JP3981076B2 - 薄いシリコンカーバイドエピタキシャル層の接触方法及びこの方法により形成された半導体素子 - Google Patents
薄いシリコンカーバイドエピタキシャル層の接触方法及びこの方法により形成された半導体素子 Download PDFInfo
- Publication number
- JP3981076B2 JP3981076B2 JP2003527802A JP2003527802A JP3981076B2 JP 3981076 B2 JP3981076 B2 JP 3981076B2 JP 2003527802 A JP2003527802 A JP 2003527802A JP 2003527802 A JP2003527802 A JP 2003527802A JP 3981076 B2 JP3981076 B2 JP 3981076B2
- Authority
- JP
- Japan
- Prior art keywords
- compound semiconductor
- layer
- active layer
- contact
- semiconductor material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 77
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 46
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 35
- 239000002019 doping agent Substances 0.000 claims description 19
- 239000011810 insulating material Substances 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 14
- 230000008901 benefit Effects 0.000 description 10
- 238000000137 annealing Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/0485—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1004—Base region of bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
この出願は、2001年1月22日に申請された米国特許出願第09/767,092号の利益を主張するものである。
(発明の分野)
(関連技術の説明)
以下に詳述する実施の形態のプロセスにより、上記の問題は解消し、微小接触を生成できるため現代の小型素子と適合できる。詳述する実施の形態の他の利点は、低温プロセスのためプロセス中に生成された絶縁層が保存されることである。最後に、詳述する実施の形態は、層を通る電気的短絡を生じさせることなく薄いシリコンカーバイド層と使用できる。
図中の要素は簡単かつ明瞭のために図示しており、必ずしも縮尺で描いていない。例えば、図中の要素の幾つかの寸法は,本発明の実施の形態の理解を助けるため他の要素に対して誇張して示す。
以下、シリコンカーバイド層のスパイク現象の発生を減少させ、金属接点と薄いシリコンカーバイド層との間の電気的接続を製造するプロセスを詳述する。接触プロセスは平面多層シリコンカーバイド素子の製造の脈絡において述べるが、任意の適用可能な金属とシリコンカーバイド層との間の接続の形成に使用できる。
SiC層50の所望のドーパント濃度は、1立方cm当り約1E19〜1E20原子である。ドーパントは、同時に共スパッタリング、DCスパッタリングにより、或いは気体の存在下でのスパッタリングにより組み入れる。例えば、アルミニウムは、アルミニウムターゲットから同時に共スパッタリング、DCスパッタリングにより、或いは気体状トリメチルアルミニウム(Al(CH3)3)の存在下でのスパッタリングにより組み入れる。アルミニウムは、約10〜50WのDC電力でスパッタリングされ得る。それに代わるp型ドーパントはホウ素であり、気体状ジボラン(B2H6)として添加され得る。或いは、ドーパントは、SiCターゲットを混ぜて合金にし得る。
Claims (14)
- 第1の化合物半導体材料を含み第1の導電型ドーパントを有する第1の化合物半導体層を形成する工程、
第2の化合物半導体材料を含み前記第1の導電型と反対の第2の導電型ドーパントを有する第2の化合物半導体層を前記第1の化合物半導体層上に形成する工程、
第3の化合物半導体材料を含み前記第1の導電型ドーパントを有する第3の化合物半導体層を前記第2の化合物半導体層上に形成する工程であって、前記第1、第2及び第3の化合物半導体層をそれぞれトランジスタ素子の第1、第2及び第3の活性層とする工程、
前記第3の活性層をパターン化して壁を有する開口を前記第3の活性層に形成し前記第2の活性層の一部を露出する工程、
前記第2の導電型ドーパントを有し前記第2の化合物半導体層のドーパント濃度より高いドーパント濃度を有する第4の化合物半導体材料を前記露出させた第2の活性層の少なくとも一部上に形成する工程、
前記第3の活性層と前記第4の化合物半導体材料との上に平面絶縁材料層を堆積して接点用開口を有するように前記平面絶縁材料層をパターン化する工程、及び
前記第3の活性層と前記第2の活性層とに対する接点の上面を同一平面とするために、前記平面絶縁材料層の表面から前記第3の活性層までの前記平面絶縁材料層の前記開口と、前記平面絶縁材料層の表面から前記第4の化合物半導体材料を通って下の前記第2の活性層までの前記平面絶縁材料層の前記開口とに前記接点を形成する工程を含むことを特徴とする、半導体素子用接点の形成方法。 - 前記第4の化合物半導体材料はスパッタリングにより形成することを特徴とする請求項1記載の接点の形成方法。
- 前記第1、第2、第3及び第4の化合物半導体材料の各々は少なくとも2種のIVA族元素を含むことを特徴とする請求項1記載の接点の形成方法。
- 前記第1、第2、第3及び第4の化合物半導体材料の各々はシリコンカーバイドを含むことを特徴とする請求項1記載の接点の形成方法。
- 前記第3の化合物半導体層上に第1タイプの金属の第1の金属接点を形成して前記第4の化合物半導体材料上に第2タイプの金属の第2の金属接点を形成することを更に含むことを特徴とする請求項1記載の接点の形成方法。
- 前記第3の化合物半導体材料と前記第1の金属接点との間の電気的接続はオーミックであり、前記第4の化合物半導体材料と前記第2の金属接点との間の電気的接続はオーミックであることを特徴とする請求項5記載の接点の形成方法。
- 前記第1の金属接点はアルミニウムからなり、前記第2の金属接点はニッケルからなることを特徴とする請求項5記載の接点の形成方法。
- 第1の化合物半導体材を含み第1の導電型ドーパントを有する第1の活性層、
第2の化合物半導体材を含み前記第1の導電型と反対の第2の導電型ドーパントを有する第2の活性層であって、前記第1の活性層と接触する前記第2の活性層、
第3の化合物半導体材を含み前記第1の導電型を有する第3の活性層であって、前記第2の活性層と接触する前記第3の活性層、ここで前記第1と第2と第3の活性層を組合せたものがトランジスタの少なくとも一部であり、
前記第2と第3の活性層によって形成された開口であって、前記第3の活性層を通って延長して前記第2の活性層内に接触して終端する前記開口、
前記開口を隣接した前記第3の活性層から絶縁する前記開口内の1つ以上の側壁絶縁層、
前記開口内と前記第2の活性層上とに少なくとも部分的にある第4の化合物半導体材であって、前記第2の導電型ドーパントと前記第2の活性層のドーパント濃度より高ドーパント濃度とを有し、前記第2の活性層に電気的に接続される前記第4の化合物半導体材、及び
前記第3の活性層と前記第4の化合物半導体材との上にあり、第1及び第2の金属接点を含む平面絶縁材料層であって、前記接点が前記絶縁材料層により互いに分離され、前記第1の金属接点が前記第3の活性層と電気的に接触し、前記第2の金属接点が前記第4の化合物半導体材と電気的に接触し、前記金属接点と前記平面絶縁材料層との上面が同一平面内にある前記平面絶縁材料層を含むことを特徴とする半導体素子。 - 前記第1、第2、第3及び第4の化合物半導体材の各々は少なくとも2種のIVA族元素を含むことを特徴とする請求項8記載の半導体素子。
- 前記第1、第2、第3及び第4の化合物半導体材の各々はシリコンカーバイドを含むことを特徴とする請求項8記載の半導体素子。
- 前記第3の活性層と前記第4の化合物半導体材にそれぞれ対する第3と第4の電気接点を更に含むことを特徴とする請求項8記載の半導体素子。
- 前記第3と第4の電気接点はそれぞれアルミニウムとニッケルからなり、前記電気接点はオーミックであることを特徴とする請求項11記載の半導体素子。
- 前記第3の活性層の表面上に第2の絶縁層を更に含むことを特徴とする請求項12記載の半導体素子。
- 前記第2の活性層は約0.1〜2ミクロンの厚さを有することを特徴とする請求項8記載の半導体素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/682,151 US7132701B1 (en) | 2001-07-27 | 2001-07-27 | Contact method for thin silicon carbide epitaxial layer and semiconductor devices formed by those methods |
PCT/US2002/023662 WO2003023860A1 (en) | 2001-07-27 | 2002-07-25 | Contact method for thin silicon carbide epitaxial layer and semiconductor devices formed by those methods |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005529478A JP2005529478A (ja) | 2005-09-29 |
JP3981076B2 true JP3981076B2 (ja) | 2007-09-26 |
Family
ID=24738448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003527802A Expired - Fee Related JP3981076B2 (ja) | 2001-07-27 | 2002-07-25 | 薄いシリコンカーバイドエピタキシャル層の接触方法及びこの方法により形成された半導体素子 |
Country Status (4)
Country | Link |
---|---|
US (3) | US7132701B1 (ja) |
EP (1) | EP1412985B1 (ja) |
JP (1) | JP3981076B2 (ja) |
WO (1) | WO2003023860A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6955978B1 (en) * | 2001-12-20 | 2005-10-18 | Fairchild Semiconductor Corporation | Uniform contact |
US6815304B2 (en) * | 2002-02-22 | 2004-11-09 | Semisouth Laboratories, Llc | Silicon carbide bipolar junction transistor with overgrown base region |
JP2004247545A (ja) * | 2003-02-14 | 2004-09-02 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
US7199442B2 (en) * | 2004-07-15 | 2007-04-03 | Fairchild Semiconductor Corporation | Schottky diode structure to reduce capacitance and switching losses and method of making same |
US7304334B2 (en) * | 2005-09-16 | 2007-12-04 | Cree, Inc. | Silicon carbide bipolar junction transistors having epitaxial base regions and multilayer emitters and methods of fabricating the same |
US7345310B2 (en) * | 2005-12-22 | 2008-03-18 | Cree, Inc. | Silicon carbide bipolar junction transistors having a silicon carbide passivation layer on the base region thereof |
JP5696543B2 (ja) * | 2011-03-17 | 2015-04-08 | セイコーエプソン株式会社 | 半導体基板の製造方法 |
TWI506815B (zh) * | 2012-04-05 | 2015-11-01 | Formosa Epitaxy Inc | Method and structure of increasing the concentration of epitaxial layer |
JP2014003252A (ja) * | 2012-06-21 | 2014-01-09 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置およびその製造方法 |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4915646B1 (ja) * | 1969-04-02 | 1974-04-16 | ||
US3866310A (en) * | 1973-09-07 | 1975-02-18 | Westinghouse Electric Corp | Method for making the self-aligned gate contact of a semiconductor device |
US4296391A (en) | 1977-10-28 | 1981-10-20 | Hitachi, Ltd. | Surface-acoustic-wave filter for channel selection system of television receiver |
US4196228A (en) * | 1978-06-10 | 1980-04-01 | Monolithic Memories, Inc. | Fabrication of high resistivity semiconductor resistors by ion implanatation |
US5296391A (en) | 1982-03-24 | 1994-03-22 | Nec Corporation | Method of manufacturing a bipolar transistor having thin base region |
JPH0744182B2 (ja) * | 1984-11-09 | 1995-05-15 | 株式会社日立製作所 | ヘテロ接合バイポ−ラ・トランジスタ |
JPS61137367A (ja) * | 1984-12-10 | 1986-06-25 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JPS636875A (ja) | 1986-06-27 | 1988-01-12 | Hitachi Ltd | 半導体装置 |
JPS63142867A (ja) * | 1986-12-05 | 1988-06-15 | Nec Corp | Misトランジスタ及びその製造方法 |
US4949162A (en) * | 1987-06-05 | 1990-08-14 | Hitachi, Ltd. | Semiconductor integrated circuit with dummy pedestals |
US4945394A (en) | 1987-10-26 | 1990-07-31 | North Carolina State University | Bipolar junction transistor on silicon carbide |
FR2625613B1 (ja) * | 1987-12-30 | 1990-05-04 | Labo Electronique Physique | |
US5040041A (en) * | 1988-10-20 | 1991-08-13 | Canon Kabushiki Kaisha | Semiconductor device and signal processing device having said device provided therein |
JPH05291277A (ja) | 1992-04-08 | 1993-11-05 | Sumitomo Electric Ind Ltd | 半導体装置及びその製造方法 |
EP0562549B1 (en) * | 1992-03-24 | 1998-07-01 | Sumitomo Electric Industries, Ltd. | Heterojunction bipolar transistor containing silicon carbide |
US5323022A (en) | 1992-09-10 | 1994-06-21 | North Carolina State University | Platinum ohmic contact to p-type silicon carbide |
US5366906A (en) * | 1992-10-16 | 1994-11-22 | Martin Marietta Corporation | Wafer level integration and testing |
US5396087A (en) * | 1992-12-14 | 1995-03-07 | North Carolina State University | Insulated gate bipolar transistor with reduced susceptibility to parasitic latch-up |
JP2771423B2 (ja) * | 1993-05-20 | 1998-07-02 | 日本電気株式会社 | バイポーラトランジスタ |
JP3584481B2 (ja) | 1993-09-21 | 2004-11-04 | ソニー株式会社 | オーミック電極の形成方法およびオーミック電極形成用積層体 |
US5442200A (en) | 1994-06-03 | 1995-08-15 | Advanced Technology Materials, Inc. | Low resistance, stable ohmic contacts to silcon carbide, and method of making the same |
JP2606141B2 (ja) * | 1994-06-16 | 1997-04-30 | 日本電気株式会社 | 半導体装置およびその製造方法 |
JPH0831841A (ja) * | 1994-07-12 | 1996-02-02 | Sony Corp | 半導体装置及びその製造方法 |
US5465006A (en) * | 1994-07-15 | 1995-11-07 | Hewlett-Packard Company | Bipolar stripe transistor structure |
JPH08115921A (ja) * | 1994-10-17 | 1996-05-07 | Mitsubishi Electric Corp | ヘテロ接合バイポーラトランジスタ,及びその製造方法 |
US5670803A (en) * | 1995-02-08 | 1997-09-23 | International Business Machines Corporation | Three-dimensional SRAM trench structure and fabrication method therefor |
JP3575110B2 (ja) * | 1995-06-06 | 2004-10-13 | 株式会社デンソー | 車両用交流発電機 |
US5939738A (en) * | 1995-10-25 | 1999-08-17 | Texas Instruments Incorporated | Low base-resistance bipolar transistor |
US5736863A (en) * | 1996-06-19 | 1998-04-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Abatement of electron beam charging distortion during dimensional measurements of integrated circuit patterns with scanning electron microscopy by the utilization of specially designed test structures |
JP3321553B2 (ja) * | 1997-10-08 | 2002-09-03 | 松下電器産業株式会社 | Bi−CMOS集積回路装置の製造方法 |
JPH11256325A (ja) | 1998-03-10 | 1999-09-21 | Okuma Engineering:Kk | 結晶性SiC薄膜の製造方法 |
JP2927768B1 (ja) | 1998-03-26 | 1999-07-28 | 技術研究組合オングストロームテクノロジ研究機構 | 半導体装置およびその製造方法 |
JP3628873B2 (ja) * | 1998-04-28 | 2005-03-16 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP3361061B2 (ja) | 1998-09-17 | 2003-01-07 | 株式会社東芝 | 半導体装置 |
KR100270965B1 (ko) * | 1998-11-07 | 2000-12-01 | 윤종용 | 고속 바이폴라 트랜지스터 및 그 제조방법 |
SE9900358D0 (sv) * | 1999-02-03 | 1999-02-03 | Ind Mikroelektronikcentrum Ab | A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor |
SE9901410D0 (sv) * | 1999-04-21 | 1999-04-21 | Abb Research Ltd | Abipolar transistor |
US6329675B2 (en) * | 1999-08-06 | 2001-12-11 | Cree, Inc. | Self-aligned bipolar junction silicon carbide transistors |
US6218254B1 (en) | 1999-09-22 | 2001-04-17 | Cree Research, Inc. | Method of fabricating a self-aligned bipolar junction transistor in silicon carbide and resulting devices |
US6982440B2 (en) * | 2002-02-19 | 2006-01-03 | Powersicel, Inc. | Silicon carbide semiconductor devices with a regrown contact layer |
-
2001
- 2001-07-27 US US09/682,151 patent/US7132701B1/en not_active Ceased
-
2002
- 2002-07-25 JP JP2003527802A patent/JP3981076B2/ja not_active Expired - Fee Related
- 2002-07-25 WO PCT/US2002/023662 patent/WO2003023860A1/en active Application Filing
- 2002-07-25 EP EP02752582A patent/EP1412985B1/en not_active Expired - Lifetime
-
2006
- 2006-11-06 US US11/556,967 patent/US7638820B2/en not_active Expired - Fee Related
-
2008
- 2008-11-07 US US12/266,739 patent/USRE42423E1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20070117366A1 (en) | 2007-05-24 |
WO2003023860A1 (en) | 2003-03-20 |
EP1412985B1 (en) | 2013-02-27 |
USRE42423E1 (en) | 2011-06-07 |
US7638820B2 (en) | 2009-12-29 |
EP1412985A1 (en) | 2004-04-28 |
JP2005529478A (ja) | 2005-09-29 |
EP1412985A4 (en) | 2008-11-26 |
US7132701B1 (en) | 2006-11-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7638820B2 (en) | Contact method for thin silicon carbide epitaxial layer and semiconductor devices formed by those methods | |
JPH08186085A (ja) | 半導体装置の製造方法 | |
KR19980041734A (ko) | 반도체 장치 및 그 제조방법 | |
US4590666A (en) | Method for producing a bipolar transistor having a reduced base region | |
US4561168A (en) | Method of making shadow isolated metal DMOS FET device | |
CN108417617B (zh) | 碳化硅沟槽型MOSFETs及其制备方法 | |
US5897359A (en) | Method of manufacturing a silicon/silicon germanium heterojunction bipolar transistor | |
US20080108190A1 (en) | SiC MOSFETs and self-aligned fabrication methods thereof | |
CN108336152A (zh) | 具有浮动结的沟槽型碳化硅sbd器件及其制造方法 | |
US6498108B2 (en) | Method for removing surface contamination on semiconductor substrates | |
KR100401036B1 (ko) | 에스오아이상에서자기정렬된수직바이폴라트랜지스터제조방법 | |
JP4308674B2 (ja) | 半導体装置の製造方法 | |
CN116741640A (zh) | 半导体结构的制作方法和半导体结构 | |
CN105990229B (zh) | 半导体器件及其制造工艺 | |
US7312150B2 (en) | Method of forming cobalt disilicide layer and method of manufacturing semiconductor device using the same | |
US20050139862A1 (en) | Self-aligned heterojunction bipolar transistor and manufacturing method thereof | |
JPH11354465A (ja) | 半導体装置 | |
KR100400078B1 (ko) | 이종접합 쌍극자 트랜지스터의 제조방법 | |
CN113725077B (zh) | 肖特基势垒器件及其形成方法 | |
KR102008460B1 (ko) | 초정렬 바이폴라 트랜지스터의 제조방법 | |
CN113517348A (zh) | 一种直接带隙GeSn增强型nMOS器件及其制备方法 | |
CN114122122A (zh) | 一种沟槽型半导体器件及其制造方法 | |
JP3189722B2 (ja) | 半導体集積回路装置及びその製造方法 | |
JP2005277108A (ja) | 炭化珪素半導体装置の製造方法 | |
CN117878161A (zh) | 氮化镓异质结功率二极管及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060525 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060531 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20060831 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20060907 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061101 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070227 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070508 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070605 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070628 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 3981076 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100706 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110706 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120706 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130706 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |