JP2002299481A5 - - Google Patents

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Publication number
JP2002299481A5
JP2002299481A5 JP2001106252A JP2001106252A JP2002299481A5 JP 2002299481 A5 JP2002299481 A5 JP 2002299481A5 JP 2001106252 A JP2001106252 A JP 2001106252A JP 2001106252 A JP2001106252 A JP 2001106252A JP 2002299481 A5 JP2002299481 A5 JP 2002299481A5
Authority
JP
Japan
Prior art keywords
electronic component
metal layer
container
opening frame
component package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001106252A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002299481A (ja
JP3831937B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001106252A priority Critical patent/JP3831937B2/ja
Priority claimed from JP2001106252A external-priority patent/JP3831937B2/ja
Publication of JP2002299481A publication Critical patent/JP2002299481A/ja
Publication of JP2002299481A5 publication Critical patent/JP2002299481A5/ja
Application granted granted Critical
Publication of JP3831937B2 publication Critical patent/JP3831937B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001106252A 2001-04-04 2001-04-04 電子部品用パッケージ Expired - Fee Related JP3831937B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001106252A JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001106252A JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Publications (3)

Publication Number Publication Date
JP2002299481A JP2002299481A (ja) 2002-10-11
JP2002299481A5 true JP2002299481A5 (enExample) 2004-11-25
JP3831937B2 JP3831937B2 (ja) 2006-10-11

Family

ID=18958792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001106252A Expired - Fee Related JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Country Status (1)

Country Link
JP (1) JP3831937B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7569926B2 (en) * 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
JP6305713B2 (ja) * 2013-09-24 2018-04-04 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージの製造方法

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