JP3989631B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP3989631B2
JP3989631B2 JP24606598A JP24606598A JP3989631B2 JP 3989631 B2 JP3989631 B2 JP 3989631B2 JP 24606598 A JP24606598 A JP 24606598A JP 24606598 A JP24606598 A JP 24606598A JP 3989631 B2 JP3989631 B2 JP 3989631B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
substrate
terminal
electrode
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP24606598A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000077459A5 (https=
JP2000077459A (ja
Inventor
慎 栗原
宏之 藤田
努 松平
聡 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP24606598A priority Critical patent/JP3989631B2/ja
Publication of JP2000077459A publication Critical patent/JP2000077459A/ja
Publication of JP2000077459A5 publication Critical patent/JP2000077459A5/ja
Application granted granted Critical
Publication of JP3989631B2 publication Critical patent/JP3989631B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
JP24606598A 1998-08-31 1998-08-31 半導体装置 Expired - Lifetime JP3989631B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24606598A JP3989631B2 (ja) 1998-08-31 1998-08-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24606598A JP3989631B2 (ja) 1998-08-31 1998-08-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2000077459A JP2000077459A (ja) 2000-03-14
JP2000077459A5 JP2000077459A5 (https=) 2005-10-27
JP3989631B2 true JP3989631B2 (ja) 2007-10-10

Family

ID=17142952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24606598A Expired - Lifetime JP3989631B2 (ja) 1998-08-31 1998-08-31 半導体装置

Country Status (1)

Country Link
JP (1) JP3989631B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230326633A1 (en) * 2022-04-08 2023-10-12 Cyntec Co., Ltd. Structure of resistor device and system for measuring resistance of same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005353757A (ja) * 2004-06-09 2005-12-22 Toshiba Matsushita Display Technology Co Ltd 半導体装置及び接続抵抗測定方法
JP2008158461A (ja) * 2006-12-26 2008-07-10 Optrex Corp 光学表示装置
JP5699585B2 (ja) * 2010-12-20 2015-04-15 日亜化学工業株式会社 半導体素子用実装基板及びその実装基板を用いた半導体発光装置並びに半導体発光装置の製造方法
KR102297284B1 (ko) * 2014-06-23 2021-09-02 삼성전기주식회사 회로 기판 및 회로 기판을 이용한 전자 부품의 배치 상태 검사 방법
JP6594246B2 (ja) 2016-03-31 2019-10-23 株式会社ジャパンディスプレイ 表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230326633A1 (en) * 2022-04-08 2023-10-12 Cyntec Co., Ltd. Structure of resistor device and system for measuring resistance of same
US12068092B2 (en) * 2022-04-08 2024-08-20 Cyntec Co., Ltd. Structure of resistor device and system for measuring resistance of same

Also Published As

Publication number Publication date
JP2000077459A (ja) 2000-03-14

Similar Documents

Publication Publication Date Title
JP7177594B2 (ja) チップオンフィルムパッケージ、表示パネル、及び表示装置
TWI541514B (zh) Power element with probe card
US20020050832A1 (en) Probe contact system having planarity adjustment mechanism
US9807872B2 (en) Circuit board and display device
JPH07109840B2 (ja) 半導体ｉｃの試験装置及び試験方法
JP2023089310A (ja) 検査用プローブ、及び検査装置
CN112825231B (zh) 显示装置和显示装置的检测方法
CN103219322A (zh) 具有电阻测量结构的三维集成电路及其使用方法
US10041989B2 (en) Circuit board with inspection terminals
JP2011197377A (ja) 表示装置及び表示装置の接続状況検査方法
JP3989631B2 (ja) 半導体装置
JP2004184839A (ja) 表示装置
JPH11202353A (ja) 液晶表示装置
JP3133938B2 (ja) 半導体素子の電気光学特性測定装置
KR102090578B1 (ko) 전자 장치의 기판, 이를 포함하는 전자 장치 및 접속부의 저항 측정 방법
CN101346632B (zh) 探针卡
JP5797805B2 (ja) 表示装置
JP3614050B2 (ja) 導体パターンの検査方法及び電気光学装置
US9535108B2 (en) Inspection apparatus and inspection method
JPH07152043A (ja) 液晶表示パネル及び該パネルへの実装方法
JP2004259750A (ja) 配線基板、接続配線基板及びその検査方法、電子装置及びその製造方法、電子モジュール並びに電子機器
JP2001135679A (ja) 半導体装置の接合構造およびその検査方法
JP4732642B2 (ja) 半導体装置
JP7493952B2 (ja) 配線回路基板
JP2948802B2 (ja) 電気接続用部材

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20040302

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050725

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050725

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070112

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070319

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070424

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070625

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070717

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070718

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100727

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20091108

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100727

Year of fee payment: 3

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D03

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110727

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110727

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120727

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130727

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term