JP3849842B2 - はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法 - Google Patents

はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法 Download PDF

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Publication number
JP3849842B2
JP3849842B2 JP2000218046A JP2000218046A JP3849842B2 JP 3849842 B2 JP3849842 B2 JP 3849842B2 JP 2000218046 A JP2000218046 A JP 2000218046A JP 2000218046 A JP2000218046 A JP 2000218046A JP 3849842 B2 JP3849842 B2 JP 3849842B2
Authority
JP
Japan
Prior art keywords
flux
soldering
electronic circuit
solder
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000218046A
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English (en)
Japanese (ja)
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JP2001170797A (ja
JP2001170797A5 (enExample
Inventor
寿之 阿部
稔 高谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2000218046A priority Critical patent/JP3849842B2/ja
Priority to TW089120637A priority patent/TW527253B/zh
Priority to US10/089,067 priority patent/US6915944B1/en
Priority to EP06076345A priority patent/EP1762329B1/en
Priority to DE60040311T priority patent/DE60040311D1/de
Priority to AT00964695T priority patent/ATE354451T1/de
Priority to AT06076345T priority patent/ATE408475T1/de
Priority to EP00964695A priority patent/EP1231016B1/en
Priority to DE60033552T priority patent/DE60033552T2/de
Priority to PCT/JP2000/006957 priority patent/WO2001024968A1/ja
Publication of JP2001170797A publication Critical patent/JP2001170797A/ja
Publication of JP2001170797A5 publication Critical patent/JP2001170797A5/ja
Application granted granted Critical
Publication of JP3849842B2 publication Critical patent/JP3849842B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP2000218046A 1999-10-05 2000-07-18 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法 Expired - Lifetime JP3849842B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2000218046A JP3849842B2 (ja) 1999-10-05 2000-07-18 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
TW089120637A TW527253B (en) 1999-10-05 2000-10-04 Soldering flux, soldering paste and soldering process
PCT/JP2000/006957 WO2001024968A1 (en) 1999-10-05 2000-10-05 Soldering flux, solder paste and method of soldering
DE60040311T DE60040311D1 (de) 1999-10-05 2000-10-05 Lötmittel, Lötpaste und Lötverfahren
AT00964695T ATE354451T1 (de) 1999-10-05 2000-10-05 Lötmittel, lötpaste und lötverfahren
AT06076345T ATE408475T1 (de) 1999-10-05 2000-10-05 Lötmittel, lötpaste und lötverfahren
US10/089,067 US6915944B1 (en) 1999-10-05 2000-10-05 Soldering flux, solder paste and method of soldering
DE60033552T DE60033552T2 (de) 1999-10-05 2000-10-05 Lötmittel, lötpaste und lötverfahren
EP06076345A EP1762329B1 (en) 1999-10-05 2000-10-05 Soldering flux, soldering paste and method of soldering
EP00964695A EP1231016B1 (en) 1999-10-05 2000-10-05 Soldering flux, solder paste and method of soldering

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28485999 1999-10-05
JP11-284859 1999-10-05
JP2000218046A JP3849842B2 (ja) 1999-10-05 2000-07-18 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法

Publications (3)

Publication Number Publication Date
JP2001170797A JP2001170797A (ja) 2001-06-26
JP2001170797A5 JP2001170797A5 (enExample) 2005-12-15
JP3849842B2 true JP3849842B2 (ja) 2006-11-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000218046A Expired - Lifetime JP3849842B2 (ja) 1999-10-05 2000-07-18 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法

Country Status (1)

Country Link
JP (1) JP3849842B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP2005072173A (ja) * 2003-08-22 2005-03-17 Senju Metal Ind Co Ltd 電子部品およびソルダペースト
WO2007018288A1 (ja) 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. 鉛フリーソルダペーストとその応用
JP4535050B2 (ja) * 2005-09-27 2010-09-01 パナソニック電工株式会社 熱硬化性樹脂組成物及びその製造方法
EP2052805B1 (en) * 2006-08-04 2016-09-28 Panasonic Intellectual Property Management Co., Ltd. Bonding material, bonded portion and circuit board
JP5411503B2 (ja) * 2006-08-28 2014-02-12 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法並びに回路基板
JP5052857B2 (ja) * 2006-10-13 2012-10-17 株式会社フジクラ 導電性組成物およびこれを用いた導電体、導電回路の形成方法
JP5468199B2 (ja) * 2006-11-22 2014-04-09 日立化成株式会社 導電性接着剤組成物、電子部品搭載基板及び半導体装置
CN101809107B (zh) 2007-10-03 2013-02-06 日立化成工业株式会社 粘接剂组合物、使用其的搭载有电子部件的基板和半导体装置
JP5373464B2 (ja) * 2008-04-23 2013-12-18 パナソニック株式会社 導電性ペーストおよびこれを用いた実装構造体
JP5464463B2 (ja) * 2008-09-25 2014-04-09 パナソニック株式会社 熱硬化性樹脂組成物及び回路基板
TWI523127B (zh) * 2008-10-27 2016-02-21 松下知識產權經營股份有限公司 電子裝置之製造方法
CN102576766A (zh) * 2009-10-15 2012-07-11 日立化成工业株式会社 导电性粘接剂、太阳能电池及其制造方法、以及太阳能电池模块
JP5900350B2 (ja) * 2011-01-27 2016-04-06 日立化成株式会社 導電性接着剤組成物、接続体及び太陽電池モジュール
JP5952849B2 (ja) * 2014-03-25 2016-07-13 岡村製油株式会社 フラックス及びソルダペースト
US10813228B2 (en) * 2018-06-22 2020-10-20 Indium Corporation Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material

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JP2001170797A (ja) 2001-06-26

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