JP3918401B2 - 基板乾燥装置及び乾燥方法、並びに基板の製造方法 - Google Patents

基板乾燥装置及び乾燥方法、並びに基板の製造方法 Download PDF

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Publication number
JP3918401B2
JP3918401B2 JP2000139007A JP2000139007A JP3918401B2 JP 3918401 B2 JP3918401 B2 JP 3918401B2 JP 2000139007 A JP2000139007 A JP 2000139007A JP 2000139007 A JP2000139007 A JP 2000139007A JP 3918401 B2 JP3918401 B2 JP 3918401B2
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Japan
Prior art keywords
substrate
air
nozzle
air knife
liquid
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000139007A
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English (en)
Japanese (ja)
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JP2001050660A (ja
JP2001050660A5 (enExample
Inventor
浩 福田
良友 安池
和彦 権守
国夫 油田
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2000139007A priority Critical patent/JP3918401B2/ja
Priority to US09/579,134 priority patent/US6418640B1/en
Publication of JP2001050660A publication Critical patent/JP2001050660A/ja
Publication of JP2001050660A5 publication Critical patent/JP2001050660A5/ja
Application granted granted Critical
Publication of JP3918401B2 publication Critical patent/JP3918401B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/14—Drying solid materials or objects by processes not involving the application of heat by applying pressure, e.g. wringing; by brushing; by wiping

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2000139007A 1999-05-31 2000-05-11 基板乾燥装置及び乾燥方法、並びに基板の製造方法 Expired - Fee Related JP3918401B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000139007A JP3918401B2 (ja) 1999-05-31 2000-05-11 基板乾燥装置及び乾燥方法、並びに基板の製造方法
US09/579,134 US6418640B1 (en) 1999-05-31 2000-05-30 Drying apparatus for a substrate and drying method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-151379 1999-05-31
JP15137999 1999-05-31
JP2000139007A JP3918401B2 (ja) 1999-05-31 2000-05-11 基板乾燥装置及び乾燥方法、並びに基板の製造方法

Publications (3)

Publication Number Publication Date
JP2001050660A JP2001050660A (ja) 2001-02-23
JP2001050660A5 JP2001050660A5 (enExample) 2005-10-27
JP3918401B2 true JP3918401B2 (ja) 2007-05-23

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JP2000139007A Expired - Fee Related JP3918401B2 (ja) 1999-05-31 2000-05-11 基板乾燥装置及び乾燥方法、並びに基板の製造方法

Country Status (2)

Country Link
US (1) US6418640B1 (enExample)
JP (1) JP3918401B2 (enExample)

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* Cited by examiner, † Cited by third party
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JP3918401B2 (ja) * 1999-05-31 2007-05-23 株式会社日立ハイテクノロジーズ 基板乾燥装置及び乾燥方法、並びに基板の製造方法
US6631726B1 (en) * 1999-08-05 2003-10-14 Hitachi Electronics Engineering Co., Ltd. Apparatus and method for processing a substrate
US6421932B2 (en) * 2000-02-14 2002-07-23 Hitachi Electronics Engineering Co., Ltd. Method and apparatus for drying substrate plates
JP3405312B2 (ja) * 2000-02-25 2003-05-12 日本電気株式会社 塗布膜除去装置
KR20030066210A (ko) * 2002-02-05 2003-08-09 엘지전자 주식회사 습식장치
US20040031167A1 (en) 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US20050022930A1 (en) * 2003-04-17 2005-02-03 Yoshihiro Moriguchi Substrate treatment apparatus, substrate treatment method and substrate manufacturing method
KR101361892B1 (ko) 2003-10-08 2014-02-12 가부시키가이샤 자오 니콘 기판 반송 장치 및 기판 반송 방법, 노광 장치 및 노광 방법, 디바이스 제조 방법
JP4506674B2 (ja) 2004-02-03 2010-07-21 株式会社ニコン 露光装置及びデバイス製造方法
CN100362625C (zh) * 2005-03-30 2008-01-16 大日本网目版制造株式会社 基板处理装置以及基板处理方法
KR100819714B1 (ko) 2006-06-01 2008-04-07 주식회사 케이씨텍 대면적 기판의 건조 장치 및 방법
KR20080090070A (ko) * 2007-04-04 2008-10-08 삼성전자주식회사 에어나이프 및 이를 포함하는 기판 건조 장치
KR101171982B1 (ko) 2010-10-18 2012-08-07 주식회사 케이씨텍 기판의 흡착이 방지된 에어나이프
TWI522589B (zh) * 2011-07-08 2016-02-21 友達光電股份有限公司 乾燥設備及乾燥方法
US20130306271A1 (en) * 2012-05-18 2013-11-21 Shenzhen China Star Optoelectronics Technology Co., Ltd. Blowing Device and Method for Using the Blowing Device
CN103017500A (zh) * 2012-12-04 2013-04-03 彩虹（佛山）平板显示有限公司 一种盖板玻璃的清洗机干燥工艺
CN103851887B (zh) * 2012-12-07 2016-01-27 深南电路有限公司 Pcb干燥机
CN103411416B (zh) * 2013-08-23 2015-05-06 宝钢工程技术集团有限公司 蒸汽烘干设备
JP6336801B2 (ja) * 2014-03-31 2018-06-06 芝浦メカトロニクス株式会社 基板乾燥装置
CN104891223A (zh) * 2015-04-10 2015-09-09 宇宙电路板设备(深圳)有限公司 一种软板输送装置
US11383936B1 (en) * 2017-12-06 2022-07-12 Alliance Manufacturing, Inc. Automatic height adjusting manifold
CN111102807B (zh) * 2019-12-19 2021-09-10 河北金力新能源科技股份有限公司 一种鼓形刮液辊、刮液设备及其使用方法
JP7356368B2 (ja) * 2020-02-10 2023-10-04 株式会社荏原製作所 基板乾燥装置
CN113443840B (zh) * 2021-06-30 2022-07-29 福莱特玻璃集团股份有限公司 一种玻璃生产制造用风刀
DE102022113979A1 (de) * 2022-06-02 2023-12-07 Krones Aktiengesellschaft Vorrichtung zum Trocknen von Behältern
CN115655099B (zh) * 2022-09-22 2025-06-03 彩虹（合肥）液晶玻璃有限公司 一种提高玻璃检测效率和降低误检率的装置及检测方法
CN115770759B (zh) * 2022-11-24 2025-04-29 深圳市贝加电子材料有限公司 风刀滚轮装置以及印制电路板水平生产线
CN116007299B (zh) * 2022-12-29 2024-08-30 西安奕斯伟材料科技股份有限公司 一种用于硅片的干燥系统

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IT1133926B (it) * 1980-10-16 1986-07-24 Argon Service Srl Procedimento di asciugatura dei fogli,delle bobine,e degli altri prodotti della stampa serigrafia e genere e forno per la realizzazione di detto processo
JPS618928A (ja) * 1984-06-22 1986-01-16 Matsushita Electric Ind Co Ltd 基板乾燥装置
JPS6281718A (ja) * 1985-10-07 1987-04-15 Oki Electric Ind Co Ltd 基板乾燥装置
US4779355A (en) * 1986-12-04 1988-10-25 Dec-E-Tech, Inc. Efficient dryer and drying process
JPH0613230Y2 (ja) * 1989-07-31 1994-04-06 セントラル硝子株式会社 曲げ板ガラスの水切装置
DE3927627A1 (de) * 1989-08-22 1991-02-28 Hoechst Ag Verfahren und vorrichtung zum trocknen einer auf einem bewegten traegermaterial aufgebrachten fluessigkeitsschicht
DE4023442A1 (de) * 1990-07-24 1992-01-30 Pagendarm Gmbh Verfahren und vorrichtung zum trocknen einer beschichteten substratbahn
JPH0536660A (ja) * 1991-07-30 1993-02-12 Tokyo Electron Ltd 基板乾燥装置
JP2581396B2 (ja) * 1993-06-23 1997-02-12 日本電気株式会社 基板乾燥装置
JPH0990306A (ja) * 1995-09-25 1997-04-04 Sigma Merutetsuku Kk 基板乾燥ノズル
US6158141A (en) * 1998-05-07 2000-12-12 Sony Corporation Apparatus and method for drying semiconductor substrate
JP3918401B2 (ja) * 1999-05-31 2007-05-23 株式会社日立ハイテクノロジーズ 基板乾燥装置及び乾燥方法、並びに基板の製造方法

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US6418640B1 (en) 2002-07-16
JP2001050660A (ja) 2001-02-23

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