JP3939062B2 - 基板検出装置 - Google Patents

基板検出装置 Download PDF

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Publication number
JP3939062B2
JP3939062B2 JP2000015968A JP2000015968A JP3939062B2 JP 3939062 B2 JP3939062 B2 JP 3939062B2 JP 2000015968 A JP2000015968 A JP 2000015968A JP 2000015968 A JP2000015968 A JP 2000015968A JP 3939062 B2 JP3939062 B2 JP 3939062B2
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JP
Japan
Prior art keywords
substrate
lid
cam
fixing unit
cam groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000015968A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001210700A5 (enExample
JP2001210700A (ja
Inventor
秀夫 原口
出 松田
重之 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000015968A priority Critical patent/JP3939062B2/ja
Priority to KR1020010003594A priority patent/KR100606526B1/ko
Priority to US09/768,065 priority patent/US6642533B2/en
Publication of JP2001210700A publication Critical patent/JP2001210700A/ja
Publication of JP2001210700A5 publication Critical patent/JP2001210700A5/ja
Application granted granted Critical
Publication of JP3939062B2 publication Critical patent/JP3939062B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000015968A 2000-01-25 2000-01-25 基板検出装置 Expired - Fee Related JP3939062B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000015968A JP3939062B2 (ja) 2000-01-25 2000-01-25 基板検出装置
KR1020010003594A KR100606526B1 (ko) 2000-01-25 2001-01-22 기판검출방법 및 그 장치
US09/768,065 US6642533B2 (en) 2000-01-25 2001-01-24 Substrate detecting method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000015968A JP3939062B2 (ja) 2000-01-25 2000-01-25 基板検出装置

Publications (3)

Publication Number Publication Date
JP2001210700A JP2001210700A (ja) 2001-08-03
JP2001210700A5 JP2001210700A5 (enExample) 2005-01-06
JP3939062B2 true JP3939062B2 (ja) 2007-06-27

Family

ID=18543183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000015968A Expired - Fee Related JP3939062B2 (ja) 2000-01-25 2000-01-25 基板検出装置

Country Status (3)

Country Link
US (1) US6642533B2 (enExample)
JP (1) JP3939062B2 (enExample)
KR (1) KR100606526B1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468056B2 (ja) * 1997-09-23 2003-11-17 東京エレクトロン株式会社 基板検出装置
US7282889B2 (en) * 2001-04-19 2007-10-16 Onwafer Technologies, Inc. Maintenance unit for a sensor apparatus
US6717171B2 (en) * 2001-06-05 2004-04-06 Semitool, Inc. Method and apparatus for accessing microelectronic workpiece containers
JP2003303876A (ja) * 2002-04-10 2003-10-24 Seiko Instruments Inc 試料ステージにおける半導体ウエハ保持機構
DE10250353B4 (de) 2002-10-25 2008-04-30 Brooks Automation (Germany) Gmbh Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten
JP4276440B2 (ja) * 2003-01-06 2009-06-10 東京エレクトロン株式会社 基板検出方法及び装置並びに基板処理装置
US7255524B2 (en) * 2003-04-14 2007-08-14 Brooks Automation, Inc. Substrate cassette mapper
US8888433B2 (en) 2004-08-19 2014-11-18 Brooks Automation, Inc. Reduced capacity carrier and method of use
JP4891538B2 (ja) * 2004-11-04 2012-03-07 株式会社日立ハイテクノロジーズ ロードポート
JP4502127B2 (ja) * 2005-04-01 2010-07-14 株式会社ダイフク カセット保管及び被処理板の処理設備
JP5592710B2 (ja) * 2010-06-17 2014-09-17 セイコーインスツル株式会社 ピッチ変換装置
JP6045946B2 (ja) * 2012-07-13 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、プログラムおよび記録媒体
KR101432137B1 (ko) * 2013-03-27 2014-08-20 주식회사 싸이맥스 웨이퍼의 존재 유무 및 위치를 검출하는 일체형 매핑바가 형성된 매핑장치
US10790177B2 (en) * 2017-11-14 2020-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Systems, devices, and methods for using a real time environment sensor in a FOUP
CN109444720B (zh) * 2018-12-13 2024-03-22 奥士康科技股份有限公司 一种pcb板自动化检测装置
CN112401880B (zh) * 2020-10-22 2022-07-12 中国人民解放军陆军军医大学第二附属医院 一种用于戴在手指上的血氧监测设备
KR102563297B1 (ko) * 2021-04-12 2023-08-03 주식회사 유진테크 기판이송장치 및 이를 포함하는 기판 처리장치
CN117810128B (zh) * 2023-12-30 2024-05-24 医顺通信息科技(常州)有限公司 一种rfid腕带芯片衬底接合装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2868645B2 (ja) * 1991-04-19 1999-03-10 東京エレクトロン株式会社 ウエハ搬送装置、ウエハの傾き検出方法、およびウエハの検出方法
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
JP3590517B2 (ja) * 1998-01-21 2004-11-17 株式会社 日立インダストリイズ カセット内ウエフア検出装置
TW444260B (en) * 2000-07-13 2001-07-01 Ind Tech Res Inst Wafer mapping method of wafer load port equipment

Also Published As

Publication number Publication date
KR100606526B1 (ko) 2006-08-01
US20010009641A1 (en) 2001-07-26
KR20010074538A (ko) 2001-08-04
US6642533B2 (en) 2003-11-04
JP2001210700A (ja) 2001-08-03

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