JP3992770B2 - 発光装置及びその形成方法 - Google Patents

発光装置及びその形成方法 Download PDF

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Publication number
JP3992770B2
JP3992770B2 JP31160496A JP31160496A JP3992770B2 JP 3992770 B2 JP3992770 B2 JP 3992770B2 JP 31160496 A JP31160496 A JP 31160496A JP 31160496 A JP31160496 A JP 31160496A JP 3992770 B2 JP3992770 B2 JP 3992770B2
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Japan
Prior art keywords
light
led chip
emitting device
translucent
light emitting
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Expired - Fee Related
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JP31160496A
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English (en)
Japanese (ja)
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JPH10151794A5 (enExample
JPH10151794A (ja
Inventor
元量 山田
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Nichia Corp
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Nichia Corp
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Priority to JP31160496A priority Critical patent/JP3992770B2/ja
Publication of JPH10151794A publication Critical patent/JPH10151794A/ja
Publication of JPH10151794A5 publication Critical patent/JPH10151794A5/ja
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Publication of JP3992770B2 publication Critical patent/JP3992770B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP31160496A 1996-11-22 1996-11-22 発光装置及びその形成方法 Expired - Fee Related JP3992770B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31160496A JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31160496A JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP11337844A Division JP2000164939A (ja) 1999-01-01 1999-11-29 発光装置
JP2004278872A Division JP3852462B2 (ja) 2004-09-27 2004-09-27 発光装置及びその形成方法

Publications (3)

Publication Number Publication Date
JPH10151794A JPH10151794A (ja) 1998-06-09
JPH10151794A5 JPH10151794A5 (enExample) 2004-11-18
JP3992770B2 true JP3992770B2 (ja) 2007-10-17

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JP31160496A Expired - Fee Related JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

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JP (1) JP3992770B2 (enExample)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3785820B2 (ja) 1998-08-03 2006-06-14 豊田合成株式会社 発光装置
JP3400958B2 (ja) * 1999-07-07 2003-04-28 株式会社シチズン電子 多色発光ダイオード
WO2000079605A1 (fr) 1999-06-23 2000-12-28 Citizen Electronics Co., Ltd. Diode électroluminescente
WO2001009963A1 (en) * 1999-07-29 2001-02-08 Citizen Electronics Co., Ltd. Light-emitting diode
JP2001077430A (ja) * 1999-09-02 2001-03-23 Citizen Electronics Co Ltd 発光ダイオード
CN1225801C (zh) 2000-02-09 2005-11-02 日本光源股份有限公司 光源装置
JP2001223388A (ja) * 2000-02-09 2001-08-17 Nippon Leiz Co Ltd 光源装置
US7053419B1 (en) * 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP2002141556A (ja) 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
JP2002124705A (ja) * 2000-10-17 2002-04-26 Citizen Electronics Co Ltd 発光ダイオードとその製造方法
JP3972670B2 (ja) 2002-02-06 2007-09-05 豊田合成株式会社 発光装置
KR20040020240A (ko) * 2002-08-30 2004-03-09 엘지이노텍 주식회사 발광다이오드 램프 및 그 제조방법
JP2004158557A (ja) * 2002-11-05 2004-06-03 Shurai Kagi Kofun Yugenkoshi 類似フリップチップ型の発光ダイオード装置パッケージ
US7009213B2 (en) * 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
DE10351397A1 (de) * 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip
JP2005159296A (ja) * 2003-11-06 2005-06-16 Sharp Corp オプトデバイスのパッケージ構造
US9130119B2 (en) * 2006-12-11 2015-09-08 The Regents Of The University Of California Non-polar and semi-polar light emitting devices
KR100576866B1 (ko) 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
JP3863169B2 (ja) * 2005-10-03 2006-12-27 東芝電子エンジニアリング株式会社 発光装置
JP3863174B2 (ja) * 2006-05-08 2006-12-27 東芝電子エンジニアリング株式会社 発光装置
CN101855735A (zh) 2007-11-19 2010-10-06 松下电器产业株式会社 半导体发光装置及半导体发光装置的制造方法
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
KR20100008620A (ko) * 2008-07-16 2010-01-26 삼성전기주식회사 발광 장치 및 이를 구비하는 백라이트 유닛
JP5326705B2 (ja) * 2009-03-17 2013-10-30 日亜化学工業株式会社 発光装置
JP5689225B2 (ja) * 2009-03-31 2015-03-25 日亜化学工業株式会社 発光装置
JP2010245481A (ja) * 2009-04-10 2010-10-28 Sharp Corp 発光装置
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
JP5572013B2 (ja) * 2010-06-16 2014-08-13 スタンレー電気株式会社 発光装置およびその製造方法
JP2012033823A (ja) 2010-08-02 2012-02-16 Stanley Electric Co Ltd 発光装置およびその製造方法
JP5588368B2 (ja) * 2011-01-24 2014-09-10 スタンレー電気株式会社 発光装置およびその製造方法
JP5647028B2 (ja) * 2011-02-14 2014-12-24 スタンレー電気株式会社 発光装置およびその製造方法
JP5681532B2 (ja) * 2011-03-07 2015-03-11 スタンレー電気株式会社 発光装置およびその製造方法
JP5718117B2 (ja) * 2011-03-24 2015-05-13 スタンレー電気株式会社 発光装置及びその製造方法
JP2013038187A (ja) * 2011-08-05 2013-02-21 Stanley Electric Co Ltd 発光装置およびその製造方法
WO2013145071A1 (ja) * 2012-03-26 2013-10-03 富士機械製造株式会社 Ｌｅｄパッケージ及びその製造方法
JP6097489B2 (ja) * 2012-03-30 2017-03-15 古河電気工業株式会社 発光ダイオード用封止樹脂フィルムおよび発光ダイオードパッケージ
KR102221599B1 (ko) 2014-06-18 2021-03-02 엘지이노텍 주식회사 발광 소자 패키지
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
JP2015099940A (ja) * 2015-02-23 2015-05-28 日亜化学工業株式会社 発光装置
US10501342B2 (en) * 2015-03-20 2019-12-10 Signify Holding B.V. UV-C water purification device
JP6274240B2 (ja) * 2016-03-28 2018-02-07 日亜化学工業株式会社 発光装置
DE102016106270A1 (de) * 2016-04-06 2017-10-12 Osram Opto Semiconductors Gmbh Herstellung eines halbleiterbauelements
JP6955135B2 (ja) 2016-10-19 2021-10-27 日亜化学工業株式会社 発光装置およびその製造方法
JP7032645B2 (ja) * 2018-03-26 2022-03-09 日亜化学工業株式会社 発光モジュール及びその製造方法
KR102872847B1 (ko) 2018-12-27 2025-10-20 덴카 주식회사 형광체 기판, 발광 기판 및 조명 장치
JP7425750B2 (ja) 2018-12-27 2024-01-31 デンカ株式会社 蛍光体基板、発光基板及び照明装置
EP3905348B1 (en) 2018-12-27 2024-01-24 Denka Company Limited Light-emitting substrate, and lighting device
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CN113228313B (zh) 2018-12-27 2025-01-07 电化株式会社 荧光体基板、发光基板以及照明装置

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