JP2002299481A5 - - Google Patents

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Publication number
JP2002299481A5
JP2002299481A5 JP2001106252A JP2001106252A JP2002299481A5 JP 2002299481 A5 JP2002299481 A5 JP 2002299481A5 JP 2001106252 A JP2001106252 A JP 2001106252A JP 2001106252 A JP2001106252 A JP 2001106252A JP 2002299481 A5 JP2002299481 A5 JP 2002299481A5
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Japan
Prior art keywords
electronic component
metal layer
container
opening frame
component package
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JP2001106252A
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Japanese (ja)
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JP3831937B2 (en
JP2002299481A (en
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Publication date
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Priority to JP2001106252A priority Critical patent/JP3831937B2/en
Priority claimed from JP2001106252A external-priority patent/JP3831937B2/en
Publication of JP2002299481A publication Critical patent/JP2002299481A/en
Publication of JP2002299481A5 publication Critical patent/JP2002299481A5/ja
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Publication of JP3831937B2 publication Critical patent/JP3831937B2/en
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Expired - Fee Related legal-status Critical Current

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Claims (11)

電子部品を収容する上面が開口した箱形の容器であって、当該容器の開口枠の上端に蓋を密着して容器内を封止する構造の電子部品用パッケージに於いて、
前記開口枠の上端面には金属層が形成されており、該金属層は上方に凸部を有するものであり、
前記開口枠の幅を０．４±０．１ｍｍとし、
前記凸部の幅を０．１５±０．０５ｍｍとし、
前記凸部の高さを５乃至２０μｍとしたことを特徴とする電子部品用パッケージ。An electronic component package having a box- shaped container having an open top surface for housing an electronic component , wherein the lid is in close contact with an upper end of an opening frame of the container to seal the inside of the container .
A metal layer is formed on the upper end surface of the opening frame , and the metal layer has a convex portion upward,
The width of the opening frame is 0.4 ± 0.1 mm,
The width of the protrusion is 0.15 ± 0.05 mm,
An electronic component package, wherein the height of the convex portion is 5 to 20 μm. 電子部品を収容する上面が開口した箱形の容器であって、当該容器の開口枠の上端に蓋を密着して容器内を封止する構造の電子部品用パッケージに於いて、
前記開口枠の上端面には金属層が形成されており、該金属層は上方に凸部を有するものであり、
前記開口枠の幅を０．４±０．１ｍｍとし、
前記凸部の幅を０．１５±０．０５ｍｍとし、
前記凸部の高さを１０乃至１５μｍとしたことを特徴とする電子部品用パッケージ。An electronic component package having a box- shaped container having an open top surface for housing an electronic component , wherein the lid is in close contact with an upper end of an opening frame of the container to seal the inside of the container .
A metal layer is formed on the upper end surface of the opening frame , and the metal layer has a convex portion upward,
The width of the opening frame is 0.4 ± 0.1 mm,
The width of the protrusion is 0.15 ± 0.05 mm,
An electronic component package, wherein the height of the convex portion is 10 to 15 μm. 電子部品を収容する上面が開口した箱形の容器と、当該容器の開口枠の上端に密着して容器内を封止する蓋とを備えた電子部品用パッケージに於いて、  An electronic component package including a box-shaped container having an open top surface for housing an electronic component, and a lid for sealing the inside of the container by being in close contact with an upper end of an opening frame of the container.
前記開口枠の上端面には金属層が形成されており、該金属層は上方に凸部を有するものであり、  A metal layer is formed on the upper end surface of the opening frame, and the metal layer has a convex portion upward,
前記開口枠の幅を０．４±０．１ｍｍとし、  The width of the opening frame is 0.4 ± 0.1 mm,
前記凸部の幅を０．１５±０．０５ｍｍとし、  The width of the protrusion is 0.15 ± 0.05 mm,
前記凸部の高さを５乃至２０μｍとしたことを特徴とする電子部品用パッケージ。  An electronic component package, wherein the height of the convex portion is 5 to 20 μm. 電子部品を収容する上面が開口した箱形の容器と、当該容器の開口枠の上端に密着して容器内を封止する蓋とを備えた電子部品用パッケージに於いて、  An electronic component package including a box-shaped container having an open top surface for housing an electronic component, and a lid for sealing the inside of the container by being in close contact with an upper end of an opening frame of the container.
前記開口枠の上端面には金属層が形成されており、該金属層は上方に凸部を有するものであり、  A metal layer is formed on the upper end surface of the opening frame, and the metal layer has a convex portion upward,
前記開口枠の幅を０．４±０．１ｍｍとし、  The width of the opening frame is 0.4 ± 0.1 mm,
前記凸部の幅を０．１５±０．０５ｍｍとし、  The width of the protrusion is 0.15 ± 0.05 mm,
前記凸部の高さを１０乃至１５μｍとしたことを特徴とする電子部品用パッケージ。  An electronic component package, wherein the height of the projections is 10 to 15 μm. 電子部品を収容する上面が開口した箱形の容器と、当該容器の開口枠の上端に密着して容器内を封止する蓋とを備えた電子部品用パッケージに於いて、
前記開口枠の上端面には第１の金属層が設けられ、該第１の金属層上の幅方向中央には第２の金属層が設けられており、
前記開口枠の幅を０．４±０．１ｍｍとし、
前記第２の金属層の幅を０．１５±０．０５ｍｍとし、
前記第２の金属層の高さを５乃至２０μｍとしたことを特徴とする電子部品用パッケージ。 An electronic component package including a box-shaped container having an open top surface for housing an electronic component, and a lid for sealing the inside of the container by being in close contact with an upper end of an opening frame of the container.
A first metal layer is provided on an upper end surface of the opening frame, and a second metal layer is provided at the center in the width direction on the first metal layer,
The width of the opening frame is 0.4 ± 0.1 mm,
The width of the second metal layer is 0.15 ± 0.05 mm,
An electronic component package, wherein the height of the second metal layer is 5 to 20 μm. 電子部品を収容する上面が開口した箱形の容器と、当該容器の開口枠の上端に密着して容器内を封止する蓋とを備えた電子部品用パッケージに於いて、
前記開口枠の上端面には第１の金属層が設けられ、該第１の金属層上の幅方向中央には第２の金属層が設けられており、
前記開口枠の幅を０．４±０．１ｍｍとし、
前記第２の金属層の幅を０．１５±０．０５ｍｍとし、
前記第２の金属層の高さを１０乃至１５μｍとしたことを特徴とする電子部品用パッケ ージ。 An electronic component package including a box-shaped container having an open top surface for housing an electronic component, and a lid for sealing the inside of the container by being in close contact with an upper end of an opening frame of the container.
A first metal layer is provided on an upper end surface of the opening frame, and a second metal layer is provided at the center in the width direction on the first metal layer,
The width of the opening frame is 0.4 ± 0.1 mm,
The width of the second metal layer is 0.15 ± 0.05 mm,
The electronic component package in which the height of the second metal layer, characterized in that a 10 to 15 [mu] m. 前記蓋は、少なくとも前記開口枠と接合される部分に金属面を有していることを特徴とする請求項３乃至６のいずれかに記載の電子部品用パッケージ。  The electronic component package according to any one of claims 3 to 6, wherein the lid has a metal surface at least at a portion joined to the opening frame. 前記容器の金属層と前記蓋の金属面との間をろう材にて接合することを特徴とする請求項７に記載の電子部品用パッケージ。  The electronic component package according to claim 7, wherein the metal layer of the container and the metal surface of the lid are joined with a brazing material. 前記蓋の金属面にろう材をクラッド化しておき、前記容器の金属層と前記蓋の金属面との間を該ろう材にて接合したものであることを特徴とする請求項７又は８に記載の電子部品用パッケージ。  9. The method according to claim 7, wherein a brazing material is clad on the metal surface of the lid, and the metal layer of the container and the metal surface of the lid are joined by the brazing material. Electronic component package as described. 前記ろう材の厚みを約３０μｍとしたことを特徴とする請求項８又は９に記載の電子部品用パッケージ。  The electronic component package according to claim 8, wherein the thickness of the brazing material is about 30 μm. 前記容器の金属層と前記蓋の金属面との間の接合をパルスヒート方式の加熱法にて接合したことを特徴とする請求項８乃至１０のいずれかに記載の電子部品用パッケージ。  The electronic component package according to any one of claims 8 to 10, wherein the metal layer of the container and the metal surface of the lid are bonded by a pulse heating heating method.
JP2001106252A 2001-04-04 2001-04-04 Package for electronic components Expired - Fee Related JP3831937B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001106252A JP3831937B2 (en) 2001-04-04 2001-04-04 Package for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001106252A JP3831937B2 (en) 2001-04-04 2001-04-04 Package for electronic components

Publications (3)

Publication Number Publication Date
JP2002299481A JP2002299481A (en) 2002-10-11
JP2002299481A5 true JP2002299481A5 (en) 2004-11-25
JP3831937B2 JP3831937B2 (en) 2006-10-11

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JP2001106252A Expired - Fee Related JP3831937B2 (en) 2001-04-04 2001-04-04 Package for electronic components

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7569926B2 (en) * 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
JP6305713B2 (en) * 2013-09-24 2018-04-04 Ｎｇｋエレクトロデバイス株式会社 Manufacturing method of electronic component storage package

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