JP3939077B2 - 基板洗浄装置 - Google Patents

基板洗浄装置 Download PDF

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Publication number
JP3939077B2
JP3939077B2 JP2000160512A JP2000160512A JP3939077B2 JP 3939077 B2 JP3939077 B2 JP 3939077B2 JP 2000160512 A JP2000160512 A JP 2000160512A JP 2000160512 A JP2000160512 A JP 2000160512A JP 3939077 B2 JP3939077 B2 JP 3939077B2
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JP
Japan
Prior art keywords
substrate
cleaning
cleaning apparatus
gas
mixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000160512A
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English (en)
Japanese (ja)
Other versions
JP2001334181A (ja
JP2001334181A5 (enExample
Inventor
貞雄 平得
雅伸 佐藤
周一 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2000160512A priority Critical patent/JP3939077B2/ja
Priority to US09/976,134 priority patent/US6729561B2/en
Publication of JP2001334181A publication Critical patent/JP2001334181A/ja
Publication of JP2001334181A5 publication Critical patent/JP2001334181A5/ja
Application granted granted Critical
Publication of JP3939077B2 publication Critical patent/JP3939077B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0433—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of gas surrounded by an external conduit of liquid upstream the mixing chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S239/00—Fluid sprinkling, spraying, and diffusing
    • Y10S239/08—Cutter sprayer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Nozzles (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2000160512A 2000-05-30 2000-05-30 基板洗浄装置 Expired - Fee Related JP3939077B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000160512A JP3939077B2 (ja) 2000-05-30 2000-05-30 基板洗浄装置
US09/976,134 US6729561B2 (en) 2000-05-30 2001-10-11 Cleaning nozzle and substrate cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000160512A JP3939077B2 (ja) 2000-05-30 2000-05-30 基板洗浄装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004201984A Division JP2004337858A (ja) 2004-07-08 2004-07-08 洗浄ノズル及び基板洗浄装置

Publications (3)

Publication Number Publication Date
JP2001334181A JP2001334181A (ja) 2001-12-04
JP2001334181A5 JP2001334181A5 (enExample) 2005-05-19
JP3939077B2 true JP3939077B2 (ja) 2007-06-27

Family

ID=18664696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000160512A Expired - Fee Related JP3939077B2 (ja) 2000-05-30 2000-05-30 基板洗浄装置

Country Status (2)

Country Link
US (1) US6729561B2 (enExample)
JP (1) JP3939077B2 (enExample)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3892792B2 (ja) 2001-11-02 2007-03-14 大日本スクリーン製造株式会社 基板処理装置および基板洗浄装置
KR100505180B1 (ko) * 2002-02-20 2005-08-01 엘지.필립스 엘시디 주식회사 노즐세정장치를 구비한 액정적하장치 및 액정적하방법
GB0307428D0 (en) 2003-03-31 2003-05-07 Medical Res Council Compartmentalised combinatorial chemistry
GB0307403D0 (en) 2003-03-31 2003-05-07 Medical Res Council Selection by compartmentalised screening
US20060078893A1 (en) 2004-10-12 2006-04-13 Medical Research Council Compartmentalised combinatorial chemistry by microfluidic control
JP4593947B2 (ja) * 2004-03-19 2010-12-08 キヤノン株式会社 成膜装置および成膜方法
US20050221339A1 (en) 2004-03-31 2005-10-06 Medical Research Council Harvard University Compartmentalised screening by microfluidic control
US7551265B2 (en) * 2004-10-01 2009-06-23 Nikon Corporation Contact material and system for ultra-clean applications
US7968287B2 (en) 2004-10-08 2011-06-28 Medical Research Council Harvard University In vitro evolution in microfluidic systems
JP4855023B2 (ja) * 2005-09-08 2012-01-18 株式会社日立プラントテクノロジー ジェットノズル
EP1984738A2 (en) 2006-01-11 2008-10-29 Raindance Technologies, Inc. Microfluidic devices and methods of use in the formation and control of nanoreactors
US9562837B2 (en) 2006-05-11 2017-02-07 Raindance Technologies, Inc. Systems for handling microfludic droplets
WO2007133710A2 (en) 2006-05-11 2007-11-22 Raindance Technologies, Inc. Microfluidic devices and methods of use thereof
EP2077912B1 (en) 2006-08-07 2019-03-27 The President and Fellows of Harvard College Fluorocarbon emulsion stabilizing surfactants
US8772046B2 (en) 2007-02-06 2014-07-08 Brandeis University Manipulation of fluids and reactions in microfluidic systems
FR2912946B1 (fr) * 2007-02-28 2009-04-10 Snecma Sa Controle d'alignement pour un systeme de decoupe par jet d'eau
WO2008130623A1 (en) 2007-04-19 2008-10-30 Brandeis University Manipulation of fluids, fluid components and reactions in microfluidic systems
WO2010009365A1 (en) 2008-07-18 2010-01-21 Raindance Technologies, Inc. Droplet libraries
US12038438B2 (en) 2008-07-18 2024-07-16 Bio-Rad Laboratories, Inc. Enzyme quantification
US8528589B2 (en) 2009-03-23 2013-09-10 Raindance Technologies, Inc. Manipulation of microfluidic droplets
EP2486409A1 (en) 2009-10-09 2012-08-15 Universite De Strasbourg Labelled silica-based nanomaterial with enhanced properties and uses thereof
US20110121108A1 (en) * 2009-11-24 2011-05-26 Stephan Rodewald Plasma polymerization nozzle
US20110121107A1 (en) * 2009-11-24 2011-05-26 Frederic Gerard Auguste Siffer Plasma polymerization nozzle
WO2011079176A2 (en) 2009-12-23 2011-06-30 Raindance Technologies, Inc. Microfluidic systems and methods for reducing the exchange of molecules between droplets
US9399797B2 (en) 2010-02-12 2016-07-26 Raindance Technologies, Inc. Digital analyte analysis
EP4484577A3 (en) 2010-02-12 2025-03-26 Bio-Rad Laboratories, Inc. Digital analyte analysis
US9366632B2 (en) 2010-02-12 2016-06-14 Raindance Technologies, Inc. Digital analyte analysis
US10351905B2 (en) 2010-02-12 2019-07-16 Bio-Rad Laboratories, Inc. Digital analyte analysis
CN104922071A (zh) 2010-04-09 2015-09-23 帕西拉制药有限公司 用于配制大直径合成膜囊泡的方法
US20120104122A1 (en) * 2010-09-16 2012-05-03 Laski Stephen J Long Reach Impingement Nozzle For Use In Robotic Water Cleaning Systems
WO2012045012A2 (en) 2010-09-30 2012-04-05 Raindance Technologies, Inc. Sandwich assays in droplets
WO2012109600A2 (en) 2011-02-11 2012-08-16 Raindance Technologies, Inc. Methods for forming mixed droplets
US9150852B2 (en) 2011-02-18 2015-10-06 Raindance Technologies, Inc. Compositions and methods for molecular labeling
US8841071B2 (en) 2011-06-02 2014-09-23 Raindance Technologies, Inc. Sample multiplexing
EP3709018A1 (en) 2011-06-02 2020-09-16 Bio-Rad Laboratories, Inc. Microfluidic apparatus for identifying components of a chemical reaction
US8658430B2 (en) 2011-07-20 2014-02-25 Raindance Technologies, Inc. Manipulating droplet size
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
KR102112881B1 (ko) * 2012-03-28 2020-05-19 노벨러스 시스템즈, 인코포레이티드 전자도금 기판 홀더들을 세정하기 위한 방법들 및 장치들
KR102092416B1 (ko) 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝
US20140196749A1 (en) * 2013-01-15 2014-07-17 Applied Materials, Inc. Cryogenic liquid cleaning apparatus and methods
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
TWI462148B (zh) * 2013-07-10 2014-11-21 Fluid nozzle and fluid nozzle device
US11901041B2 (en) 2013-10-04 2024-02-13 Bio-Rad Laboratories, Inc. Digital analysis of nucleic acid modification
US9944977B2 (en) 2013-12-12 2018-04-17 Raindance Technologies, Inc. Distinguishing rare variations in a nucleic acid sequence from a sample
WO2015103367A1 (en) 2013-12-31 2015-07-09 Raindance Technologies, Inc. System and method for detection of rna species
JP6529780B2 (ja) 2015-02-25 2019-06-12 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
JP6369395B2 (ja) * 2015-06-11 2018-08-08 株式会社ダイフク 洗浄装置、それを用いた洗車機
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US10647981B1 (en) 2015-09-08 2020-05-12 Bio-Rad Laboratories, Inc. Nucleic acid library generation methods and compositions
JP2019160958A (ja) * 2018-03-12 2019-09-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CA3180492A1 (en) * 2020-05-01 2021-11-04 Agilent Technologies, Inc. Pipette tip washing devices and methods
US20220165547A1 (en) * 2020-11-24 2022-05-26 Applied Materials, Inc. Novel and effective homogenize flow mixing design
CN113102132A (zh) * 2021-04-15 2021-07-13 攀钢集团攀枝花钢铁研究院有限公司 一种强腐蚀液体射流器
CN113996922B (zh) * 2021-12-31 2022-04-01 苏州佳祺仕信息科技有限公司 一种用于激光焊接的焊烟吸附装置及控制方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3823408A (en) * 1972-11-29 1974-07-09 Ibm High performance ink jet nozzle
JP3530270B2 (ja) 1995-04-27 2004-05-24 島田理化工業株式会社 精密洗浄装置
JP3504023B2 (ja) 1995-05-26 2004-03-08 株式会社ルネサステクノロジ 洗浄装置および洗浄方法
JP3369418B2 (ja) * 1996-11-25 2003-01-20 大日本スクリーン製造株式会社 超音波振動子、超音波洗浄ノズル、超音波洗浄装置、基板洗浄装置、基板洗浄処理システムおよび超音波洗浄ノズル製造方法
JP3315611B2 (ja) 1996-12-02 2002-08-19 三菱電機株式会社 洗浄用２流体ジェットノズル及び洗浄装置ならびに半導体装置
DE19725955C1 (de) * 1997-06-19 1999-01-21 Heraeus Quarzglas Verfahren zur Herstellung eines Quarzglasrohlings und dafür geeignete Vorrichtung
US5969353A (en) * 1998-01-22 1999-10-19 Millennium Pharmaceuticals, Inc. Microfluid chip mass spectrometer interface
JP3925000B2 (ja) * 1999-09-06 2007-06-06 株式会社日立製作所 噴霧器及びそれを用いた分析装置

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Publication number Publication date
US20020020763A1 (en) 2002-02-21
JP2001334181A (ja) 2001-12-04
US6729561B2 (en) 2004-05-04

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