SE9900358D0 - A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor - Google Patents

A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor

Info

Publication number
SE9900358D0
SE9900358D0 SE9900358A SE9900358A SE9900358D0 SE 9900358 D0 SE9900358 D0 SE 9900358D0 SE 9900358 A SE9900358 A SE 9900358A SE 9900358 A SE9900358 A SE 9900358A SE 9900358 D0 SE9900358 D0 SE 9900358D0
Authority
SE
Sweden
Prior art keywords
layer
transistor
region layer
sic
field effect
Prior art date
Application number
SE9900358A
Other languages
English (en)
Inventor
Christopher Harris
Andrei Konstantinov
Original Assignee
Ind Mikroelektronikcentrum Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Mikroelektronikcentrum Ab filed Critical Ind Mikroelektronikcentrum Ab
Priority to SE9900358A priority Critical patent/SE9900358D0/sv
Publication of SE9900358D0 publication Critical patent/SE9900358D0/sv
Priority to US09/247,469 priority patent/US6127695A/en
Priority to CNB008034044A priority patent/CN1146969C/zh
Priority to AU28382/00A priority patent/AU2838200A/en
Priority to DE60044776T priority patent/DE60044776D1/de
Priority to AT00906825T priority patent/ATE476752T1/de
Priority to JP2000597836A priority patent/JP5038556B2/ja
Priority to CA2361752A priority patent/CA2361752C/en
Priority to EP00906825A priority patent/EP1163696B1/en
Priority to PCT/SE2000/000192 priority patent/WO2000046850A1/en
Priority to KR1020017009812A priority patent/KR100629020B1/ko
Priority to HK02104058.9A priority patent/HK1042378B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/1608—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
    • H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7838—Field effect transistors with field effect produced by an insulated gate without inversion channel, e.g. buried channel lateral MISFETs, normally-on lateral MISFETs, depletion-mode lateral MISFETs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/931—Silicon carbide semiconductor
SE9900358A 1999-02-03 1999-02-03 A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor SE9900358D0 (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE9900358A SE9900358D0 (sv) 1999-02-03 1999-02-03 A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor
US09/247,469 US6127695A (en) 1999-02-03 1999-02-08 Lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor
KR1020017009812A KR100629020B1 (ko) 1999-02-03 2000-02-01 ＳｉＣ 측면 전계효과 트랜지스터, 그 제조 방법 및 상기 트랜지스터의 사용 방법
DE60044776T DE60044776D1 (de) 1999-02-03 2000-02-01 LATERALER SiC-BASIERTER FELDEFFEKTTRANSITOR, DESSEN HERSTELLUNGSVERFAHREN UND DER GEBRAUCH EINES SOLCHEN TRANSISTORS
AU28382/00A AU2838200A (en) 1999-02-03 2000-02-01 A lateral field effect transistor of sic, a method for production thereof and a use of such a transistor
CNB008034044A CN1146969C (zh) 1999-02-03 2000-02-01 碳化硅横向场效应晶体管和制造方法及其使用
AT00906825T ATE476752T1 (de) 1999-02-03 2000-02-01 Lateraler sic-basierter feldeffekttransitor, dessen herstellungsverfahren und der gebrauch eines solchen transistors
JP2000597836A JP5038556B2 (ja) 1999-02-03 2000-02-01 ＳｉＣのラテラル電界効果トランジスタ、その製造方法、およびかかるトランジスタの使用
CA2361752A CA2361752C (en) 1999-02-03 2000-02-01 A lateral field effect transistor of sic, a method for production thereof and a use of such a transistor
EP00906825A EP1163696B1 (en) 1999-02-03 2000-02-01 A LATERAL FIELD EFFECT TRANSISTOR OF SiC, A METHOD FOR PRODUCTION THEREOF AND A USE OF SUCH A TRANSISTOR
PCT/SE2000/000192 WO2000046850A1 (en) 1999-02-03 2000-02-01 A LATERAL FIELD EFFECT TRANSISTOR OF SiC, A METHOD FOR PRODUCTION THEREOF AND A USE OF SUCH A TRANSISTOR
HK02104058.9A HK1042378B (zh) 1999-02-03 2002-05-31 碳化硅橫向場效應晶體管和製造方法及其使用

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9900358A SE9900358D0 (sv) 1999-02-03 1999-02-03 A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor
US09/247,469 US6127695A (en) 1999-02-03 1999-02-08 Lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor

Publications (1)

Publication Number Publication Date
SE9900358D0 true SE9900358D0 (sv) 1999-02-03

Family

ID=26663492

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9900358A SE9900358D0 (sv) 1999-02-03 1999-02-03 A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor

Country Status (4)

Country Link
US (1) US6127695A (sv)
AU (1) AU2838200A (sv)
SE (1) SE9900358D0 (sv)
WO (1) WO2000046850A1 (sv)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196580A (ja) * 2000-01-12 2001-07-19 Kmt Semiconductor Ltd 電界効果トランジスタの製造方法
US6563150B1 (en) * 2000-07-25 2003-05-13 Alison Schary High frequency field effect transistor
JP4526179B2 (ja) * 2000-11-21 2010-08-18 三菱電機株式会社 半導体装置
US7132701B1 (en) * 2001-07-27 2006-11-07 Fairchild Semiconductor Corporation Contact method for thin silicon carbide epitaxial layer and semiconductor devices formed by those methods
US6620697B1 (en) * 2001-09-24 2003-09-16 Koninklijke Philips Electronics N.V. Silicon carbide lateral metal-oxide semiconductor field-effect transistor having a self-aligned drift region and method for forming the same
US6982440B2 (en) 2002-02-19 2006-01-03 Powersicel, Inc. Silicon carbide semiconductor devices with a regrown contact layer
US6764907B2 (en) * 2002-02-19 2004-07-20 Bart J. Van Zeghbroeck Method of fabricating self-aligned silicon carbide semiconductor devices
JP2004128037A (ja) * 2002-09-30 2004-04-22 Trecenti Technologies Inc 半導体装置の製造方法
US6940110B2 (en) * 2002-11-29 2005-09-06 Matsushita Electric Industrial Co., Ltd. SiC-MISFET and method for fabricating the same
ATE536633T1 (de) * 2003-09-05 2011-12-15 Cree Sweden Ab Verfahren und einrichtung
US7834396B2 (en) * 2004-09-01 2010-11-16 Cree Sweden Ab Lateral field effect transistor and its fabrication comprising a spacer layer above and below the channel layer
JP5052025B2 (ja) * 2006-03-29 2012-10-17 株式会社東芝 電力用半導体素子
US7683400B1 (en) 2006-06-26 2010-03-23 Northrop Grumman Systems Corporation Semiconductor heterojunction devices based on SiC
US7629616B2 (en) 2007-02-28 2009-12-08 Cree, Inc. Silicon carbide self-aligned epitaxial MOSFET for high powered device applications
US9917419B2 (en) * 2016-06-26 2018-03-13 Vi Systems Gmbh Low capacitance optoelectronic device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374843A (en) * 1991-05-06 1994-12-20 Silinconix, Inc. Lightly-doped drain MOSFET with improved breakdown characteristics
US5270554A (en) * 1991-06-14 1993-12-14 Cree Research, Inc. High power high frequency metal-semiconductor field-effect transistor formed in silicon carbide
US5612260A (en) * 1992-06-05 1997-03-18 Cree Research, Inc. Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures
US5925895A (en) * 1993-10-18 1999-07-20 Northrop Grumman Corporation Silicon carbide power MESFET with surface effect supressive layer
EP0676814B1 (en) * 1994-04-06 2006-03-22 Denso Corporation Process of producing trench semiconductor device
US5686737A (en) * 1994-09-16 1997-11-11 Cree Research, Inc. Self-aligned field-effect transistor for high frequency applications
US5734180A (en) * 1995-06-02 1998-03-31 Texas Instruments Incorporated High-performance high-voltage device structures
US5627385A (en) * 1995-08-28 1997-05-06 Motorola, Inc. Lateral silicon carbide transistor
US5569937A (en) * 1995-08-28 1996-10-29 Motorola High breakdown voltage silicon carbide transistor
SE9601178D0 (sv) * 1996-03-27 1996-03-27 Abb Research Ltd A field controlled semiconductor device of SiC and a method for production thereof
US5909039A (en) * 1996-04-24 1999-06-01 Abb Research Ltd. Insulated gate bipolar transistor having a trench
US5780878A (en) * 1996-07-29 1998-07-14 Motorola, Inc. Lateral gate, vertical drift region transistor
US5859939A (en) * 1997-02-25 1999-01-12 Mci Communications Corporation Method and system for equalizing PMD using incremental delay switching
US6150680A (en) * 1998-03-05 2000-11-21 Welch Allyn, Inc. Field effect semiconductor device having dipole barrier

Also Published As

Publication number Publication date
AU2838200A (en) 2000-08-25
US6127695A (en) 2000-10-03
WO2000046850A1 (en) 2000-08-10

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