CN101120440A - 区域安装型半导体装置及用于该半导体装置的小片接合用树脂组合物、密封用树脂组合物 - Google Patents
区域安装型半导体装置及用于该半导体装置的小片接合用树脂组合物、密封用树脂组合物 Download PDFInfo
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Abstract
本发明提供即使通过使用无铅焊锡的表面安装也具有高可靠性的区域安装型半导体装置、以及用于该半导体装置的小片接合用树脂组合物和密封用树脂组合物。该区域安装型半导体装置,是通过小片接合用树脂组合物在基板的单表面上装载半导体元件,且通过密封用树脂组合物实质上仅对该基板的装载有该半导体元件的面进行密封的、装载了半导体元件或者叠层元件的区域安装型半导体装置,其特征在于,上述小片接合用树脂组合物的固化物在260℃下的弹性模量为1MPa以上、120MPa以下;上述密封用树脂组合物的固化物在260℃下的弹性模量为400MPa以上、1200MPa以下,且在260℃下的热膨胀系数为20ppm以上、50ppm以下。
Description
技术领域
本发明涉及区域安装型半导体装置及用于该半导体装置的小片接合用树脂组合物、密封用树脂组合物。
背景技术
近年来,在电子仪器的小型化、轻量化,高功能化的市场动向中,半导体(也称作集成电路(IC))的高集成化也在年年推进,另外,在半导体装置(以下,也称作封装件)的表面安装化在不断地被促进的过程中,开发出了新型的区域安装型半导体装置,理想的半导体装置由以往结构的半导体装置开始转向区域安装型半导体装置。具体地说,作为区域安装型半导体装置的代表性例子,可以举出球栅阵列(以下,称作BGA)、或者追求进一步小型化的芯片级封装(以下,称作CSP)。这些区域安装型半导体装置,是为了应对以四侧引脚扁平封装(以下,称作QFP)、小外形封装(SOP)为代表的以往的表面安装型半导体装置中,由于电极排列为IC的周边结构的安装方式,电极只能从IC的周边引出而接近极限的多引脚化以及高速化的要求而开发的。
作为区域安装型半导体装置的结构,在以双马来酰亚胺·三嗪(以下称作BT)树脂/铜箔电路基板为代表的硬质电路基板或者以聚酰亚胺薄膜/铜箔电路基板为代表的挠性电路基板等的基板的单表面上装载半导体元件,只有该元件装载面、即只有该基板的单表面被树脂组合物成型·密封。在该基板的元件装载面的相反面,形成有按格子状或周边状排列的焊锡珠,将该半导体装置安装在半导体装置用电路基板时,进行该形成有焊锡珠的面与该电路基板的接合。由于在这样的安装方式中电极排列为矩阵结构,因此,可以利用装载IC区域内将电极引出,对输入端子的增大、小型化有利。另外,作为装载半导体元件的基板,除了上述有机电路基板以外,还提议了利用引线框架等金属基板的结构。
如上所述,这些区域安装型半导体装置的结构,为用树脂组合物只对基板的元件装载面进行密封而对焊锡珠形成面不进行密封的、单表面密封的结构。极少情况下,在引线框架等的金属基板等中,即使在焊锡珠形成面有时也存在几十微米左右的密封树脂层,但由于在元件装载面上形成有几百微米至几毫米左右的密封树脂层,因此,在这样的金属基板等中,实质上也成为单表面密封结构。若是单表面密封,则由于有机基板或金属基板与树脂组合物的固化物之间的热膨胀以及热收缩的不一致或者由于树脂组合物的成型以及固化时的固化收缩的影响,在上述半导体装置中从刚刚成型后开时就容易产生弯曲。而且,在安装这些半导体装置的电路基板上实施焊接接合时,因树脂组合物的固化物的吸湿而存在于半导体装置内部的水分,在焊锡回流处理中暴露在高温下由于剧烈气化而产生的应力导致半导体装置中产生裂纹。
为了解决上述问题,探讨了利用耐热性、附着性优异的树脂的密封材料(例如,参照专利文献1)或者、提高粘结强度的小片接合材料(例如,参照专利文献2)。但是,近年来由于环境问题,高熔点的无铅焊锡的使用比以往增多,由于该无铅焊锡的使用必须将安装温度比以往提高约20℃,产生了安装后的半导体装置的可靠性比以往显著下降的问题。由此,通过对树脂组合物的改善提高半导体装置的可靠性的要求急剧增强,并希望推出耐回流裂纹性优异的半导体装置。
尤其是近年来,为了满足半导体装置的高功能化,推出了将功能等不同的元件装载在同一装置上的半导体装置(封装件)。作为其中之一例,有叠层封装件(以下,也称作装载了叠层元件的区域安装型半导体装置)。叠层封装件,是指用粘结剂将功能等不同的多个半导体元件(例如,逻辑元件、存储元件等)层压而对各个元件进行电连接,从而更有效地发挥其功能的封装件。此时,为了避免由于层压而引起的封装件厚度变厚的问题,多数情况下将用作叠层元件的半导体元件自身的厚度设计为很薄,例如,设计为200微米以下的情形很多,由此加大了半导体元件(芯片)自身的脆弱性。另外,伴随着封装件的小型化,与基板直接粘结的半导体元件的芯片面积相对于装载了该半导体元件的基板面积的比例增大,与基板直接粘结的半导体元件所承受的应力增大。而且,由于半导体元件具有上述层压结构,因此存在很多界面。由于上述原因,难以维持或者提高整个叠层封装件的可靠性。
专利文献1:特开2000-302842号公报(第2~6页)
专利文献2:特开2001-123013号公报(第2~8页)
发明的公开
发明要解决的课题
本发明提供即使通过使用无铅焊锡的表面安装也具有高可靠性的、装载了半导体元件或者叠层元件的区域安装型半导体装置、以及用于该半导体装置的小片接合用树脂组合物及密封用树脂组合物。
用于解决课题的方法
本发明为以下所述:
(1)本发明的区域安装型半导体装置,其通过小片接合用树脂组合物在基板的单表面上装载半导体元件,且通过密封用树脂组合物实质上仅对该基板的装载有该半导体元件的面进行密封,其特征在于,上述小片接合用树脂组合物的固化物在260℃下的弹性模量为1MPa以上、120MPa以下;上述密封用数脂组合物的固化物在260℃下的弹性模量为400MPa以上、1200MPa以下,且在260℃下的热膨胀系数为20ppm以上、50ppm以下。
(2)上述区域安装型半导体装置具有叠层元件结构,该叠层元件结构是在通过上述小片接合用树脂组合物装载在基板单表面的半导体元件上,进一步层压与该半导体元件相同或不同的一个或者两个以上的半导体元件的叠层元件结构。
(3)一种小片接合用树脂组合物,其用于通过小片接合用树脂组合物在基板的单表面装载半导体元件、且通过密封用树脂组合物实质上仅对该基板的装载有该半导体元件的面进行密封的区域安装型半导体装置,其特征在于,该小片接合用树脂组合物的固化物在260℃下的弹性模量为1MPa以上、120MPa以下。
(4)上述小片接合用树脂组合物中,上述区域安装型半导体装置具有叠层元件结构,该叠层元件结构是在通过上述小片接合用树脂组合物装载在基板单表面的半导体元件上,进一步层压与该半导体元件相同或不同的一个或者两个以上的半导体元件的叠层元件结构。
(5)一种密封用树脂组合物,其用于通过小片接合用树脂组合物在基板的单表面装载半导体元件、且通过密封用树脂组合物实质上仅对该基板的装载有该半导体元件的面进行密封的区域安装型半导体装置,其特征在于,该密封用树脂组合物的固化物在260℃下的弹性模量为400MPa以上、1200MPa以下,且在260℃下的热膨胀系数为20ppm以上、50ppm以下。
(6)上述密封用树脂组合物中,上述区域安装型半导体装置具有叠层元件结构,该叠层元件结构是在通过上述小片接合用树脂组合物装载在基板单表面的半导体元件上,进一步层压与该半导体元件相同或不同的一个或者两个以上的半导体元件的叠层元件结构。
发明效果
根据本发明,即使在比以往高的安装温度下,也能够得到低应力性优异、耐焊锡裂纹性优良的小片接合用树脂组合物以及密封用树脂组合物。另外,当使用本发明的小片接合用树脂组合物以及密封用树脂组合物时,即使在比以往高的安装温度下使用无铅焊锡实施表面安装,也能够得到具有高可靠性的、装载了半导体元件或者叠层元件的区域安装型半导体装置。
附图的简单说明
图1为装载了一个半导体元件的区域安装型半导体装置的剖面图
图2为装载了由两个半导体元件构成的叠层元件的区域安装型半导体装置的剖面图
其中,符号的说明如下:
1密封树脂(密封用树脂组合物的固化物)
2基板
3粘结剂层(小片接合用树脂组合物的固化物)
3a第一粘结剂层(小片接合用树脂组合物的固化物)
3b第二粘结剂层
4半导体元件
4a第一半导体元件
4b第二半导体元件
5金线
6焊锡珠
7抗蚀层
8半导体装置
9叠层元件
用于实施发明的最佳方式
本发明的区域安装型半导体装置,其通过小片接合用树脂组合物在基板的单表面上装载半导体元件,且通过密封用树脂组合物实质上仅对该基板的装载有该半导体元件的面进行密封,其中,上述小片接合用树脂组合物的固化物在260℃下的弹性模量为1MPa以上、120MPa以下;上述密封用树脂组合物的固化物在260℃下的弹性模量为400MPa以上、1200MPa以下,且在260℃下的热膨胀系数为20ppm以上、50ppm以下;通过使用具有上述特征的材料,可以得到即使使用无铅焊锡实施表面安装也具有高可靠性的本发明的区域安装型半导体装置。
另外,本发明的区域安装型半导体装置,也可以是具有叠层元件结构的区域安装型半导体装置,该叠层元件结构是在通过上述小片接合用树脂组合物装载在基板单表面的半导体元件上,进一步层压与该半导体元件相同或不同的一个或者两个以上的半导体元件的叠层元件结构。
下面,对本发明进行详细的说明。
小片接合用树脂组合物,是指制造半导体装置时用以粘结半导体元件和基板的树脂组合物,用于本发明的小片接合用树脂组合物,其固化物在260℃下的弹性模量必须在1MPa以上、120MPa以下,但对其形态没有特别的限定,例如,可以举出树脂膏或者树脂膜等。
能够作为本发明的小片接合用树脂组合物使用的树脂膏(以下,也称作小片接合用树脂膏),其特征在于,以热固化性树脂和填充材料为主要成份,其固化物在260℃下的弹性模量为1MPa以上、120MPa以下。用于上述树脂膏的热固化性树脂,为包括树脂、固化剂、固化促进剂等的通常的热固化性树脂,对其不做特别的限定,但由于其是形成膏的材料,因此优选在室温下为液状。
在此,弹性模量按以下方法求出。在特氟隆(テフロン)(注册商标)薄板上,按照宽度4mm、长度约50mm、厚度200μm涂敷树脂膏,在规定温度(例如175℃)的烤箱中固化规定的时间(例如30分钟)后,将树脂膏固化物从特氟隆(テフロン)(注册商标)薄板剥离,用动态粘弹性测定装置以试验长度为20mm、-100℃至300℃的升温速度为5℃/分钟、频率为10Hz进行测定,求出260℃下的弹性模量(以下,也称作贮存弹性模量)。
作为用于上述树脂膏中的热固化性树脂的例子,可以举出液状的环氧树脂、各种丙烯酸树脂、马来酰亚胺树脂、具有芳基的三芳基异氰脲酸酯等的具有自由基聚合性官能团的化合物、液状的氰酸酯树脂等,这些均可以单独使用一种或者多个并用。
作为液状的环氧树脂,例如,可以举出双酚A型环氧树脂、双酚F型环氧树脂、双酚E型环氧树脂、脂环式环氧树脂、脂肪族环氧树脂、缩水甘油胺型的液状环氧树脂等。
作为上述具有自由基聚合性官能团的化合物,可以举出脂环式(甲基)丙烯酸酯、脂肪族(甲基)丙烯酸酯、芳香族(甲基)丙烯酸酯、脂肪族二羧酸(甲基)丙烯酸酯、芳香族二羧酸(甲基)丙烯酸酯、马来酰亚胺、烯丙基化合物等。
作为上述液状氰酸酯树脂,可以举出3,3’,5,5’-四甲基-4,4’-二氰氧基二苯基甲烷、2,2-双(4-氰氧基苯基)丙烷、2,2-双(4-氰氧基苯基)乙烷、酚醛清漆型氰酸酯树脂、双酚A型氰酸酯树脂、双酚E型氰酸酯树脂、双酚F型氰酸酯树脂等。
本发明中,作为用于树脂膏中的热固化性树脂,在不引起树脂膏特性的降低的前提下,也可以混合室温下为固体的热固化性树脂而使用。作为可并用的室温下为固体的热固化性树脂组合物,没有特别的限定,在环氧树脂中,可以举出双酚A、双酚F、苯酚酚醛清漆、甲酚酚醛清漆类和环氧氯丙烷反应而得到的聚缩水甘油醚、联苯型环氧树脂、茋型环氧树脂、氢醌型环氧树脂、三酚基甲烷型环氧树脂、苯酚芳烷基型(含亚苯基、二亚苯基骨架)环氧树脂、含萘骨架的环氧树脂、二环戊二烯型环氧树脂等。另外,还可以使用正丁基缩水甘油醚、叔碳酸缩水甘油酯、氧化苯乙烯、乙基己基缩水甘油醚、苯基缩水甘油醚、甲苯基缩水甘油醚、丁基苯基缩水甘油醚等的单环氧树脂。作为马来酰亚胺树脂,可以举出N,N,(4,4’,-二苯基甲烷)双马来酰亚胺、双(3-乙基-5-甲基-4-马来酰亚胺基苯基)甲烷、2,2-双[4-(4-马来酰亚胺基苯氧基)苯基]丙烷等的双马来酰亚胺树脂。
优选在树脂膏总量中的上述热固化性树脂的含量为20%以下。若该热固化性树脂的含量在上述范围之外,则树脂膏增粘,妨碍分配器等的涂敷操作。
作为树脂膏中使用的热固化性树脂而采用环氧树脂时的固化剂,例如,可以举出酚醛树脂、脂肪族胺、芳香族胺、双氰胺、二羧酸二酰肼化合物、羧酸酐等。上述固化剂的含量,由“环氧树脂的环氧基总数/固化剂的活性氢总数”决定(但是,固化剂为酸酐等时,为水解后的固化剂的活性氢总数),其范围优选为0.8以上、1.2以下。若该含量超过上述上限值,则耐热性显著降低,若低于上述下限值,则会导致耐热性以及吸水率的下降,因此不优选。
作为树脂膏中使用的热固化性树脂采用环氧树脂时的固化促进剂兼固化剂,例如,有各种咪唑化合物,具体地可以举出,2-甲基咪唑、2-乙基咪唑、2-苯基-4-甲基-5-羟基甲基咪唑、2-C11H23-咪唑等的普通的咪唑;加成三嗪或者异氰尿酸的咪唑2,4-二氨基-6-{2-甲基咪唑-(1)}-乙基-S-三嗪、还有其异氰酸酯加成物等。这些均可以单独使用一种或者可以几个并用。优选在树脂膏总量中的上述固化促进剂兼固化剂的含量为0.01重量%以上、10重量%以下。若该含量在上述范围之外,则导致固化性的降低、适用期的下降。
作为树脂膏中使用的热固化性树脂采用具有自由基聚合性官能团的化合物时的聚合引发剂,只要是通常用于自由基聚合中的催化剂即可,没有特别的限定,例如,可以举出有机过氧化物等的热自由基聚合引发剂。优选上述聚合引发剂在树脂膏总量中的含量为0.001重量%以上、2重量%以下。若该含量在上述范围之外,则导致固化性的降低、适用期的下降。
作为树脂膏中使用的热固化性树脂采用氰酸酯树脂时的固化催化剂,例如,可以举出乙酰丙酮铜、乙酰丙酮锌等的金属络合物。相对于氰酸酯树脂100重量份,优选上述固化催化剂的含量为0.1重量份以上、1.0重量份以下。若该含量在上述范围之外,则影响固化性、适用期等。
作为能够用于树脂膏中的填充材料,有无机填充材料和有机填充材料。作为无机填充材料,例如,可以举出金粉、银粉、铜粉、铝粉等的金属粉;熔融石英、结晶石英、氮化硅、三氧化二铝、氮化铝、滑石等。作为有机填充材料,例如,可以举出硅树脂、聚四氟乙烯等的氟树脂、聚甲基丙烯酸甲酯等的丙烯酸树脂、苯并鸟粪胺或者三聚氰胺和甲醛的交联物等。其中,金属粉主要为了赋予导电性或导热性而使用,但从粒径或形状等的种类多、且容易得到的方面考虑,特别优选为银粉。
树脂膏中使用的填充材料中,优选卤离子、碱金属离子等的离子性杂质的含量为10ppm以下。离子性杂质,可通过对树脂膏的固化物进行热水萃取,用离子色谱法等加以测定。另外,作为填充材料的形状,可以使用片状、鳞片状、树枝状或球状等的填充材料。根据需要的树脂膏的粘度,所使用的填充材料的粒径也不同,但通常优选其平均粒径为0.3μm以上、20μm以下,最大粒径为50μm以下。若平均粒径在上述范围内,则可以抑制粘度上升或、涂敷或固化时由于树脂成份的流出而产生的扩散。另外,若最大粒径在上述范围内,则可以防止在涂敷树脂膏时,树脂膏堵塞针孔而不能连续使用的现象。另外,可将比较粗的填充材料和细的填充材料加以混合而使用,对形状、种类,也可以将各种形状和种类的填充材料加以适当的混合。在此,作为测定粒径的方法,可以举出激光粒度分布仪等。
为了赋予所需要的特性,作为用于树脂膏中的填充材料,例如,也可以添加粒径为1nm以上、100nm以下的纳米级填充材料,石英和丙烯酸的复合材料,有机填充材料的表面上实施了金属涂层的有机和无机复合填充材料等。
另外,用于树脂膏的填充材料,也可以使用事先用烷氧基硅烷、烯丙氧基硅烷、硅氨烷、羟基氨基硅烷等的硅烷偶联剂等对其表面进行处理后的填充材料。
另外,能够用于本发明的小片接合用树脂膏的粘度,优选为10Pa·s以上、50Pa·s以下,更优选为15Pa·s以上、35Pa·s以下。粘度可利用E型粘度计(3°锥体),在树脂膏制作后测定25℃、2.5rpm下的数值。若小片接合用树脂膏的粘度在上述范围之外,则涂敷时引起拔丝或下垂,因此不优选。
能够用于本发明的小片接合用树脂膏中,根据需要,在不损伤用途特性的范围内,可以使用硅烷偶联剂、钛酸酯偶联剂、低应力剂、颜料、染料、消泡剂、表面活性剂、溶剂等的添加剂。
作为能够用于本发明的小片接合用树脂膏的制造方法,例如,可以举出将各组分预混合,用三轧辊、湿式玻珠研磨机等进行混炼而得到树脂膏后,在真空下脱泡的方法等。
为了使能够用于本发明的小片接合用树脂膏的固化物在260℃下的弹性模量调整为1MPa以上、120MPa以下,例如,优选作为热固化性树脂使用加氢的双酚A型环氧树脂、1,4-环己烷二甲醇二缩水甘油醚、1,4-丁二醇二缩水甘油醚、1,6-己二醇二缩水甘油醚等的液状环氧树脂;二环戊二烯型环氧树脂等的固体环氧树脂;分子内具有能够自由基聚合的官能团(丙烯酰基、甲基丙烯酰基、丙烯酰胺基、马来酰亚胺基、乙烯酯基、乙烯醚基等)的聚丁二烯、聚异戊二烯、聚环氧化物、脂肪族聚酯、聚降冰片烯等的化合物等,向树脂骨架导入很多脂肪链(烃链)或者脂环骨架等的不含芳香环的骨架。另外,使用羧基末端丁二烯-丙烯腈共聚物、邻苯二甲酸酯等的低应力剂也有效。
使用能够用于本发明的小片接合用树脂膏,将半导体元件粘结在印刷电路板、金属引线框、在玻璃纤维上浸渍了环氧树脂的基板、聚酰亚胺基板、双马来酰亚胺-三嗪树脂基板等的半导体元件装载用基板上的方法,可以采用通过多点针或单点针的点涂法、通过单点针的线涂法、网板印刷或冲压件等将树脂膏涂敷在基板上后,装载半导体元件,用烤箱或加热板、在线熟化装置等进行加热而固化树脂膏等的公知的方法。另外,本发明的小片接合用树脂膏同样也适合用于构成叠层元件的半导体元件和半导体元件之间的接合中。
能够用作本发明的小片接合用树脂组合物的树脂膜(以下也称作小片接合用树脂膜),其特征在于,以热塑性树脂和固化性树脂为主要成份,其固化物在260℃下的弹性模量为1MPa以上、120MPa以下。
在此,弹性模量按以下方法求出。将上述树脂膜在规定温度(例如180℃)的烤箱中加热固化规定的时间(例如60分钟)后,用动态粘弹性测定装置以试验长度为20mm、-100℃至330℃的升温速度为5℃/分钟、频率为10Hz进行测定,求出260℃下的弹性模量(以下,也称作贮存弹性模量)。
另外,优选固化后的树脂膜厚度为5μm以上、50μm以下。若该树脂膜的厚度低于上述下限值,则粘结时容易残留空隙,若超过上述上限值,则整个封装件的厚度变厚,因而不优选。
作为用于上述树脂膜中的热塑性树脂,可以举出聚酰亚胺树脂、聚醚酰亚胺树脂等的聚酰亚胺类树脂;聚酰胺树脂、聚酰胺亚胺树脂等的聚酰胺类树脂;丙烯酸类树脂等。其中,由于丙烯酸类树脂能够提高上述树脂膜的初期附着性,故为优选。在此,初期附着性是指用小片接合用树脂膜粘结半导体元件和基板时的初期阶段中的附着性,即意味着对小片接合用树脂膜进行固化处理之前的附着性。
上述丙烯酸类树脂,是指丙烯酸及其衍生物,具体地可以举出丙烯酸;甲基丙烯酸;丙烯酸甲酯、丙烯酸乙酯等的丙烯酸酯;甲基丙烯酸甲酯、甲基丙烯酸乙酯等的甲基丙烯酸酯;丙烯腈、丙烯酰胺等的聚合体以及上述单体和其他单体的共聚物等。
另外,作为上述丙烯酸类树脂,优选包括具有环氧基、羟基、羧基、硝基等官能团的化合物的丙烯酸类树脂(特别是,丙烯酸酯共聚物)。通过采用包括具有上述官能团的化合物的丙烯酸类树脂,能够进一步提高半导体元件和被附着体之间的附着性。作为包括具有上述官能团的化合物的丙烯酸类树脂,具体地可以举出具有缩水甘油醚基的甲基丙烯酸缩水甘油酯、具有羟基的羟基甲基丙烯酸酯、具有羧基的羧基甲基丙烯酸酯;具有硝基的丙烯腈等。其中,特别优选包括具有硝基的化合物的丙烯酸共聚物。由此,能够更加提高与被附着体的附着性。
包括具有上述官能团的化合物的丙烯酸类树脂的含量,没有特别的限制,优选为上述丙烯酸类树脂总含量的0.5重量%以上、40重量%以下,特别优选为5重量%以上、30重量%以下。若含量在上述范围内,则小片接合用树脂膜具有合适的附着性,在小片接合用树脂膜的制作中能够得到良好的操作性。
对用于上述树脂膜中的热塑性树脂(特别是丙烯酸类树脂)的重均分子量没有特别的限定,但优选为10万以上,特别优选为15万以上、100万以下。若重均分子量在上述范围内,则能够提高特别是小片接合用树脂膜的成膜性。
作为用于上述树脂膜的固化性树脂,可以举出热固化性树脂、紫外线固化性树脂、电子束固化性树脂等。另外,作为固化性树脂,还可以含有具有后述的固化剂功能的物质。
从能够特别地提高上述树脂膜的耐热性(特别是在260℃下的耐焊锡回流性)考虑,上述固化性树脂优选含有热固化性树脂。
作为上述热固化性树脂,例如,可以举出苯酚酚醛清漆树脂、甲酚酚醛清漆树脂、双酚A酚醛清漆树脂等的酚醛清漆型酚醛树脂;甲阶酚醛树脂等的酚醛树脂;双酚A环氧树脂、双酚F环氧树脂等的双酚型环氧树脂;酚醛清漆环氧树脂、甲酚酚醛清漆环氧树脂等的酚醛清漆型环氧树脂;联苯型环氧树脂、茋型环氧树脂、三酚甲烷型环氧树脂、烷基改性三酚甲烷型环氧树脂、含三嗪核环氧树脂、二环戊二烯改性酚型环氧树脂等的环氧树脂;脲醛(尿素)树脂、三聚氰胺树脂等的具有三嗪环的树脂;不饱和聚酯树脂、双马来酰亚胺树脂、聚氨酯树脂、邻苯二甲酸二烯丙酯树脂、聚硅氧烷树脂、具有苯并恶嗪环的树脂、氰酸酯树脂等。这些既可以单独使用也可以混合使用。其中,从能够进一步提高上述树脂膜的耐热性以及附着性方面考虑,特别优选环氧树脂。
作为上述环氧树脂,没有特别的限定,但优选结晶性环氧树脂。作为如此的结晶性环氧树脂,可以举出在主链上具有联苯骨架、双酚骨架、茋骨架等的刚直结构,且为较低分子量的环氧树脂。优选结晶性环氧树脂,是因为虽然常温下为结晶化的固体,但在熔点以上的温度区域下能够迅速熔解变成低粘度的液体的缘故。由此,能够进一步提高上述树脂膜的初期附着性。
对上述结晶性环氧树脂的熔点,没有特别的限定,优选50℃以上、150℃以下,特别优选为60℃以上、140℃以下。若上述结晶性环氧树脂的熔点在上述范围内,则特别能够提高上述树脂膜的低温附着性。
上述熔点,例如,可利用示差扫描量热计,用从室温以5℃/分钟的升温速度升温的结晶熔解的吸热波峰的顶点温度进行评价。
对上述热固化性树脂的含量没有特别的限制,但相对于上述热塑性树脂100重量份,优选为10重量份以上、100重量份以下,特别优选为30重量份以上、70重量份以下。若上述热固化性树脂的含量在上述范围内,则能够同时提高树脂膜的耐热性与韧性。
用于上述树脂膜的固化性树脂,优选进一步含有紫外线固化性树脂。由此,能够进一步提高上述树脂膜的初期附着性。
作为上述紫外线固化性树脂,例如,可以举出以丙烯酸类化合物为主要成份的紫外线固化性树脂;以尿烷丙烯酸酯低聚物和聚酯尿烷丙烯酸酯低聚物为主要成份的紫外线固化性树脂;以选自环氧类树脂、乙烯基酚类树脂中的至少一种为主要成份的紫外线固化性树脂等。
其中,从能够进一步提高上述树脂膜的初期附着性的方面考虑,优选以丙烯酸类化合物为主要成份的紫外线固化性树脂。作为上述丙烯酸类化合物,可以举出丙烯酸酯或者甲基丙烯酸酯的单体等,具体地说,可以举出二丙烯酸乙二醇酯、二甲基丙烯酸乙二醇酯、二丙烯酸1,6-己二醇酯、二甲基丙烯酸1,6-己二醇酯、二丙烯酸甘油酯、二甲基丙烯酸甘油酯、二丙烯酸1,10-癸二醇酯、二甲基丙烯酸1,10-癸二醇酯等的二官能团丙烯酸酯;三羟甲基丙烷三丙烯酸酯、三羟甲基丙烷三甲基丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇三甲基丙烯酸酯、二季戊四醇六丙烯酸酯、二季戊四醇六甲基丙烯酸酯等的多官能丙烯酸酯等。其中,优选为丙烯酸酯,特别优选为酯部分的碳原子数为1以上、15以下的丙烯酸酯或者甲基丙烯酸烷基酯。
对上述紫外线固化性树脂的含量没有特别的限制,但相对于上述热塑性树脂100重量份,优选为20重量份以上、55重量份以下,特别优选为30重量份以上、40重量份以下。若上述紫外线固化性树脂的含量在上述范围内,则能够抑制由于上述树脂膜的粘结性的降低、或者由于上述树脂膜和支撑基材之间的附着性过高而引起的上述树脂膜从支撑基材的剥离性的降低。
通过将上述紫外线固化性树脂进一步与作为分子内具有羟基的紫外线固化性树脂的丙烯酸酯或者甲基丙烯酸酯并用,由此容易控制上述树脂膜与被附着体之间的附着性或粘结剂的特性。
另外,对上述紫外线固化性树脂没有特别的限制,但优选常温下为液状。由此,能够特别降低最低熔融粘度,能够进一步提高低温粘结性。作为常温下为液状的紫外线固化性树脂,可以举出以上述丙烯酸化合物为主要成份的紫外线固化性树脂等。
另外,优选上述紫外线固化性树脂进一步与光聚合引发剂并用。由此,当难以从支撑基材剥离小片接合用树脂膜时,通过照射紫外线而固化小片接合用树脂膜的表面,从而能够使剥离变得容易。
作为上述光聚合引发剂,例如,可以举出而二苯甲酮、苯乙酮、苯偶因、苯偶因异丁醚、苯偶因安息香酸甲酯、苯偶因安息香酸、苯偶因甲醚、苄基苯基硫化物、联苯酰、二联苯酰、丁二酮等。
对上述光聚合引发剂的含量没有特别的限定,但相对于紫外线固化性树脂100重量份,优选为1重量份以上、30重量份以下,特别优选为3重量份以上、15重量份以下。若上述光聚合引发剂的含量在上述范围内,能够确实引发光聚合,而且,还可以抑制由于反应性过高而引起的储存性的下降。
对上述树脂膜没有特别的限制,从能够进一步提高上述树脂膜与被附着体之间的附着性和耐热性的方面考虑,优选作为其他成份包括具有氰酸酯基的有机化合物。
作为上述具有氰酸酯基的有机化合物,例如,可以举出双酚A二氰酸酯、双酚F二氰酸酯、二(4-氰酸酯基苯基)醚、双酚E二氰酸酯、氰酸酯酚醛清漆树脂等。
对上述具有氰酸酯基的有机化合物的含量没有特别的限定,但相对于上述热塑性树脂100重量份,优选为1重量份以上、50重量份以下,特别优选为3重量份以上、30重量份以下。若上述具有氰酸酯基的有机化合物的含量在上述范围内,则能够得到提高特别是上述树脂膜的附着性以及耐热性的效果。
若上述固化性树脂为环氧树脂,优选上述树脂膜含有固化剂(特别是酚类固化剂)。
作为上述固化剂,例如,可以举出二乙烯三胺(DETA)、三乙烯四胺(TETA)、间苯二甲胺(MXDA)等的脂肪族聚胺;二氨基二苯甲烷(DDM)、间苯二胺(MPDA)、二氨基二苯砜(DDS)等的芳香族聚胺;另外,可举出双氰胺(DICY)、含有有机酸二酰肼等的聚胺化合物等的胺类固化剂;六氢苯酐(HHPA)、甲基四氢苯酐(MTHPA)等的脂环族酸酐(液状酸酐);偏苯三酸酐(TMA)、均苯四甲酸二酐(PMDA)、苯酮四羧酸二酐(BTDA)等的芳香族酸酐等的酸酐类固化剂;酚醛树脂等的酚类固化剂。其中,优选酚类固化剂,具体地可以举出,二(4-羟基-3,5-二甲基苯基)甲烷(通常称作四甲基双酚F)、4,4’-硫二苯酚、4,4’-异亚丙基联苯酚(通常称作双酚A)、二(4-羟基苯基)甲烷、二(2-羟基苯基)甲烷、(2-羟基苯基)(4-羟基苯基)甲烷以及其中的二(4-羟基苯基)甲烷、二(2-羟基苯基)甲烷、(2-羟基苯基)(4-羟基苯基)甲烷的三种的混合物(例如,双酚F-D,本州化学工业株式会社制造)等的双酚类;1,2-苯二酚、1,3-苯二酚、1,4-苯二酚等的二羟基苯类;1,2,4-苯三酚等的三羟基苯类;1,6-二羟基萘等的二羟基萘类的各种异构体、2,2’-二苯酚、4,4’-二苯酚等二苯酚类的各种异构体等的化合物。
对上述环氧树脂的固化剂(特别是酚类固化剂)的含量没有特别的限制,但相对于上述环氧树脂100重量份,优选为1重量份以上、30重量份以下,更优选为3重量份以上、10重量份以下。若上述环氧树脂的固化剂的含量在上述范围内,则能够提高上述树脂膜的耐热性,并且能够抑制储存性的降低。
对上述树脂膜没有特别的限定,但从能够进一步提高上述树脂膜的耐热性方面考虑,优选进一步含有填充材料。
作为上述填充材料,例如,可以举出银、氧化钛、二氧化硅、云母等的无机填充材料;聚硅氧烷橡胶、聚酰亚胺等的微粒子的有机填充材料。其中,由于无机填充材料(特别是石英填充剂)能够进一步提高上述树脂膜的耐热性,故为优选。
对上述填充材料(特别是无机填充材料)的含量没有特别的限制,但相对于上述热塑性树脂100重量份,优选为1重量份以上、100重量份以下,特别优选为10重量份以上,50重量份以下。若上述填充材料的含量在上述范围内,则能够提高上述树脂膜的耐热性以及附着性。
对上述填充剂(特别是无机填充剂)的平均粒径没有特别的限定,但优选其平均粒径为0.1μm以上、25μm以下,特别优选为0.5μm以上、20μm以下。若平均粒径在上述范围内,则能够提高上述树脂膜的耐热性,并且能够抑制树脂膜粘结性的下降。在此,平均粒径可利用激光粒度分布仪等进行测定。
能够用于本发明的小片接合用树脂膜,例如,可通过将以上述热塑性树脂和上述固化性树脂为主要成份、且根据需要适当配合上述成份的树脂组合物,溶解在甲乙酮、丙酮、甲苯、二甲基甲酰胺(Dimethylformaldehyde)等的溶剂中,做成树脂清漆状态后,用逗号涂布机(commacoater)、模池涂布机(die coater)、凹版涂布机等将该树脂清漆涂布在支撑基材,进行干燥后,除去支撑基材的方法制得。作为该支撑基材,没有特别的限制,可以举出聚酰亚胺、聚对苯二甲酸乙二醇酯、特氟隆(テフロン)(注册商标)等。
对上述小片接合用树脂膜的厚度,没有特别的限定,优选3μm以上、100μm以下,特别优选为5μm以上、75μm以下。若上述小片接合用树脂膜的厚度在上述范围内,则能够特别容易控制上述小片接合用树脂膜的厚度的精度。
为了将能够用于本发明的小片接合用树脂膜的固化物在260℃下的弹性模量调整为1MPa以上、120MPa以下,优选将热时低弹性以及附着性优异的上述热塑性树脂(特别是丙烯酸类树脂)和耐热性及附着性优异的上述热固化性树脂(特别是环氧树脂)并用。根据所使用的热塑性树脂和热固化性树脂的种类适宜地调整并用比例,能够无上述小片接合用树脂膜的耐热性、附着性的降低而得到具有热时低弹性的上述小片接合用树脂膜的固化物,能够减少在上述小片接合用树脂膜内产生的应力。
下面,对使用了小片接合用树脂膜的半导体元件的粘结方法进行说明。
所得到的树脂膜可以用于半导体元件和印刷电路板、金属制的引线框、以及在玻璃纤维上浸渍了环氧树脂的基板、聚酰亚胺基板、双马来酰亚胺-三嗪树脂基板等的半导体元件装载用基板的粘结上。
作为粘结上述半导体元件的条件,可通过该树脂膜,将半导体元件和上述半导体元件装载用基板在温度为80℃以上、200℃以下,时间为0.1秒以上、30秒以下的条件下进行压焊。然后,根据需要进行引线接合、通过密封材料进行密封而能够得到半导体装置。另外,本发明的小片接合用树脂膜,同样也可以适用于构成叠层元件的半导体元件和半导体元件之间的接合中。
密封用树脂组合物(以下,也称作密封材料),是指对基板上装载的半导体元件等的电子零件进行密封而形成半导体装置的树脂组合物,用于本发明的密封用树脂组合物,其特征在于,以环氧树脂、酚醛树脂固化剂、固化促进剂、无机填充材料为主要成份,该密封用树脂组合物的固化物在260℃下的弹性模量为400MPa以上、1200MPa以下,且260℃下的热膨胀系数为20ppm以上、50ppm以下。
在此,弹性模量按以下方法测定。根据JISK6911,用传递模塑机在模具温度为175℃、注入压力为6.9MPa、固化时间为90秒的条件下,成型80mm×10mm×4mm(厚度)的密封用树脂组合物的试样,在175℃下进行2小时的后固化,在260℃下测定弹性模量(弯曲弹性值)。
另外,热膨胀系数按以下方法测定。用传递模塑机在模具温度为175℃、注入压力为6.9MPa、固化时间为90秒的条件下,成型10mm×4mm×4mm(厚度)的密封用树脂组合物的试样,在175℃下进行2小时的后固化,以5℃/分钟的升温速度进行TMA分析(热机械分析),从TMA曲线得到260℃下的热膨胀系数。
作为用于本发明的密封用树脂组合物的环氧树脂,是指具有环氧基的单体、低聚物、聚合物的全部的环氧树脂,例如,可以举出双酚型环氧树脂、联苯型环氧树脂、茋型环氧树脂、氢醌型环氧树脂、邻甲酚酚醛清漆型环氧树脂、三酚基甲烷型环氧树脂、苯酚芳烷基型(具有亚苯基骨架、联亚苯基骨架)环氧树脂、具有萘骨架的环氧树脂、二环戊二烯型环氧树脂等,这些既可以单独使用也可以混合使用。为了达到热时低弹性的目的,优选如二环戊二烯型环氧树脂的具有柔软结构的树脂。但是,由于如此的热时低弹性的树脂同时还具有热时高热膨胀性,所以裂纹性降低。因此,不仅由于无机填充材料的增量引起的低热膨胀化非常有必要,而且环氧树脂引起的低粘度化也很重要。因此,为了能够得到热时低弹性兼热时低热膨胀,优选采用联苯型环氧树脂、双酚型环氧树脂、苯酚芳烷基型环氧树脂等热时的柔软性和流动性的平衡良好的环氧树脂。另外,也可以不是单独使用而是将多个环氧树脂加以混合来谋求柔软性和流动性的平衡。
本发明的密封用树脂组合物中作为固化剂使用的酚醛树脂,是指能够与上述的环氧树脂起固化反应而形成交联结构的、至少在一分子内具有两个以上酚性羟基的单体、低聚物、聚合物的全部的酚醛树脂,例如,可以举出苯酚酚醛清漆树脂、甲酚酚醛清漆树脂、苯酚芳烷基(具有亚苯基骨架、联亚苯基骨架)树脂、萘酚芳烷基树脂、三酚基甲烷树脂、二环戊二烯型酚醛树脂等,这些既可以单独使用也可以混合使用。与环氧树脂同样,为了得到热时低弹性兼热时低热膨胀,优选采用苯酚芳烷基树脂、萘酚芳烷基树脂等的热时的柔软性和流动性的平衡良好的酚醛树脂。另外,也可以不是单独使用而是将多个酚醛树脂加以混合来谋求柔软性和流动性的平衡。
作为用于本发明的密封用树脂组合物中的全部环氧树脂的环氧基总数(a)和全部酚醛树脂的酚性羟基总数(b)的当量比(a/b),优选为0.5以上、2以下,特别优选为0.7以上、1.5以下。若该当量比在上述范围内,则能够抑制耐湿性、固化性等性能的下降。
上述环氧树脂以及酚醛树脂固化剂的含量,优选为全部密封用树脂组合物的5重量%以上、20重量%以下。若该含量在上述范围内,则能够抑制因热时热膨胀系数的增大而引起的耐裂纹性的降低、或流动性的降低。
作为本发明的密封用树脂组合物中使用的固化促进剂,是指能够作为上述环氧树脂和酚醛树脂的交联反应的催化剂的物质,例如,可以举出1,8-二氮杂双环(5,4,0)十一碳烯-7、三丁基胺等的胺类化合物;三苯基膦、四苯基鏻鎓·四苯基硼酸酯等的有机膦类化合物;2-甲基咪唑等的咪唑化合物等,但并不限于此,这些既可以单独使用也可以并用。优选上述固化剂在密封用树脂组合物总量中的含量为0.05重量%以上、2重量%以下。若该含量在上述范围之外,则固化性降低,或者流动性、适用期下降。
对本发明的密封用树脂组合物中使用的无机填充材料的种类没有特别的限制,可以使用通常的密封材料中使用的填充材料。例如,可以举出熔融石英、结晶石英、二次凝聚石英、氧化铝、钛白、氢氧化铝、滑石、粘土、玻璃纤维等的无机填充材料,这些既可以单独使用一种也可以两种以上并用。其中,特别优选为熔融石英。熔融石英可以使用破碎状、球状的任何一种,但为了提高配合量、且抑制密封用树脂组合物的熔融粘度的上升,更优选主要使用球状石英。为了进一步提高球状石英的配合量,优选使球状石英的粒度分布变宽。
从成型性、可靠性的平衡考虑,优选无机填充材料的总配合量在全部密封用树脂组合物中为80重量%以上、95重量%以下。若无机填充材料的配合量在上述范围内,则能够抑制热时的热膨胀系数的增大而引起的耐裂纹性的降低、或流动性的降低。随着填充材料量的增加,有热时弹性模量增大、热时热膨胀系数减少的倾向,为了根据热时低弹性和热时低膨胀而达到提高耐裂纹性的目的,通过填充材料、环氧树脂、酚醛树脂固化剂的组合来得到配合的平衡是非常重要的。
本发明的密封用树脂组合物,除了环氧树脂、酚醛树脂固化剂、固化促进剂、无机填充材料以外,根据需要,也可以适当地配合溴化环氧树脂、氧化锑、磷化合物等的阻燃剂;氧化铋水合物等的无机离子交换体;γ-环氧丙氧基丙基三甲氧基硅烷等的硅烷偶联剂;炭黑、氧化铁红等的着色剂;硅油、硅橡胶等的低应力成份;天然蜡、合成蜡、高级脂肪酸及其金属盐类或者石蜡等的脱模剂;抗氧化剂等的各种添加剂。
而且,根据需要,也可以预先将无机填充材料用偶联剂或环氧树脂或酚醛树脂进行处理后使用,作为其处理方法,可以举出用溶剂将无机填充材料和上述偶联剂等混合以后除去溶剂的方法;或者将上述偶联剂等直接添加在无机填充材料中,用混合机加以处理的方法等。在这些添加剂中,随着添加硅油、硅橡胶等的低应力成份,有热时弹性模量减少、热时热膨胀系数增大的倾向,通过适宜地调整低应力成份的配合量,能够提高裂纹性,但此时,通过填充材料、环氧树脂、酚醛树脂固化剂的组合来得到平衡是非常重要的。
为了将能够用于本发明的密封用树脂组合物的固化物在260℃下的弹性模量调整为400MPa以上、1200MPa以下,且将260℃下的热膨胀系数调整为20ppm以上、50ppm以下,优选使用联苯型环氧树脂、双酚型环氧树脂、苯酚芳烷基型环氧树脂等热时的柔软性和流动性的平衡良好的环氧树脂,及/或苯酚芳烷基树脂、萘酚芳烷基树脂等热时的柔软性和流动性的平衡良好的酚醛树脂,进一步使用具有更宽的粒度分布的球状石英,由此,将填充材料的总配合量相对于密封树脂组合物总量达到80%重量以上、95重量%以下的高填充程度。另外,在不超过本发明中特定的260℃下的热膨胀系数的上限值的范围内,可以添加硅油、硅橡胶等的低应力成份,从而降低密封树脂组合物的固化物在260℃下的弹性模量。
能够作为半导体元件等的密封材料使用的本发明的密封用树脂组合物,可通过用混合器在常温下将环氧树脂、酚醛树脂、固化促进剂、无机填充材料、其他添加剂加以混合,用轧辊、捏合机或者挤出机等的混炼机进行熔融混炼,冷却后加以粉碎而得到。
采用本发明的密封用树脂组合物对半导体元件等的电子零件进行密封而制造半导体装置时,可用传递模塑成型、压缩成型、注射成型等的以往的成型方法来固化成型。特别是,由于本发明的密封用树脂组合物的低应力性优异、且耐焊锡裂纹性良好,因此,最适合用于装载半导体元件或者叠层元件的区域安装型半导体装置中。
下面,对本发明的区域安装型半导体装置进行说明。本发明的区域安装型半导体装置,是通过小片接合用树脂组合物在基板的单表面上装载半导体元件,且通过密封用树脂组合物实质上仅对该基板的装载有该半导体元件的面进行密封的区域安装型半导体装置,其使用上述的小片接合用树脂组合物以及密封用树脂组合物。图1中示出本发明的装载了半导体元件的区域安装型半导体装置的一例。图1中,半导体装置8中形成有抗蚀层7以及焊锡珠6,但本发明并不限于该形态。
另外,本发明的区域安装型半导体装置,也可以是装载了叠层元件的区域安装型半导体装置,该叠层元件具有在上述半导体元件上,进一步层压与该半导体元件相同或不同的一个或者两个以上的半导体元件的叠层元件结构。图2中示出本发明的装载了叠层元件的区域安装型半导体装置的一例。在图2中,半导体装置8中形成有抗蚀层7以及焊锡珠6,但本发明并不限于该形态。
对用于本发明的区域安装型半导体装置的半导体元件,没有特别的限定,例如,是指逻辑元件、存储元件等的通常的半导体装置中使用的半导体元件。另外,叠层元件中的与该半导体元件不同的半导体元件,是指功能、结构等不同的半导体元件。
对装载了上述的半导体元件或叠层元件的区域安装型半导体装置的制造方法没有特别的限定,例如,可以例示以下方法。另外,参照图1说明装载了半导体元件的区域安装型半导体装置的制造方法,参照图2说明装载了叠层元件的区域安装型半导体装置的制造方法。
<装载了半导体元件的区域安装型半导体装置的制造方法>
(利用树脂膏的半导体元件的装载方法)
通过作为粘结剂层3的小片接合用树脂膏,将半导体元件4(半导体元件的尺寸:9mm×9mm,半导体元件的厚度:0.20mm)装载在作为基板2的双马来酰亚胺·三嗪树脂/玻璃纤维布基板(厚度:0.36mm,双马来酰亚胺·三嗪树脂:155pFPBGA(商品名、三菱气体化学社制造)、阻焊膜(Solder Resist):PSR4000AUS308(商品名、太阳油墨株式会社制造))上,在烤箱中固化而得到装载了半导体元件的基板。小片接合用树脂膏的固化条件为用30分钟从室温升温至175℃后,在175℃下保持30分钟。
(利用树脂膜的半导体元件的装载方法)
在60℃下,在树脂膜的单表面上粘贴厚度为0.20mm的形成有半导体元件的半导体晶片的背面(没有形成IC的面),得到接合了树脂膜的半导体晶片。然后,将切割膜(ダイシングフイルム)粘贴在该树脂膜的上面。接着,将接合了该树脂膜以及切割膜的半导体晶片,用切割锯以轴旋转速度为30,000rpm、切断速度为50mm/sec切断成尺寸为9mm×9mm的半导体元件。接着,从没有粘贴该切割膜的树脂膜的面向上顶所对应的半导体元件的中心部位,使切割膜从树脂膜剥离,得到只接合了树脂膜的半导体元件。
将接合有作为粘结剂层3的上述树脂膜的半导体元件4,在130℃、1MPa下向作为基板2的双马来酰亚胺·三嗪树脂/玻璃纤维布基板(厚度:0.36mm,双马来酰亚胺·三嗪树脂:155pFPBGA(商品名、三菱气体化学社制造),阻焊膜(Solder Resist):PSR4000AUS308(商品名、太阳油墨株式会社制造))上压焊1.0秒而焊接,在烤箱中进行固化得到装载了半导体元件的基板。树脂膜的固化条件为用30分钟从室温升温至180℃后,在180℃下保持60分钟。
(利用密封用树脂组合物的封装件成型方法)
根据需要,通过金线5等进行金线焊接等后,用传递模塑机,在模具温度为175℃、注入压力为6.9MPa、固化时间为90秒下,用作为密封树脂1的密封用树脂组合物,将用上述树脂膏或者树脂膜装载了半导体元件4的基板2,密封成型为16mm×16mm、厚度为0.7mm的尺寸后,在175℃下进行2小时的后固化,得到本发明的装载了半导体元件4的区域安装型半导体装置8(封装件)。
本发明的用小片接合用树脂组合物以及密封用树脂组合物而制造的、装载了半导体元件的区域安装型半导体装置,即使在电路基板上焊接接合该区域安装型半导体元件时的安装温度为比以往高的260℃,其低应力性以及耐回流裂纹性也优异。
<装载了叠层元件的区域安装型半导体装置的制造方法>
(利用树脂膏或者树脂膜的半导体元件的装载方法)
为了制造本发明的装载了叠层元件的区域安装型半导体装置8,首先,将第一半导体元件4a装载在基板2上。具体地说,除了将半导体元件的尺寸调整为10mm×10mm以及厚度为100μm之外,与上述“装载了半导体元件的区域安装型半导体装置的制造方法”的“利用树脂膏的半导体元件的装载方法”或者“利用树脂膜的半导体元件的装载方法”相同的方法,将第一半导体元件4a装载在基板2上。在此所使用的小片接合用树脂组合物固化后,成为粘结剂层3a。
另外,除了将半导体元件的尺寸调整为8mm×8mm以及厚度为100μm之外,与上述“利用树脂膜的半导体元件的装载方法”相同的方法,制造用于形成叠层元件的接合了树脂膜的第二半导体元件4b。在此,第二半导体元件4b与第一半导体元件4a既可以相同也可以不同。
接着,以与上述“利用树脂膜的半导体元件的装载方法”同样的压焊条件,在上述第一半导体元件4a上压焊第二半导体元件4b,得到装载了叠层元件9的基板。在此所使用的树脂膜在固化后成为第二粘结剂层3b。
(利用密封用树脂组合物的封装件成型方法)
将上述装载了叠层元件9的基板2,与上述“装载了半导体元件的区域安装型半导体装置的制造方法”的“利用密封用树脂组合物的封装件成型方法”同样,利用密封树脂组合物密封成型为16mm×16mm、厚度为0.7mm的尺寸以及进行后固化,得到本发明的装载了叠层元件9的区域安装型半导体装置8。
另外,作为将第二半导体元件4b装载在第一半导体元件4a上的方法,可以使用本发明的树脂膏,但是由于树脂膏有可能从叠层元件露出或者产生扩散,由此恐怕会对通过金线焊接的第一半导体元件和第二半导体元件的电接合或者对第二半导体元件和基板之间的电接合带来阻碍,因此,叠层元件的结构被限制。由此,当装载第二半导体元件时,优选采用树脂膜来粘贴。
另外,在本发明中,根据封装件的功能设计,也可以形成层压了两个以上半导体元件的叠层元件。关于用于第一半导体元件4a和第二半导体元件4b中的粘结剂、以及继第二半导体元件之后的半导体元件的粘贴中使用的粘结剂的物理性质,没有特别的限定,因此,也可以使用与本发明的树脂膏或者树脂膜不同的粘结剂。在此,若存在从叠层元件的结构对通过金线焊接的半导体元件和基板之间的电接合带来阻碍的可能性时,则优选使用树脂膜等。
在本发明的装载了叠层元件的区域安装型半导体装置中,由于向通过第一粘结剂层3a与基板2接合的第一半导体元件4a的应力变高,因此,至少用于第一半导体元件4a和基板2之间的粘贴中的树脂膏或者树脂膜的固化物在260℃下的弹性模量,必须在1MPa以上、120MPa以下。
另外,本发明的装载了叠层元件的区域安装型半导体装置,由于装载了多个半导体元件,因此,比起装载了半导体元件的区域安装型半导体装置,所要求的安装条件严格。例如,存在着比起装载了一个半导体元件的半导体装置,由于半导体元件的厚度变薄引起的半导体元件的脆弱化;以及伴随着相对于基板面积的第一半导体元件的占有面积的增大而引起的应力的增大等问题。但是,用本发明的小片接合用树脂组合物以及密封用树脂组合物制造的装载了叠层元件的区域安装型半导体装置,即使在电路基板上焊接接合该区域安装型半导体元件时的安装温度为比以往高的260℃,其低应力性以及耐回流裂纹性也优异。如此的本发明的装载了叠层元件的区域安装型半导体装置,能够应对半导体装置的进一步的小型化以及高性能化的要求。
实施例
下面,对本发明的实施例进行详细的说明,但本发明并不限定于这些实施例。配合比例为重量份。
(1)树脂膏的制作
根据表1的配合量,将下面的各成分在常温下进行混合后,用三轧辊(轧辊间隔为50μm/30μm)在室温下进行5次混炼,制作树脂膏P1~P5。将该树脂膏在真空室于2mmHg下脱泡30分钟后,按下面方法对各种特性进行评价。将评价结果示于表1中。
原料成分
所使用的原料成分如下:
·双酚A型环氧树脂(エピコ一ト828,环氧当量190;Japan EpoxyResins Co.,Ltd;制造以下称作BPA)
·加水双酚A型环氧树脂(YX-8000,环氧当量206;Japan EpoxyResins Co.,Ltd.制造;以下称作加水BPA)
·甲酚缩水甘油醚(m,p-CGE,环氧当量165;阪本药品工业株式会社制造;以下称作m,p-CGE)
·重复单元为四亚甲氧醚的用下述式(1)表示的二丙烯酸酯(NKエステルA-PTM65;新中村化学工业株式会社制造;以下称作A-PTM65)
·用下述式(2)表示的作为双酚A的环氧丙烷加成物的二丙烯酸酯(ライトアクリレ一トBP-4PA;共荣社化学株式会社制造;以下称作BP-4PA)
·1,6-己二醇二丙烯酸酯(ライトエステル1,6HX-A;共荣社化学株式会社制造;以下称作1,6HX-A)
·4,4’-双酚(双酚、羟基当量93;本州化学工业株式会社制造;以下称作BP)
·二氰二胺(以下称作DDA)
·2-苯基-4-甲基-5-羟甲基咪唑(キユアゾ一ル2P4MHZ;四国化成工业株式会社制造;以下称作2P4MHZ)
·过氧化二异丙苯(パ一クミルD;日本油脂株式会社制造;以下称作引发剂)
·具有缩水甘油基的硅烷偶联剂(KBM-403E;信越化学工业株式会社制造;以下称作环氧硅烷)
·银粉:平均粒径为3μm、最大粒径为30μm的片状银粉
·石英:平均粒径为2μm、最大粒径为20μm的球状石英
评价方法
·粘度:用E型粘度计(3°锥体),在树脂膏制作后测定25℃、2.5rpm下的数值。将粘度为15~25Pa·s时设定为合格。粘度的单位为Pa·s。
·弹性模量:在特氟隆(テフロン)(注册商标)薄板上,按照宽度4mm、长度约50mm、厚度200μm涂敷树脂膏,在175℃的烤箱中固化30分钟后,将树脂膏固化物从特氟隆(テフロン)(注册商标)薄板剥离,用动态粘弹性测定装置以试验长度为20mm、-100℃至300℃的升温速度为5℃/分钟、频率为10Hz进行测定,求出260℃下的贮存弹性模量。
(2)树脂膜的制作
<小片接合用树脂膜的树脂清漆的制作>
按照表2的配合量,将以下成份在常温下溶解于MEK,得到树脂固体成份为40%的树脂清漆。
<原料成份>
所使用的原料成份如下:
·丙烯酸酯共聚物(N,N-二甲基丙烯酰胺-丙烯晴-丙烯酸乙酯-甲基丙烯酸缩水甘油酯共聚物;ナガセケムテツクス株式会社制造;SG-80HDR;Tg:10℃;重均分子量:350,000;以下称作SG-80HDR)
·甲酚酚醛清漆环氧树脂(EOCN-1020-80、环氧当量200g/eq、熔点80℃;日本化药株式会社制造;以下称作EOCN-1020-80)
·氰酸酯树脂(L-10;バンテイコ株式会社制造;以下称作L-10)
·硅烷偶联剂(KBM-403E;信越化学株式会社制造;以下称作KBM-403E)
·硅烷偶联剂(KBM-573;信越化学株式会社制造;以下称作KBM-573)
·硅烷偶联剂(KBM5103;信越化学株式会社制造;以下称作KBM-5103)
·紫外线固化性树脂(1,6-己二醇二甲基丙烯酸酯、ライトエステル1,6HX;共荣社化学株式会社制造;以下称作1,6HX)
·光聚合引发剂(2,2-二甲氧基-二苯基乙烷-1-酮、IG651;チバ·スペシヤルテイ·ケミカルズ株式会社制造;以下称作IG651)
·固化促进剂(咪唑化合物、1B2MZ;四国化成株式会社制造;以下称作1B2MZ)
·溶剂(甲乙酮、以下称作MEK)
·石英(SE-2050、平均粒径0.5μm、最大粒径5μm;アドマテツクス株式会社制造;以下称作SE-2050)
<小片接合用树脂膜的制作>
用逗号涂布机(comma coater)将上述树脂清漆涂敷在作为支撑基材的聚对苯二甲酸乙二醇酯胶片(商品号:38RL-07(L)、厚度38μm;王子制纸社制造)上后,在70℃下干燥10分钟,剥离作为支撑基材的聚对苯二甲酸乙二醇酯胶片,得到厚度为25μm的小片接合用树脂膜F1~F3。按以下方法对所得到的小片接合用树脂膜F1~F3的特性进行了评价。将评价结果示于表2中。
<评价方法>
·弹性模量:将上述树脂膜在180℃的烤箱中加热固化60分钟后,用动态粘弹性测定装置以试验长度为20mm、-100℃至330℃的升温速度为5℃/分钟、频率为10Hz的条件进行测定,求出260℃下的贮存弹性模量。
(3)密封材料用树脂组合物的制作
按照表3的配合量,将下述成份在常温下用混合器加以混合后,在70~120℃下用双轧辊(轧辊间隔:1mm)进行混炼,冷却后加以粉碎而制作密封材料用树脂组合物。以下示出所使用的主要原料成份以及对所得到的树脂组合物的特性的评价方法。将评价结果示于表3中。
<用于密封材料用环氧树脂组合物的原料>
·环氧树脂1:联苯型环氧树脂(YX4000K、熔点105℃、环氧当量185;Japan Epoxy Resins Co.,Ltd.制造)
·环氧树脂2:具有联亚苯基骨架的苯酚芳烷基型环氧树脂(NC3000P、软化点58℃、环氧当量274;日本化药株式会社制造)
·酚醛树脂1:具有联亚苯基骨架的苯酚芳烷基树脂(MEH-7851SS、软化点65℃、羟基当量203;明和化成株式会社制造)
·酚醛树脂2:苯酚酚醛清漆树脂(软化点80℃、羟基当量105)
·球状熔融石英:平均粒径20μm
·偶联剂:γ-缩水甘油基丙基三甲氧基硅烷
·炭黑
·巴西棕闾蜡(Carnauba Wax)
·硅橡胶:平均粒径为3μm(トレフイルE-500,東レ·ダウニ一ニング·シリコ一ン株式会社制造)
<密封材料用树脂组合物的特性评价方法>
·旋流:用低压传递模塑机,在模具温度为175℃、注入压力为6.9MPa、固化时间为120秒的条件下,向根据EMMI-1-66的旋流测定用模具注入密封材料用树脂组合物,测定了流动长度。其单位为cm。
·TMA(热机械分析):用低压传递模塑机,在模具温度为175℃、注入压力为6.9MPa、固化时间为90秒的条件下,成型10mm×4mm×4mm(厚度)的密封用树脂组合物的固化物,在175℃下进行2小时的后固化,以升温速度5℃/分钟进行TMA分析。将所得到TMA曲线的60℃以及260℃下的热膨胀系数分别作为α1、α2,另外,读取60℃以及260℃下的TMA曲线的与切线相交的点的温度,将该温度作为玻璃化转变温度(Tg)。
·弯曲强度、弯曲弹性模量(260℃):根据JISK6911,用低压传递模塑机,在模具温度为175℃、注入压力为6.9MPa、固化时间为90秒的条件下,成型80mm×10mm×4mm(厚度)的密封材料用树脂组合物的试样,并在175℃下进行2小时的后固化,在260℃下测定弯曲强度、弯曲弹性模量。
(4)封装件评价方法
实施例1~19,比较例1~19
根据表4~7,装配封装件(半导体装置),并评价各种特性。将评价结果示于表4~7。实施例1~8以及比较例1~11为装载了半导体元件的区域安装型半导体装置,实施例9~19以及比较例12~19为装载了叠层元件的区域安装型半导体装置。
下面描述封装件的装配方法和封装件的评价方法。
<装载了半导体元件的区域安装型半导体装置的制造方法>
(利用树脂膏的半导体元件的装载方法)
通过小片接合用树脂膏,将半导体元件(半导体元件的尺寸:9mm×9mm,半导体元件的厚度:0.20mm)装载在双马来酰亚胺·三嗪树脂/玻璃纤维布基板(厚度:0.36mm;双马来酰亚胺·三嗪树脂:155pFPBGA(商品名、三菱气体化学社制造);阻焊膜(Solder Resist):PSR4000AUS308(商品名、太阳油墨株式会社制造))上,在烤箱中固化而得到装载了半导体元件的基板。小片接合用树脂膏的固化条件为用30分钟从室温升温至175℃后,在175℃下保持30分钟。固化后的树脂膏的厚度为约20μm。
(利用树脂膜的半导体元件的装载方法)
在树脂膜的单表面上,在60℃下粘贴形成有厚度为0.20mm的半导体元件的半导体晶片的背面(没有形成IC的面),得到接合了树脂膜的半导体晶片。然后,将切割膜粘贴在该树脂膜的上面。接着,将接合了该树脂膜以及切割膜的半导体晶片,用切割机以轴旋转速度为30,000rpm、切断速度为50mm/sec切断成尺寸为9mm×9mm的半导体元件。接着,从没有粘贴该切割膜的树脂膜的面向上顶所对应的半导体元件的中心部位,使切割膜从树脂膜剥离,得到只接合了树脂膜的半导体元件。
将接合有上述树脂膜的半导体元件,在130℃、1MPa下向双马来酰亚胺·三嗪树脂/玻璃纤维布基板(厚度:0.36mm;双马来酰亚胺·三嗪树脂:155pFPBGA(商品名、三菱气体化学社制造);阻焊膜(SolderResist):PSR4000AUS308(商品名、太阳油墨株式会社制造))上压焊1.0秒而焊接,在烤箱中进行固化而得到装载了半导体元件的基板。树脂膜的固化条件为用30分钟从室温升温至180℃后,在180℃下保持60分钟。
(利用密封用树脂组合物的封装件成型方法)
用传递模塑机,在模具温度为175℃、注入压力为6.9MPa、固化时间为90秒的条件下,用密封用树脂组合物,将用上述树脂膏或者树脂膜装载了半导体元件的基板,密封成型为16mm×16mm、厚度为0.7mm的尺寸后,在175℃下进行2小时的后固化,得到装载了半导体元件的区域安装型半导体装置(封装件)的试样。按照相同的方法,准备两组(16个×2)该试样。
<装载了叠层元件的区域安装型半导体装置的制造方法>
(利用树脂膏或者树脂膜的半导体元件的装载方法)
除了将半导体元件的尺寸调整为10mm×10mm以及厚度为100μm之外,以与上述“装载了半导体元件的区域安装型半导体装置的制造方法”的“利用树脂膏的半导体元件的装载方法”或者“利用树脂膜的半导体元件的装载方法”相同的方法,将第一半导体元件装载在基板上。
另外,除了将半导体元件的尺寸调整为8mm×8mm以及厚度为100μm之外,以与上述“利用树脂膜的半导体元件的装载方法”相同的方法,制造出用于形成叠层元件的接合了树脂膜的第二半导体元件。在此,第二半导体元件是与第一半导体元件相同的半导体元件。
接着,以与上述“利用树脂膜的半导体元件的装载方法”同样的压焊条件,在上述第一半导体元件上压焊第二半导体元件,得到装载了叠层元件的基板。
(利用密封用树脂组合物的封装件成型方法)
将上述装载了叠层元件的基板,与上述“装载了半导体元件的区域安装型半导体装置的制造方法”的“利用密封用树脂组合物的封装件成型方法”同样,利用密封树脂组合物密封成型为16mm×16mm、厚度为0.7mm的尺寸以及进行后固化,得到装载了叠层元件的区域安装型半导体装置(封装件)的试样。按照相同的方法,准备两组(16个×2)该试样。
<耐回流裂纹性评价方法>
在60℃、相对湿度60%的环境下,对一组(16个)试样进行120小时的加湿处理后,用IR回流(260℃)下处理10秒钟。另外,在85℃、相对湿度60%的环境下,对另一组(16个)试样进行168小时的加湿处理后,用IR回流(260℃)下处理10秒钟。用超声波探伤装置对处理后的各试样进行观察,确认是否有内部裂纹以及界面剥离。即使发现一处内部裂纹或者界面剥离也视为不良,将不良封装件数(n个)作为「n/16」示于表4~7中。
表1
P1 | P2 | P3 | P4 | P5 | ||
BPA | 7.7 | 21.5 | 15.4 | |||
加水BPA | 7.7 | 21.5 | ||||
m,p-CGE | 6.6 | 18.4 | 6.6 | |||
A-PTMG65 | 13.7 | |||||
BP-4PA | 4.9 | |||||
1,6HX-A | 5.9 | 14.7 | ||||
BP | 2.2 | 6.1 | 2.2 | |||
DDA | 0.2 | 0.6 | 0.2 | |||
2P4MHZ | 0.4 | 1.2 | 0.4 | |||
引发剂 | 0.2 | 0.2 | ||||
环氧硅烷 | 0.2 | 0.6 | 0.2 | 0.2 | 0.2 | |
银粉 | 75.0 | 80.0 | 75.0 | 80.0 | ||
石英 | 30.0 | |||||
粘度 | Pa·S | 20 | 16 | 18 | 22 | 23 |
弹性模量260℃ | MPa | 100 | 100 | 80 | 250 | 200 |
表2
F1 | F2 | F3 | ||
SG-80HDR | 100 | 100 | 100 | |
EOCN-1020-80L-10 | 4010 | 15030 | ||
1B2MZ | 3 | 3 | ||
KBM-403EKBM-573KBM-5103 | 514 | 5 | ||
1,6HXIG651 | 302 | 302 | 302 | |
SE-2050 | 250 | |||
弹性模量260℃ | MPa | 6 | 135 | 低于1 |
表3
C1 | C2 | C3 | C4 | C5 | ||
环氧树脂1 | 5.8 | 2.9 | 6.4 | 5.5 | 4.5 | |
环氧树脂2 | 2.9 | |||||
酚醛树脂1 | 2.1 | 5.2 | 2.3 | 0.9 | ||
酚醛树脂2 | 2.1 | 2.3 | 2.6 | 2.5 | ||
三苯基膦 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |
球状熔融石英 | 89.0 | 88.0 | 85.0 | 90.0 | 92.0 | |
偶联剂 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | |
炭黑 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | |
巴西棕榈蜡 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |
硅橡胶 | 3.0 | |||||
漩流 | cm | 150 | 120 | 200 | 140 | 80 |
α1 | ppm | 9 | 9 | 10 | 8 | 7 |
α2 | ppm | 44 | 35 | 57 | 42 | 25 |
Tg | ℃ | 150 | 140 | 150 | 150 | 155 |
弯曲强度260℃ | MPa | 25 | 20 | 22 | 30 | 33 |
弯曲弹性模量260℃ | MPa | 1100 | 600 | 800 | 1400 | 2200 |
表4
实施例 | |||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | ||
树脂膏 | P1 | ○ | ○ | ||||||
P2 | ○ | ○ | |||||||
P3 | ○ | ○ | |||||||
树脂膜 | F1 | ○ | ○ | ||||||
密封材料 | C1 | ○ | ○ | ○ | ○ | ||||
C2 | ○ | ○ | ○ | ○ | |||||
耐回流裂纹性(60℃/60%/120hr) | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | |
耐回流裂纹性(85℃/60%/168hr) | 2/16 | 2/16 | 1/16 | 0/16 | 1/16 | 0/16 | 0/16 | 0/16 |
表5
实施例 | |||||||||||||
9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18 | 19 | |||
基板—第一半导体元件 | 树脂膏 | P1 | ○ | ○ | ○ | ||||||||
P2 | ○ | ○ | |||||||||||
P3 | ○ | ○ | |||||||||||
树脂膜 | F1 | ○ | ○ | ○ | ○ | ||||||||
第一半导体元件—第二半导体元件 | 树脂膜 | F1 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ||||
F2 | ○ | ○ | ○ | ○ | |||||||||
密封材料 | C1 | ○ | ○ | ○ | ○ | ○ | ○ | ||||||
C2 | ○ | ○ | ○ | ○ | ○ | ||||||||
耐回流裂纹性(60℃/60%/120hr) | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | ||
耐回流裂纹性(85℃/60%/168hr) | 2/16 | 3/16 | 3/16 | 2/16 | 0/16 | 3/16 | 2/16 | 2/16 | 0/16 | 2/16 | 0/16 |
表6
比较例 | ||||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | ||
树脂膏 | P1 | ○ | ○ | ○ | ||||||||
P4 | ○ | ○ | ||||||||||
P5 | ○ | |||||||||||
树脂膜 | F1 | ○ | ○ | ○ | ||||||||
F2 | ○ | |||||||||||
F3 | ○ | |||||||||||
密封材料 | C1 | ○ | ○ | ○ | ○ | |||||||
C2 | ||||||||||||
C3 | ○ | ○ | ○ | |||||||||
C4 | ○ | ○ | ||||||||||
C5 | ○ | ○ | ||||||||||
耐回流裂纹性(60℃/60%/120hr) | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 0/16 | 16/16 | 7/16 | |
耐回流裂纹性(85℃/60%/168hr) | 10/16 | 5/16 | 6/16 | 11/16 | 10/16 | 6/16 | 10/16 | 13/16 | 10/16 | 16/16 | 16/16 |
表7
比较例 | ||||||||||
12 | 13 | 14 | 15 | 16 | 17 | 18 | 19 | |||
基板-第一半导体元件 | 树脂膏 | P4 | ○ | ○ | ||||||
P5 | ○ | |||||||||
树脂膜 | F1 | |||||||||
F2 | ○ | ○ | ||||||||
F3 | ○ | ○ | ○ | |||||||
第一半导体元件一第二半导体元件 | 树脂膜 | F1 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | |
F2 | ○ | |||||||||
密封材料 | C1 | ○ | ○ | ○ | ○ | |||||
C2 | ○ | |||||||||
C3 | ○ | |||||||||
C4 | ○ | |||||||||
C5 | ○ | |||||||||
耐回流裂纹性(60℃/60%/120hr) | 3/16 | 2/16 | 2/16 | 4/16 | 16/16 | 2/16 | 6/16 | 9/16 | ||
耐回流裂纹性(85℃/60%/168hr) | 12/16 | 10/16 | 5/16 | 7/16 | 16/16 | 9/16 | 10/16 | 14/16 |
产业上的利用可能性
使用本发明的小片接合用树脂组合物以及密封用树脂组合物的半导体装置,其低应力性优异、且耐焊锡裂纹性良好。因此,通过将本发明的小片接合用树脂组合物以及密封用树脂组合物适用于在印刷电路板或金属引线框等的基板的单表面上装载半导体元件或者叠层元件,实质上仅对装载了该半导体元件或叠层元件的面进行树脂密封的、所谓的区域安装型半导体装置,能够提高装载了半导体元件或叠层元件的区域安装型半导体装置的可靠性。
Claims (6)
1.一种区域安装型半导体装置,其通过小片接合用树脂组合物在基板的单表面上装载半导体元件、且通过密封用树脂组合物实质上仅对该基板的装载有该半导体元件的面进行密封,其特征在于,上述小片接合用树脂组合物的固化物在260℃下的弹性模量为1MPa以上、120MPa以下;上述密封用树脂组合物的固化物在260℃下的弹性模量为400MPa以上、1200MPa以下,且在260℃下的热膨胀系数为20ppm以上、50ppm以下。
2.根据权利要求1所述的区域安装型半导体装置,其中,其具有叠层元件结构,该叠层元件结构是在通过上述小片接合用树脂组合物装载在基板单表面的半导体元件上,进一步层压与该半导体元件相同或不同的一个或者两个以上的半导体元件的叠层元件结构。
3.一种小片接合用树脂组合物,其是用于区域安装型半导体装置的小片接合用树脂组合物,所述区域安装型半导体装置通过小片接合用树脂组合物在基板的单表面装载半导体元件、且通过密封用树脂组合物实质上仅对该基板的装载有该半导体元件的面进行密封,其特征在于,该小片接合用树脂组合物的固化物在260℃下的弹性模量为1MPa以上、120MPa以下。
4.根据权利要求3所述的小片接合用树脂组合物,其中,上述区域安装型半导体装置具有叠层元件结构,该叠层元件结构是在通过上述小片接合用树脂组合物装载在基板单表面的半导体元件上,进一步层压与该半导体元件相同或不同的一个或者两个以上的半导体元件的叠层元件结构。
5.一种密封用树脂组合物,其是用于区域安装型半导体装置的密封用树脂组合物,所述区域安装型半导体装置通过小片接合用树脂组合物在基板的单表面装载半导体元件、且通过密封用树脂组合物实质上仅对该基板的装载有半导体元件的面进行密封,其特征在于,该密封用树脂组合物的固化物在260℃下的弹性模量为400MPa以上、1200MPa以下,且在260℃下的热膨胀系数为20ppm以上、50ppm以下。
6.根据权利要求5所述的密封用树脂组合物,其中,上述区域安装型半导体装置具有叠层元件结构,该叠层元件结构是在通过上述小片接合用树脂组合物装载在基板单表面的半导体元件上,进一步层压与该半导体元件相同或不同的一个或者两个以上的半导体元件的叠层元件结构。
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JPWO2006101199A1 (ja) | 2008-09-04 |
TW200642055A (en) | 2006-12-01 |
US7560821B2 (en) | 2009-07-14 |
US20060226525A1 (en) | 2006-10-12 |
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