JP3958080B2 - プラズマ処理装置内の被洗浄部材の洗浄方法 - Google Patents

プラズマ処理装置内の被洗浄部材の洗浄方法 Download PDF

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Publication number
JP3958080B2
JP3958080B2 JP2002073957A JP2002073957A JP3958080B2 JP 3958080 B2 JP3958080 B2 JP 3958080B2 JP 2002073957 A JP2002073957 A JP 2002073957A JP 2002073957 A JP2002073957 A JP 2002073957A JP 3958080 B2 JP3958080 B2 JP 3958080B2
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Japan
Prior art keywords
cleaning
cleaned
plasma processing
processing apparatus
physical
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Expired - Lifetime
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JP2002073957A
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Japanese (ja)
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JP2003273078A (ja
JP2003273078A5 (https=
Inventor
均 高瀬
将之 長山
康至 三橋
博之 中山
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2002073957A priority Critical patent/JP3958080B2/ja
Priority to US10/385,571 priority patent/US6790289B2/en
Priority to CN03119377.3A priority patent/CN100533673C/zh
Publication of JP2003273078A publication Critical patent/JP2003273078A/ja
Priority to US10/854,181 priority patent/US20040216769A1/en
Publication of JP2003273078A5 publication Critical patent/JP2003273078A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2002073957A 2002-03-18 2002-03-18 プラズマ処理装置内の被洗浄部材の洗浄方法 Expired - Lifetime JP3958080B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002073957A JP3958080B2 (ja) 2002-03-18 2002-03-18 プラズマ処理装置内の被洗浄部材の洗浄方法
US10/385,571 US6790289B2 (en) 2002-03-18 2003-03-12 Method of cleaning a plasma processing apparatus
CN03119377.3A CN100533673C (zh) 2002-03-18 2003-03-14 清洗等离子加工装置的方法
US10/854,181 US20040216769A1 (en) 2002-03-18 2004-05-27 Method of cleaning a plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002073957A JP3958080B2 (ja) 2002-03-18 2002-03-18 プラズマ処理装置内の被洗浄部材の洗浄方法

Publications (3)

Publication Number Publication Date
JP2003273078A JP2003273078A (ja) 2003-09-26
JP2003273078A5 JP2003273078A5 (https=) 2005-09-08
JP3958080B2 true JP3958080B2 (ja) 2007-08-15

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JP2002073957A Expired - Lifetime JP3958080B2 (ja) 2002-03-18 2002-03-18 プラズマ処理装置内の被洗浄部材の洗浄方法

Country Status (3)

Country Link
US (2) US6790289B2 (https=)
JP (1) JP3958080B2 (https=)
CN (1) CN100533673C (https=)

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US7544254B2 (en) * 2006-12-14 2009-06-09 Varian Semiconductor Equipment Associates, Inc. System and method for cleaning an ion implanter
US7767028B2 (en) 2007-03-14 2010-08-03 Lam Research Corporation Cleaning hardware kit for composite showerhead electrode assemblies for plasma processing apparatuses
US7578889B2 (en) * 2007-03-30 2009-08-25 Lam Research Corporation Methodology for cleaning of surface metal contamination from electrode assemblies
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US8221552B2 (en) * 2007-03-30 2012-07-17 Lam Research Corporation Cleaning of bonded silicon electrodes
JP2010529670A (ja) * 2007-06-07 2010-08-26 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 半導体適用のための非可燃性溶媒
KR100883205B1 (ko) 2007-09-28 2009-02-20 (주)코리아스타텍 패턴 공정의 모재 지지용 지그 세정방법과 그 세정장치
JP2009255277A (ja) * 2008-03-19 2009-11-05 Tokyo Electron Ltd 表面処理方法、シャワーヘッド部、処理容器及びこれらを用いた処理装置
JP5249639B2 (ja) * 2008-06-09 2013-07-31 日本発條株式会社 ヘッドサスペンションの再生方法及び製造方法、並びにワークの再生方法
JP4829937B2 (ja) 2008-07-28 2011-12-07 東京エレクトロン株式会社 半導体製造装置のパーツに付着した堆積物またはパーティクルを除去する洗浄装置及び洗浄方法
DE102009044011A1 (de) 2009-09-15 2011-03-24 Paul Hettich Gmbh & Co. Kg Verfahren zum Herstellen einer beschichteten Auszugsführung
JP5896915B2 (ja) * 2009-12-18 2016-03-30 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ プラズマチャンバで使用される上方電極から表面金属汚染を洗浄するための方法
WO2012082902A1 (en) * 2010-12-15 2012-06-21 Sulzer Metco (Us), Inc. Pressure based liquid feed system for suspension plasma spray coatings
KR101436310B1 (ko) 2012-10-04 2014-09-02 주식회사 알지비하이텍 로봇아암 연결용 디퓨져 세정장치
US9387521B2 (en) * 2012-12-05 2016-07-12 Lam Research Corporation Method of wet cleaning aluminum chamber parts
KR20160057966A (ko) 2014-11-14 2016-05-24 가부시끼가이샤 도시바 처리 장치, 노즐 및 다이싱 장치
JP6545511B2 (ja) * 2015-04-10 2019-07-17 株式会社東芝 処理装置
US20180311707A1 (en) * 2017-05-01 2018-11-01 Lam Research Corporation In situ clean using high vapor pressure aerosols
JP6899252B2 (ja) * 2017-05-10 2021-07-07 株式会社ディスコ 加工方法
CN108081151B (zh) * 2017-12-04 2020-04-24 中国人民解放军陆军装甲兵学院 一种金属零件表面无损物理清洗方法
GB201720265D0 (en) * 2017-12-05 2018-01-17 Semblant Ltd Method and apparatus for cleaning a plasma processing apparatus
CN108573855B (zh) * 2018-04-08 2021-01-01 苏州珮凯科技有限公司 半导体8寸晶元薄膜制程的TD/DRM工艺的Al/Al2O3件的再生方法
CN108441925A (zh) * 2018-04-18 2018-08-24 北京理贝尔生物工程研究所有限公司 一种新型阳极氧化工艺预处理方法
DE102018109217A1 (de) * 2018-04-18 2019-10-24 Khs Corpoplast Gmbh Vorrichtung zum Beschichten von Hohlkörpern mit mindestens einer Beschichtungsstation
WO2020096091A1 (ko) * 2018-11-09 2020-05-14 주식회사 그리너지 리튬메탈 음극의 표면처리방법, 표면처리된 리튬메탈 음극 및 이를 포함하는 리튬금속전지
CN111298608B (zh) * 2020-03-03 2021-03-23 云南大学 一种用于等离子体降解VOCs装置的自清洁防火系统
CN114308798B (zh) * 2020-10-10 2023-03-31 中国科学院微电子研究所 一种清洗组件

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JP3876167B2 (ja) * 2002-02-13 2007-01-31 川崎マイクロエレクトロニクス株式会社 洗浄方法および半導体装置の製造方法

Also Published As

Publication number Publication date
CN100533673C (zh) 2009-08-26
US20040216769A1 (en) 2004-11-04
US6790289B2 (en) 2004-09-14
CN1445826A (zh) 2003-10-01
JP2003273078A (ja) 2003-09-26
US20030172952A1 (en) 2003-09-18

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