JP3904798B2 - 異方導電性ペースト - Google Patents

異方導電性ペースト Download PDF

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Publication number
JP3904798B2
JP3904798B2 JP2000094811A JP2000094811A JP3904798B2 JP 3904798 B2 JP3904798 B2 JP 3904798B2 JP 2000094811 A JP2000094811 A JP 2000094811A JP 2000094811 A JP2000094811 A JP 2000094811A JP 3904798 B2 JP3904798 B2 JP 3904798B2
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JP
Japan
Prior art keywords
anisotropic conductive
conductive paste
epoxy resin
fine particles
mass
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JP2000094811A
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English (en)
Japanese (ja)
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JP2000345010A (ja
JP2000345010A5 (enExample
Inventor
正 北村
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Mitsui Chemicals Inc
Sharp Corp
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Mitsui Chemicals Inc
Sharp Corp
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Priority to JP2000094811A priority Critical patent/JP3904798B2/ja
Publication of JP2000345010A publication Critical patent/JP2000345010A/ja
Publication of JP2000345010A5 publication Critical patent/JP2000345010A5/ja
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Publication of JP3904798B2 publication Critical patent/JP3904798B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
JP2000094811A 1999-04-01 2000-03-30 異方導電性ペースト Expired - Lifetime JP3904798B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000094811A JP3904798B2 (ja) 1999-04-01 2000-03-30 異方導電性ペースト

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-94582 1999-04-01
JP9458299 1999-04-01
JP2000094811A JP3904798B2 (ja) 1999-04-01 2000-03-30 異方導電性ペースト

Publications (3)

Publication Number Publication Date
JP2000345010A JP2000345010A (ja) 2000-12-12
JP2000345010A5 JP2000345010A5 (enExample) 2005-03-17
JP3904798B2 true JP3904798B2 (ja) 2007-04-11

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JP2000094811A Expired - Lifetime JP3904798B2 (ja) 1999-04-01 2000-03-30 異方導電性ペースト

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JP (1) JP3904798B2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012178342A (ja) * 2011-02-01 2012-09-13 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2014212311A (ja) * 2013-04-02 2014-11-13 国立大学法人大阪大学 異方性導電フィルム及び異方性導電接続体
US20220254571A1 (en) * 2021-02-05 2022-08-11 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4627125B2 (ja) * 2001-07-27 2011-02-09 三井化学株式会社 異方性導電ペースト
JP4824876B2 (ja) * 2001-08-01 2011-11-30 三井化学株式会社 回路接続ペースト材料
JP4896366B2 (ja) * 2003-09-02 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤及びその製造方法
JP2005187637A (ja) * 2003-12-25 2005-07-14 Sekisui Chem Co Ltd 異方導電性接着剤、液晶表示素子用上下導通材料及び液晶表示素子
JP2006080013A (ja) * 2004-09-10 2006-03-23 Mitsui Mining & Smelting Co Ltd 導電性ペースト及びその導電性ペーストを用いて得られるフレキシブルプリント配線板
JP4541186B2 (ja) * 2005-02-28 2010-09-08 ガンツ化成株式会社 液状エポキシ樹脂組成物
JP4867181B2 (ja) * 2005-03-17 2012-02-01 富士電機株式会社 電子部品実装用熱硬化性樹脂組成物
JP5285841B2 (ja) * 2005-04-12 2013-09-11 デクセリアルズ株式会社 フィルム状接着剤の製造方法
WO2006109831A1 (ja) * 2005-04-12 2006-10-19 Sony Chemical & Information Device Corporation 接着剤の製造方法
JP4852893B2 (ja) * 2005-05-31 2012-01-11 住友ベークライト株式会社 プリアプライド用封止樹脂組成物及びそれを用いた半導体装置の製造方法
JP2007317563A (ja) * 2006-05-26 2007-12-06 Sumitomo Electric Ind Ltd 回路接続用接着剤
JP5089089B2 (ja) * 2006-06-15 2012-12-05 積水化学工業株式会社 塗工ペースト
JP5112089B2 (ja) * 2008-01-28 2013-01-09 京セラケミカル株式会社 接着剤組成物
JP5499448B2 (ja) 2008-07-16 2014-05-21 デクセリアルズ株式会社 異方性導電接着剤
EP2444437B1 (en) * 2009-06-15 2019-02-20 Ajinomoto Co., Inc. Resin composition and organic-electrolyte battery
JPWO2011086680A1 (ja) 2010-01-15 2013-05-16 デクセリアルズ株式会社 異方性導電接着剤
JP5578862B2 (ja) * 2010-01-19 2014-08-27 ソマール株式会社 一液型エポキシ樹脂系接着剤
JP5314713B2 (ja) * 2011-02-17 2013-10-16 積水化学工業株式会社 接続構造体の製造方法及び異方性導電材料
JP5802081B2 (ja) * 2011-08-24 2015-10-28 株式会社タムラ製作所 異方性導電性ペースト
KR102055031B1 (ko) * 2012-06-29 2019-12-11 타츠타 전선 주식회사 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판
JP6027812B2 (ja) * 2012-08-06 2016-11-16 デクセリアルズ株式会社 回路接続材料
JP6114557B2 (ja) * 2013-01-10 2017-04-12 積水化学工業株式会社 導電材料及び接続構造体の製造方法
JP6269190B2 (ja) * 2014-03-10 2018-01-31 三菱ケミカル株式会社 硬化型接着剤
CN105849820B (zh) 2014-05-14 2018-10-26 积水化学工业株式会社 导电糊剂、导电糊剂的制造方法、连接结构体及连接结构体的制造方法
JP6302818B2 (ja) * 2014-10-20 2018-03-28 京セラ株式会社 リペアラブル接着剤組成物および電気・電子部品
US10870776B2 (en) * 2015-05-19 2020-12-22 Rohm And Haas Company Curable aqueous composition
KR101908185B1 (ko) * 2016-04-29 2018-10-15 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용해 접속된 디스플레이 장치
JP7028641B2 (ja) * 2016-05-19 2022-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
JP6490781B2 (ja) * 2016-12-28 2019-03-27 株式会社タムラ製作所 異方性導電ペーストおよび電子基板の製造方法
JP6772946B2 (ja) * 2017-04-26 2020-10-21 信越化学工業株式会社 低温硬化型液状エポキシ樹脂組成物
WO2019044649A1 (ja) * 2017-08-29 2019-03-07 東洋紡株式会社 生体接触型電極および生体情報計測用衣服
JP7390237B2 (ja) * 2020-03-31 2023-12-01 京セラ株式会社 異方導電性樹脂組成物、異方導電性接着フィルム、及びマイクロｌｅｄディスプレイ装置
JP7390236B2 (ja) * 2020-03-31 2023-12-01 京セラ株式会社 異方導電性樹脂組成物、及びマイクロｌｅｄディスプレイ装置
WO2022249282A1 (ja) * 2021-05-25 2022-12-01 サンスター技研株式会社 硬化性組成物及び硬化性組成物の製造方法
JP7122449B1 (ja) 2021-05-25 2022-08-19 サンスター技研株式会社 硬化性組成物及び硬化性組成物の製造方法
CN117586714B (zh) * 2023-11-23 2024-06-18 常州宏巨电子科技有限公司 一种具有各向异性的导电胶膜及其制备方法
JP7705077B1 (ja) 2024-03-11 2025-07-09 藤倉化成株式会社 導電性塗料
CN119153152B (zh) * 2024-11-12 2025-01-07 依士文生物科技(天津)有限公司 一种形成各向异性导电性能的材料及其制备方法和用途

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012178342A (ja) * 2011-02-01 2012-09-13 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2014212311A (ja) * 2013-04-02 2014-11-13 国立大学法人大阪大学 異方性導電フィルム及び異方性導電接続体
US20220254571A1 (en) * 2021-02-05 2022-08-11 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
US11810721B2 (en) * 2021-02-05 2023-11-07 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component

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Publication number Publication date
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