JP3989049B2 - 樹脂封止装置 - Google Patents

樹脂封止装置 Download PDF

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Publication number
JP3989049B2
JP3989049B2 JP10434997A JP10434997A JP3989049B2 JP 3989049 B2 JP3989049 B2 JP 3989049B2 JP 10434997 A JP10434997 A JP 10434997A JP 10434997 A JP10434997 A JP 10434997A JP 3989049 B2 JP3989049 B2 JP 3989049B2
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JP
Japan
Prior art keywords
unit
press
resin
press unit
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP10434997A
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English (en)
Japanese (ja)
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JPH10230536A5 (enExample
JPH10230536A (ja
Inventor
一彦 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP10434997A priority Critical patent/JP3989049B2/ja
Priority to TW086111539A priority patent/TW410194B/zh
Priority to MYPI97003717A priority patent/MY119447A/en
Priority to EP97306222A priority patent/EP0825006B1/en
Priority to US08/912,611 priority patent/US6050802A/en
Priority to CN97117725A priority patent/CN1106922C/zh
Priority to KR1019970039569A priority patent/KR100257957B1/ko
Publication of JPH10230536A publication Critical patent/JPH10230536A/ja
Publication of JPH10230536A5 publication Critical patent/JPH10230536A5/ja
Application granted granted Critical
Publication of JP3989049B2 publication Critical patent/JP3989049B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10434997A 1996-08-20 1997-04-22 樹脂封止装置 Expired - Lifetime JP3989049B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP10434997A JP3989049B2 (ja) 1996-12-19 1997-04-22 樹脂封止装置
TW086111539A TW410194B (en) 1996-08-20 1997-08-12 Resin molding machine
MYPI97003717A MY119447A (en) 1996-08-20 1997-08-14 Resin molding machine
EP97306222A EP0825006B1 (en) 1996-08-20 1997-08-15 Resin molding machine
US08/912,611 US6050802A (en) 1996-08-20 1997-08-18 Resin molding machine
CN97117725A CN1106922C (zh) 1996-08-20 1997-08-20 树脂模制机
KR1019970039569A KR100257957B1 (ko) 1996-08-20 1997-08-20 수지 성형 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8-339371 1996-12-19
JP33937196 1996-12-19
JP10434997A JP3989049B2 (ja) 1996-12-19 1997-04-22 樹脂封止装置

Publications (3)

Publication Number Publication Date
JPH10230536A JPH10230536A (ja) 1998-09-02
JPH10230536A5 JPH10230536A5 (enExample) 2005-03-17
JP3989049B2 true JP3989049B2 (ja) 2007-10-10

Family

ID=26444851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10434997A Expired - Lifetime JP3989049B2 (ja) 1996-08-20 1997-04-22 樹脂封止装置

Country Status (1)

Country Link
JP (1) JP3989049B2 (enExample)

Also Published As

Publication number Publication date
JPH10230536A (ja) 1998-09-02

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