TWI362081B - - Google Patents

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Publication number
TWI362081B
TWI362081B TW96117968A TW96117968A TWI362081B TW I362081 B TWI362081 B TW I362081B TW 96117968 A TW96117968 A TW 96117968A TW 96117968 A TW96117968 A TW 96117968A TW I362081 B TWI362081 B TW I362081B
Authority
TW
Taiwan
Prior art keywords
substrate
wafer
deformation
optical path
light
Prior art date
Application number
TW96117968A
Other languages
English (en)
Chinese (zh)
Other versions
TW200807598A (en
Inventor
Kohei Mori
Jyunji Kume
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200807598A publication Critical patent/TW200807598A/zh
Application granted granted Critical
Publication of TWI362081B publication Critical patent/TWI362081B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW96117968A 2006-05-22 2007-05-21 Basal plate deformation detecting system and deformation detecting method TW200807598A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006141377A JP2009200063A (ja) 2006-05-22 2006-05-22 基板の変形検出機構，処理システム，基板の変形検出方法及び記録媒体

Publications (2)

Publication Number Publication Date
TW200807598A TW200807598A (en) 2008-02-01
TWI362081B true TWI362081B (enExample) 2012-04-11

Family

ID=38723379

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96117968A TW200807598A (en) 2006-05-22 2007-05-21 Basal plate deformation detecting system and deformation detecting method

Country Status (3)

Country Link
JP (1) JP2009200063A (enExample)
TW (1) TW200807598A (enExample)
WO (1) WO2007136066A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8907277B2 (en) 2008-03-07 2014-12-09 Carl Zeiss Microscopy, Llc Reducing particle implantation
JP5917165B2 (ja) * 2012-01-25 2016-05-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及びこれに用いられる液供給装置
WO2013111569A1 (ja) * 2012-01-25 2013-08-01 大日本スクリーン製造株式会社 基板処理装置及びこれに用いられる液供給装置並びに基板処理方法
JP5838520B2 (ja) * 2012-02-28 2016-01-06 株式会社ダイフク 物品搬送設備
CN102931117A (zh) * 2012-11-21 2013-02-13 苏州矽科信息科技有限公司 利用光反射原理测量晶圆传输中变形量的方法
CN103278103B (zh) * 2013-05-18 2016-01-06 大连理工大学 一种薄基片变形的测量方法与装置
JP6090035B2 (ja) * 2013-07-25 2017-03-08 東京エレクトロン株式会社 液処理装置
JP6394220B2 (ja) * 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
JP6408349B2 (ja) * 2014-11-10 2018-10-17 株式会社アルバック 基板搬送方法
JP6794880B2 (ja) * 2017-03-14 2020-12-02 東京エレクトロン株式会社 縦型熱処理装置及び縦型熱処理装置の運転方法
JP6440757B2 (ja) * 2017-03-16 2018-12-19 キヤノン株式会社 基板搬送システム、リソグラフィ装置、および物品の製造方法
CN108766915A (zh) * 2018-08-06 2018-11-06 江阴佳泰电子科技有限公司 一种用于晶圆防破片报警系统
CN108987296B (zh) * 2018-08-14 2024-04-02 长江存储科技有限责任公司 晶圆弹性应变测量装置、测量方法及晶圆键合方法
JP7748238B2 (ja) * 2021-09-22 2025-10-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN116798891A (zh) * 2022-03-15 2023-09-22 长鑫存储技术有限公司 晶圆的弯曲程度确定装置和控温系统
CN115711664B (zh) * 2022-11-07 2025-05-27 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) 微弱振动形变检测电路

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119673A (ja) * 2002-09-26 2004-04-15 Nitto Denko Corp 半導体ウエハの反り量測定方法および測定装置
JP2005158809A (ja) * 2003-11-20 2005-06-16 Tokyo Seimitsu Co Ltd プローバ装置、並びにウエハ検出方法、ウエハ位置測定方法及びカセット位置補正方法

Also Published As

Publication number Publication date
TW200807598A (en) 2008-02-01
WO2007136066A1 (ja) 2007-11-29
JP2009200063A (ja) 2009-09-03

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