KR100606526B1 - 기판검출방법 및 그 장치 - Google Patents

기판검출방법 및 그 장치 Download PDF

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Publication number
KR100606526B1
KR100606526B1 KR1020010003594A KR20010003594A KR100606526B1 KR 100606526 B1 KR100606526 B1 KR 100606526B1 KR 1020010003594 A KR1020010003594 A KR 1020010003594A KR 20010003594 A KR20010003594 A KR 20010003594A KR 100606526 B1 KR100606526 B1 KR 100606526B1
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KR
South Korea
Prior art keywords
substrate
cam
cover
opening
cam groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020010003594A
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English (en)
Korean (ko)
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KR20010074538A (ko
Inventor
하라구치히데오
마츠다이즈루
야마모토시게유키
Original Assignee
마츠시타 덴끼 산교 가부시키가이샤
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Publication of KR20010074538A publication Critical patent/KR20010074538A/ko
Application granted granted Critical
Publication of KR100606526B1 publication Critical patent/KR100606526B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020010003594A 2000-01-25 2001-01-22 기판검출방법 및 그 장치 Expired - Fee Related KR100606526B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000015968A JP3939062B2 (ja) 2000-01-25 2000-01-25 基板検出装置
JP2000-15968 2000-01-25

Publications (2)

Publication Number Publication Date
KR20010074538A KR20010074538A (ko) 2001-08-04
KR100606526B1 true KR100606526B1 (ko) 2006-08-01

Family

ID=18543183

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010003594A Expired - Fee Related KR100606526B1 (ko) 2000-01-25 2001-01-22 기판검출방법 및 그 장치

Country Status (3)

Country Link
US (1) US6642533B2 (enExample)
JP (1) JP3939062B2 (enExample)
KR (1) KR100606526B1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468056B2 (ja) * 1997-09-23 2003-11-17 東京エレクトロン株式会社 基板検出装置
US7282889B2 (en) * 2001-04-19 2007-10-16 Onwafer Technologies, Inc. Maintenance unit for a sensor apparatus
US6717171B2 (en) * 2001-06-05 2004-04-06 Semitool, Inc. Method and apparatus for accessing microelectronic workpiece containers
JP2003303876A (ja) * 2002-04-10 2003-10-24 Seiko Instruments Inc 試料ステージにおける半導体ウエハ保持機構
DE10250353B4 (de) 2002-10-25 2008-04-30 Brooks Automation (Germany) Gmbh Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten
JP4276440B2 (ja) * 2003-01-06 2009-06-10 東京エレクトロン株式会社 基板検出方法及び装置並びに基板処理装置
US7255524B2 (en) * 2003-04-14 2007-08-14 Brooks Automation, Inc. Substrate cassette mapper
KR101233101B1 (ko) 2004-08-19 2013-02-14 브룩스 오토메이션 인코퍼레이티드 저용량 캐리어 및 그 사용방법
JP4891538B2 (ja) 2004-11-04 2012-03-07 株式会社日立ハイテクノロジーズ ロードポート
JP4502127B2 (ja) * 2005-04-01 2010-07-14 株式会社ダイフク カセット保管及び被処理板の処理設備
JP5592710B2 (ja) * 2010-06-17 2014-09-17 セイコーインスツル株式会社 ピッチ変換装置
JP6045946B2 (ja) * 2012-07-13 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、プログラムおよび記録媒体
KR101432137B1 (ko) * 2013-03-27 2014-08-20 주식회사 싸이맥스 웨이퍼의 존재 유무 및 위치를 검출하는 일체형 매핑바가 형성된 매핑장치
US10790177B2 (en) * 2017-11-14 2020-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Systems, devices, and methods for using a real time environment sensor in a FOUP
CN109444720B (zh) * 2018-12-13 2024-03-22 奥士康科技股份有限公司 一种pcb板自动化检测装置
CN112401880B (zh) * 2020-10-22 2022-07-12 中国人民解放军陆军军医大学第二附属医院 一种用于戴在手指上的血氧监测设备
KR102563297B1 (ko) * 2021-04-12 2023-08-03 주식회사 유진테크 기판이송장치 및 이를 포함하는 기판 처리장치
CN117810128B (zh) * 2023-12-30 2024-05-24 医顺通信息科技(常州)有限公司 一种rfid腕带芯片衬底接合装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214483A (ja) * 1998-01-21 1999-08-06 Hitachi Techno Eng Co Ltd カセット内ウエフア検出装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2868645B2 (ja) * 1991-04-19 1999-03-10 東京エレクトロン株式会社 ウエハ搬送装置、ウエハの傾き検出方法、およびウエハの検出方法
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
TW444260B (en) * 2000-07-13 2001-07-01 Ind Tech Res Inst Wafer mapping method of wafer load port equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214483A (ja) * 1998-01-21 1999-08-06 Hitachi Techno Eng Co Ltd カセット内ウエフア検出装置

Also Published As

Publication number Publication date
JP2001210700A (ja) 2001-08-03
US20010009641A1 (en) 2001-07-26
US6642533B2 (en) 2003-11-04
JP3939062B2 (ja) 2007-06-27
KR20010074538A (ko) 2001-08-04

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