夹具和方法
EP3783397A1 (de) * 2019-08-20 2021-02-24 Fisba AG Subbaugruppe, objektiv und langes und schlankes optisches bildübertragungssystem
CN111704353B (zh) * 2020-06-23 2022-04-05 惠州市祺光科技有限公司 一种镀膜立方体棱镜的加工方法
CN113511804B (zh) * 2021-03-23 2023-05-12 常州第二电子仪器有限公司 45°直角棱镜粗加工的方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0495263A (ja) * 1990-08-10 1992-03-27 Teac Corp ヘッドキャリッジ装置
TWI708971B (zh) * 2014-11-13 2020-11-01 新加坡商新加坡恒立私人有限公司 光學式光導件製造方法及光學式光導件
US12130454B2 (en) 2014-11-13 2024-10-29 Ams Sensors Singapore Pte. Ltd. Manufacture of optical light guides
CN105152524A (zh) * 2015-08-05 2015-12-16 上海浩赞智能科技有限公司 触摸屏层叠切断的加工方法
CN105152524B (zh) * 2015-08-05 2017-06-06 上海浩赞智能科技有限公司 触摸屏层叠切断的加工方法

Also Published As

Publication number Publication date
JP2000143264A (ja) 2000-05-23

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