JP3872463B2 - プリント基板 - Google Patents
プリント基板 Download PDFInfo
- Publication number
- JP3872463B2 JP3872463B2 JP2003310094A JP2003310094A JP3872463B2 JP 3872463 B2 JP3872463 B2 JP 3872463B2 JP 2003310094 A JP2003310094 A JP 2003310094A JP 2003310094 A JP2003310094 A JP 2003310094A JP 3872463 B2 JP3872463 B2 JP 3872463B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- identification mark
- information
- displayed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Description
2 識別マーク
3 識別マーク
4 識別マーク
10 搬送ベルト
11 爪部
12 ハンダ槽
13 ガイド
Claims (2)
- 回路部品を実装したプリント基板において、前記回路部品の重量情報及び基準位置情報並びに前記回路部品の実装位置に関する設計情報により算出された前記プリント基板全体の重量分布と関連付けられた識別マークが表示されており、前記識別マークは、前記プリント基板の縁部に表示されて前記プリント基板のハンダ槽内における搬送方向の先端側又は後端側を表示していることを特徴とするプリント基板。
- 回路部品を実装したプリント基板において、前記回路部品の重量情報及び基準位置情報並びに前記回路部品の実装位置に関する設計情報により算出された前記プリント基板全体の重量分布と関連付けられた識別マークが表示されており、前記識別マークは、前記重量分布の最も重い部分を通るように表示されて前記プリント基板のハンダ槽内における搬送方向を示すように表示していることを特徴とするプリント基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003310094A JP3872463B2 (ja) | 2003-09-02 | 2003-09-02 | プリント基板 |
US10/931,892 US20050045370A1 (en) | 2003-09-02 | 2004-09-01 | Printed board and method of displaying an identification mark on the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003310094A JP3872463B2 (ja) | 2003-09-02 | 2003-09-02 | プリント基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005079446A JP2005079446A (ja) | 2005-03-24 |
JP3872463B2 true JP3872463B2 (ja) | 2007-01-24 |
Family
ID=34214209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003310094A Expired - Fee Related JP3872463B2 (ja) | 2003-09-02 | 2003-09-02 | プリント基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050045370A1 (ja) |
JP (1) | JP3872463B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9245061B2 (en) * | 2012-04-25 | 2016-01-26 | Shapeways, Inc. | Weight-based identification of three dimensional printed parts |
EP3529023B1 (en) | 2016-10-19 | 2022-05-25 | Shapeways, Inc. | Systems and methods for identifying three-dimensional printed objects |
CN116619921B (zh) * | 2023-06-25 | 2023-11-10 | 杭州兆臻网络科技有限公司 | 一种自助打印终端 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002298132A (ja) * | 2001-04-02 | 2002-10-11 | Fuji Mach Mfg Co Ltd | 撮像システム,撮像システム制御プログラムおよび電気部品装着システム |
US6999835B2 (en) * | 2001-07-23 | 2006-02-14 | Fuji Machine Mfg. Co., Ltd. | Circuit-substrate working system and electronic-circuit fabricating process |
JP2003208210A (ja) * | 2002-01-16 | 2003-07-25 | Fuji Mach Mfg Co Ltd | 生産機械 |
JP3997101B2 (ja) * | 2002-03-18 | 2007-10-24 | 富士機械製造株式会社 | 電子回路部品装着システム |
US6851831B2 (en) * | 2002-04-16 | 2005-02-08 | Gelcore Llc | Close packing LED assembly with versatile interconnect architecture |
-
2003
- 2003-09-02 JP JP2003310094A patent/JP3872463B2/ja not_active Expired - Fee Related
-
2004
- 2004-09-01 US US10/931,892 patent/US20050045370A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20050045370A1 (en) | 2005-03-03 |
JP2005079446A (ja) | 2005-03-24 |
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