JP3992770B2 - 発光装置及びその形成方法 - Google Patents

発光装置及びその形成方法 Download PDF

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Publication number
JP3992770B2
JP3992770B2 JP31160496A JP31160496A JP3992770B2 JP 3992770 B2 JP3992770 B2 JP 3992770B2 JP 31160496 A JP31160496 A JP 31160496A JP 31160496 A JP31160496 A JP 31160496A JP 3992770 B2 JP3992770 B2 JP 3992770B2
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Japan
Prior art keywords
light
led chip
emitting device
translucent
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31160496A
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English (en)
Japanese (ja)
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JPH10151794A5 (https=
JPH10151794A (ja
Inventor
元量 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP31160496A priority Critical patent/JP3992770B2/ja
Publication of JPH10151794A publication Critical patent/JPH10151794A/ja
Publication of JPH10151794A5 publication Critical patent/JPH10151794A5/ja
Application granted granted Critical
Publication of JP3992770B2 publication Critical patent/JP3992770B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP31160496A 1996-11-22 1996-11-22 発光装置及びその形成方法 Expired - Fee Related JP3992770B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31160496A JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31160496A JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP11337844A Division JP2000164939A (ja) 1999-01-01 1999-11-29 発光装置
JP2004278872A Division JP3852462B2 (ja) 2004-09-27 2004-09-27 発光装置及びその形成方法

Publications (3)

Publication Number Publication Date
JPH10151794A JPH10151794A (ja) 1998-06-09
JPH10151794A5 JPH10151794A5 (https=) 2004-11-18
JP3992770B2 true JP3992770B2 (ja) 2007-10-17

Family

ID=18019257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31160496A Expired - Fee Related JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

Country Status (1)

Country Link
JP (1) JP3992770B2 (https=)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3785820B2 (ja) 1998-08-03 2006-06-14 豊田合成株式会社 発光装置
JP3400958B2 (ja) * 1999-07-07 2003-04-28 株式会社シチズン電子 多色発光ダイオード
WO2000079605A1 (fr) 1999-06-23 2000-12-28 Citizen Electronics Co., Ltd. Diode électroluminescente
JP2001077430A (ja) * 1999-09-02 2001-03-23 Citizen Electronics Co Ltd 発光ダイオード
EP1119058A4 (en) * 1999-07-29 2006-08-23 Citizen Electronics LIGHT-EMITTING DIODE
AU3226101A (en) 2000-02-09 2001-08-20 Nippon Leiz Corporation Light source
JP2001223388A (ja) * 2000-02-09 2001-08-17 Nippon Leiz Co Ltd 光源装置
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US7053419B1 (en) * 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP2002141556A (ja) 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
JP2002124705A (ja) * 2000-10-17 2002-04-26 Citizen Electronics Co Ltd 発光ダイオードとその製造方法
JP3972670B2 (ja) 2002-02-06 2007-09-05 豊田合成株式会社 発光装置
KR20040020240A (ko) * 2002-08-30 2004-03-09 엘지이노텍 주식회사 발광다이오드 램프 및 그 제조방법
JP2004158557A (ja) * 2002-11-05 2004-06-03 Shurai Kagi Kofun Yugenkoshi 類似フリップチップ型の発光ダイオード装置パッケージ
US7009213B2 (en) * 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
DE10351397A1 (de) * 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip
JP2005159296A (ja) * 2003-11-06 2005-06-16 Sharp Corp オプトデバイスのパッケージ構造
KR100576866B1 (ko) 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
JP3863169B2 (ja) * 2005-10-03 2006-12-27 東芝電子エンジニアリング株式会社 発光装置
JP3863174B2 (ja) * 2006-05-08 2006-12-27 東芝電子エンジニアリング株式会社 発光装置
JP2010512660A (ja) * 2006-12-11 2010-04-22 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 無極性および半極性の発光デバイス
JPWO2009066430A1 (ja) * 2007-11-19 2011-03-31 パナソニック株式会社 半導体発光装置および半導体発光装置の製造方法
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
KR20100008620A (ko) * 2008-07-16 2010-01-26 삼성전기주식회사 발광 장치 및 이를 구비하는 백라이트 유닛
JP5326705B2 (ja) * 2009-03-17 2013-10-30 日亜化学工業株式会社 発光装置
JP5689225B2 (ja) * 2009-03-31 2015-03-25 日亜化学工業株式会社 発光装置
JP2010245481A (ja) * 2009-04-10 2010-10-28 Sharp Corp 発光装置
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
JP5572013B2 (ja) * 2010-06-16 2014-08-13 スタンレー電気株式会社 発光装置およびその製造方法
JP2012033823A (ja) * 2010-08-02 2012-02-16 Stanley Electric Co Ltd 発光装置およびその製造方法
JP5588368B2 (ja) * 2011-01-24 2014-09-10 スタンレー電気株式会社 発光装置およびその製造方法
JP5647028B2 (ja) * 2011-02-14 2014-12-24 スタンレー電気株式会社 発光装置およびその製造方法
JP5681532B2 (ja) * 2011-03-07 2015-03-11 スタンレー電気株式会社 発光装置およびその製造方法
JP5718117B2 (ja) * 2011-03-24 2015-05-13 スタンレー電気株式会社 発光装置及びその製造方法
JP2013038187A (ja) * 2011-08-05 2013-02-21 Stanley Electric Co Ltd 発光装置およびその製造方法
JP6029188B2 (ja) * 2012-03-26 2016-11-24 富士機械製造株式会社 Ｌｅｄパッケージ及びその製造方法
JP6097489B2 (ja) * 2012-03-30 2017-03-15 古河電気工業株式会社 発光ダイオード用封止樹脂フィルムおよび発光ダイオードパッケージ
KR102221599B1 (ko) 2014-06-18 2021-03-02 엘지이노텍 주식회사 발광 소자 패키지
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
JP2015099940A (ja) * 2015-02-23 2015-05-28 日亜化学工業株式会社 発光装置
WO2016150718A1 (en) * 2015-03-20 2016-09-29 Philips Lighting Holding B.V. Uv-c water purification device
JP6274240B2 (ja) * 2016-03-28 2018-02-07 日亜化学工業株式会社 発光装置
DE102016106270A1 (de) * 2016-04-06 2017-10-12 Osram Opto Semiconductors Gmbh Herstellung eines halbleiterbauelements
JP6955135B2 (ja) 2016-10-19 2021-10-27 日亜化学工業株式会社 発光装置およびその製造方法
JP7032645B2 (ja) * 2018-03-26 2022-03-09 日亜化学工業株式会社 発光モジュール及びその製造方法
EP3905347B1 (en) 2018-12-27 2024-02-21 Denka Company Limited Light-emitting substrate, and lighting device
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12040436B2 (en) 2018-12-27 2024-07-16 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
EP3905348B1 (en) 2018-12-27 2024-01-24 Denka Company Limited Light-emitting substrate, and lighting device
CN113228316B (zh) 2018-12-27 2025-01-10 电化株式会社 荧光体基板、发光基板以及照明装置

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