JP3831937B2 - 電子部品用パッケージ - Google Patents

電子部品用パッケージ Download PDF

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Publication number
JP3831937B2
JP3831937B2 JP2001106252A JP2001106252A JP3831937B2 JP 3831937 B2 JP3831937 B2 JP 3831937B2 JP 2001106252 A JP2001106252 A JP 2001106252A JP 2001106252 A JP2001106252 A JP 2001106252A JP 3831937 B2 JP3831937 B2 JP 3831937B2
Authority
JP
Japan
Prior art keywords
metal layer
container
lid
opening frame
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001106252A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002299481A (ja
JP2002299481A5 (enExample
Inventor
洋二 永野
昌一 永松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Epson Toyocom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP2001106252A priority Critical patent/JP3831937B2/ja
Publication of JP2002299481A publication Critical patent/JP2002299481A/ja
Publication of JP2002299481A5 publication Critical patent/JP2002299481A5/ja
Application granted granted Critical
Publication of JP3831937B2 publication Critical patent/JP3831937B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2001106252A 2001-04-04 2001-04-04 電子部品用パッケージ Expired - Fee Related JP3831937B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001106252A JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001106252A JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Publications (3)

Publication Number Publication Date
JP2002299481A JP2002299481A (ja) 2002-10-11
JP2002299481A5 JP2002299481A5 (enExample) 2004-11-25
JP3831937B2 true JP3831937B2 (ja) 2006-10-11

Family

ID=18958792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001106252A Expired - Fee Related JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Country Status (1)

Country Link
JP (1) JP3831937B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7569926B2 (en) * 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
JP6305713B2 (ja) * 2013-09-24 2018-04-04 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージの製造方法

Also Published As

Publication number Publication date
JP2002299481A (ja) 2002-10-11

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