JP3992770B2 - 発光装置及びその形成方法 - Google Patents

発光装置及びその形成方法 Download PDF

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Publication number
JP3992770B2
JP3992770B2 JP31160496A JP31160496A JP3992770B2 JP 3992770 B2 JP3992770 B2 JP 3992770B2 JP 31160496 A JP31160496 A JP 31160496A JP 31160496 A JP31160496 A JP 31160496A JP 3992770 B2 JP3992770 B2 JP 3992770B2
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JP
Japan
Prior art keywords
light
led chip
emitting device
translucent
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31160496A
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English (en)
Japanese (ja)
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JPH10151794A (ja
JPH10151794A5 (enExample
Inventor
元量 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP31160496A priority Critical patent/JP3992770B2/ja
Publication of JPH10151794A publication Critical patent/JPH10151794A/ja
Publication of JPH10151794A5 publication Critical patent/JPH10151794A5/ja
Application granted granted Critical
Publication of JP3992770B2 publication Critical patent/JP3992770B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP31160496A 1996-11-22 1996-11-22 発光装置及びその形成方法 Expired - Fee Related JP3992770B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31160496A JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31160496A JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP11337844A Division JP2000164939A (ja) 1999-01-01 1999-11-29 発光装置
JP2004278872A Division JP3852462B2 (ja) 2004-09-27 2004-09-27 発光装置及びその形成方法

Publications (3)

Publication Number Publication Date
JPH10151794A JPH10151794A (ja) 1998-06-09
JPH10151794A5 JPH10151794A5 (enExample) 2004-11-18
JP3992770B2 true JP3992770B2 (ja) 2007-10-17

Family

ID=18019257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31160496A Expired - Fee Related JP3992770B2 (ja) 1996-11-22 1996-11-22 発光装置及びその形成方法

Country Status (1)

Country Link
JP (1) JP3992770B2 (enExample)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3785820B2 (ja) 1998-08-03 2006-06-14 豊田合成株式会社 発光装置
EP1107321A4 (en) 1999-06-23 2006-08-30 Citizen Electronics LIGHT-EMITTING DIODE
JP3400958B2 (ja) * 1999-07-07 2003-04-28 株式会社シチズン電子 多色発光ダイオード
JP2001077430A (ja) * 1999-09-02 2001-03-23 Citizen Electronics Co Ltd 発光ダイオード
US6396082B1 (en) 1999-07-29 2002-05-28 Citizen Electronics Co., Ltd. Light-emitting diode
HK1041367A1 (en) 2000-02-09 2002-07-05 Nippon Leiz Corporation light source
JP2001223388A (ja) * 2000-02-09 2001-08-17 Nippon Leiz Co Ltd 光源装置
US7053419B1 (en) * 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP2002141556A (ja) 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP2002124705A (ja) * 2000-10-17 2002-04-26 Citizen Electronics Co Ltd 発光ダイオードとその製造方法
JP3972670B2 (ja) 2002-02-06 2007-09-05 豊田合成株式会社 発光装置
KR20040020240A (ko) * 2002-08-30 2004-03-09 엘지이노텍 주식회사 발광다이오드 램프 및 그 제조방법
JP2004158557A (ja) * 2002-11-05 2004-06-03 Shurai Kagi Kofun Yugenkoshi 類似フリップチップ型の発光ダイオード装置パッケージ
US7009213B2 (en) * 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
DE10351397A1 (de) * 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip
JP2005159296A (ja) * 2003-11-06 2005-06-16 Sharp Corp オプトデバイスのパッケージ構造
KR100576866B1 (ko) 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
JP3863169B2 (ja) * 2005-10-03 2006-12-27 東芝電子エンジニアリング株式会社 発光装置
JP3863174B2 (ja) * 2006-05-08 2006-12-27 東芝電子エンジニアリング株式会社 発光装置
TWI492411B (zh) * 2006-12-11 2015-07-11 美國加利福尼亞大學董事會 非極性與半極性發光裝置
KR20100077213A (ko) 2007-11-19 2010-07-07 파나소닉 주식회사 반도체 발광장치 및 반도체 발광장치의 제조방법
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
KR20100008620A (ko) * 2008-07-16 2010-01-26 삼성전기주식회사 발광 장치 및 이를 구비하는 백라이트 유닛
JP5326705B2 (ja) * 2009-03-17 2013-10-30 日亜化学工業株式会社 発光装置
JP5689225B2 (ja) * 2009-03-31 2015-03-25 日亜化学工業株式会社 発光装置
JP2010245481A (ja) * 2009-04-10 2010-10-28 Sharp Corp 発光装置
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
JP5572013B2 (ja) * 2010-06-16 2014-08-13 スタンレー電気株式会社 発光装置およびその製造方法
JP2012033823A (ja) * 2010-08-02 2012-02-16 Stanley Electric Co Ltd 発光装置およびその製造方法
JP5588368B2 (ja) * 2011-01-24 2014-09-10 スタンレー電気株式会社 発光装置およびその製造方法
JP5647028B2 (ja) * 2011-02-14 2014-12-24 スタンレー電気株式会社 発光装置およびその製造方法
JP5681532B2 (ja) * 2011-03-07 2015-03-11 スタンレー電気株式会社 発光装置およびその製造方法
JP5718117B2 (ja) * 2011-03-24 2015-05-13 スタンレー電気株式会社 発光装置及びその製造方法
JP2013038187A (ja) * 2011-08-05 2013-02-21 Stanley Electric Co Ltd 発光装置およびその製造方法
WO2013145071A1 (ja) * 2012-03-26 2013-10-03 富士機械製造株式会社 Ｌｅｄパッケージ及びその製造方法
JP6097489B2 (ja) * 2012-03-30 2017-03-15 古河電気工業株式会社 発光ダイオード用封止樹脂フィルムおよび発光ダイオードパッケージ
KR102221599B1 (ko) 2014-06-18 2021-03-02 엘지이노텍 주식회사 발광 소자 패키지
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
JP2015099940A (ja) * 2015-02-23 2015-05-28 日亜化学工業株式会社 発光装置
JP6758313B2 (ja) * 2015-03-20 2020-09-23 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． Ｕｖ−ｃ浄水装置
JP6274240B2 (ja) * 2016-03-28 2018-02-07 日亜化学工業株式会社 発光装置
DE102016106270A1 (de) * 2016-04-06 2017-10-12 Osram Opto Semiconductors Gmbh Herstellung eines halbleiterbauelements
JP6955135B2 (ja) 2016-10-19 2021-10-27 日亜化学工業株式会社 発光装置およびその製造方法
JP7032645B2 (ja) * 2018-03-26 2022-03-09 日亜化学工業株式会社 発光モジュール及びその製造方法
US12100788B2 (en) 2018-12-27 2024-09-24 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
KR102854327B1 (ko) 2018-12-27 2025-09-04 덴카 주식회사 형광체 기판, 발광 기판 및 조명 장치
WO2020137762A1 (ja) * 2018-12-27 2020-07-02 デンカ株式会社 蛍光体基板、発光基板及び照明装置
EP3905345B1 (en) 2018-12-27 2024-01-24 Denka Company Limited Light-emitting substrate, and lighting device

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Publication number Publication date
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