JP2005353885A - Manufacturing method of electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity and to reduce costs for manufacturing by making operation of sealing a lead to a base easy in an electronic device for sealing a package using brazing filler metal. <P>SOLUTION: On one surface, a base plate 2 is formed of a plurality of bases 1 each having a cavity 7, an electrode and a wiring pattern 5, and a piezoelectric vibration piece 6 is fixed in the cavity of each base. A lid plate 11 is formed of a plurality of lids 10, and the brazing filler metal 12 is stuck to the other surface. The base plate and the lid plate are superposed, and the brazing filler is melted with a laser beam to adhere and seal the lid to each base airtight. After cutting the lid plate with the laser beam into individual pieces, the base plate is cut off by dicing along the outer shape of each base to divide a piezoelectric vibrator into individual pieces. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a piezoelectric device, a semiconductor device, and other electronic devices in which an electronic component such as a piezoelectric vibrating piece or a semiconductor integrated circuit (IC) chip is mounted in a package and hermetically sealed, and in particular, a metal brazing material. The present invention relates to a method for manufacturing an electronic device that seals a package by using the.

  As electronic devices have become smaller and thinner, piezoelectric devices and other electronic devices are required to be smaller and thinner, and surface mount devices that are suitable for mounting on circuit boards and the like are often used. Has been. In general, surface-mount type electronic devices are widely adopted in which electronic parts such as piezoelectric vibrating reeds are mounted on a package made of an insulating material such as ceramic, and a metal lid is joined with a metal brazing material to seal it. Has been.

  In these packages, for example, a method is known in which a metal plating layer is formed on a seal ring brazed to the peripheral edge of the package, a metal plating layer is formed on a metal cap, and the melt bonding is performed by seam welding (see FIG. For example, see Patent Document 1). Further, a metallized portion is provided by metal plating on the outer peripheral frame of the ceramic container, a metal brazing material is attached to one side of a lid made of a metal plate, and the metal brazing material is irradiated with the metal beam while being in contact with the metal brazing material. There is known a method of sealing a package by melting them and welding them (see, for example, Patent Document 2).

  Further, in Patent Document 1, a metal plating layer is formed on the peripheral edge of the base, a metal lid is stacked thereon, and the lid is directly melted with a laser beam or an electron beam and bonded to form a hermetic seal. Is disclosed. In Patent Document 1, a metallized portion provided on an outer peripheral frame of a ceramic container and a metal brazing material attached to one surface of a metal lid are overlapped, and a seam is applied by pressing and energizing with a roller electrode. A method of welding is disclosed.

JP-A-8-46075 JP 2000-3973 A

  However, any of the above-described conventional techniques joins a base and a lid that are separated into pieces, and when joining them, it is necessary to position the base and the lid so as to match each other. Therefore, there is a problem that handling of the base and the lid is troublesome, requiring a lot of labor and labor, and lowering the productivity. In particular, in the case of sealing using a laser beam, since the main sealing is performed after positioning and temporarily attaching the lid, a large-sized device is required exclusively for temporary attachment, which causes an increase in manufacturing cost. Further, since the metal brazing filler material is adhered to each lid, it takes much labor and labor, and the price of the lid is high.

  Therefore, the present invention has been made in view of the above-described conventional problems, and an object of the present invention is to facilitate the work of sealing a lid on a base in an electronic device that seals a package using a metal brazing material. Another object of the present invention is to provide an electronic device manufacturing method capable of improving productivity and reducing manufacturing costs.

  According to the present invention, in order to achieve the above object, a base plate composed of a plurality of bases each having a cavity opened on one surface thereof, an electrode, and a wiring pattern is formed, and in each base cavity, For example, a step of fixing and electrically connecting an electronic component that is a piezoelectric vibrating piece, and forming a metal lid plate composed of a plurality of lids having a predetermined outer dimension, and attaching a metal brazing material to one surface thereof And forming a plurality of narrow grooves that define the outer shape of the lid, and superimposing the one surface of the lid plate on the one surface of the base plate with each base and each lid aligned, A process of melting the metal brazing material by, for example, laser beam, electron beam or seam welding while pressing the lid against the corresponding base, and sealingly bonding the lid to each base; The head plate is cut along the outer shape of the base and the lid, a method for fabricating an electronic device and a step of singulating electronic device is provided.

  In this way, by using a base plate composed of a plurality of bases and a lid plate composed of a plurality of lids, the number of parts can be reduced and the part cost can be reduced. Since the sealing can be performed, it is not necessary to align the individual base and the lid individually, and the handling of the base and the lid and the sealing work are simplified. Therefore, productivity can be improved and manufacturing cost can be reduced. In particular, when a laser beam is used, there is no need to use a dedicated tacking apparatus as in the prior art, so that the sealing process becomes simpler and its workability is improved, and the manufacturing cost is further reduced. Furthermore, since the lid plate bends when the lid is pressed against the base plate by a narrow groove provided so as to define the outer shape of each lid, the plane of the base plate that may occur particularly when formed from a ceramic sheet material, etc. The internal bending can be absorbed for each base, whereby a good bonding state and hermetic sealing performance can be obtained for the entire base plate.

  According to another aspect of the present invention, a plurality of bases having an open cavity, an electrode, and a wiring pattern are formed on one surface of the base, and electronic components are fixed and electrically connected to the cavities of the bases. A step of connecting, a step of forming a lid plate made of a plurality of lids having a predetermined outer dimension, and attaching a metal brazing material to one surface thereof, and the one of each base on the one surface of the lid plate Each base and each lid are aligned and overlapped, and each lid is pressed against the corresponding base, and the metal brazing material is melted by, for example, laser beam, electron beam or seam welding, and the lid is attached to each base. A method of manufacturing an electronic device is provided, which includes a step of hermetically bonding and sealing and a step of cutting the lid plate along the outer shape of the lid and separating the electronic device into individual pieces.

  By using a lid plate made up of a plurality of lids in this way, the number of parts can be reduced and the cost of parts can be reduced, and the individual bases can be aligned and overlapped on the lid board to seal them together. Since it can be stopped, it is not necessary to individually align the individual base and the lid, and the handling and sealing work of the base and the lid are simplified. Therefore, productivity can be improved and manufacturing cost can be reduced. In particular, when a laser beam is used, there is no need to use a dedicated tacking apparatus as in the prior art, so that the sealing process becomes simpler and its workability is improved, and the manufacturing cost is further reduced. Furthermore, since the lid plate bends when the lid is pressed against the base plate by a narrow groove provided so as to define the outer shape of each lid, the plane of the base plate that may occur particularly when formed from a ceramic sheet material, etc. The internal bending can be absorbed for each base, whereby a good bonding state and hermetic sealing performance can be obtained for the entire base plate.

  In one embodiment, by cutting the lid plate with a laser beam, the cut surface where the base material is exposed can be oxidized by the high heat of the laser beam, so that a rust prevention effect can be obtained.

The process of manufacturing a piezoelectric vibrator as an electronic device will be described in detail below using a preferred embodiment of the method according to the present invention with reference to the accompanying drawings.
According to the first embodiment of the present invention, as shown in FIG. 1A, a base plate 2 composed of a large number of bases 1 is formed. The base plate 2 is formed by laminating and bonding two ceramic sheets 3 and 4 as shown in FIG. As shown in FIG. 2B, the lower ceramic sheet 3 has a predetermined number of electrodes and wiring patterns 5 necessary for mounting the piezoelectric vibrating reed continuously formed in advance in the vertical and horizontal directions. Yes. In the upper ceramic sheet 4, a predetermined number of openings 6 necessary for defining a cavity for housing the piezoelectric vibrating piece are continuously formed in the vertical and horizontal directions. These ceramic sheets 3 and 4 form a base plate 2 in which the predetermined number of bases 1 having the cavities 7 opened on the upper surface thereof are continuously formed in the vertical and horizontal directions. Further, a metal plating layer 8 similar to the prior art is formed on the upper surface of the base plate 2 with a uniform film thickness. On each base 1 of the base plate 2, a piezoelectric vibrating piece 9 is mounted in a cavity 7 and connected and fixed to the electrode.

  Further, in this embodiment, as shown in FIG. 3A, a lid plate 11 composed of the predetermined number of lids 10 corresponding to each base 1 of the base plate 2 is formed. The lid plate 11 is formed of a metal plate having a predetermined thickness made of a NiFe alloy such as Kovar (trade name), NSD (42 alloy), NSI (42 alloy), and the entire surface thereof is plated with nickel. Has been. On one surface of the lid plate 11, a metal brazing material 12 such as Au / Sn, Au / Cu, solder, silver brazing or the like as a sealing material is attached to the entire surface with a uniform thickness.

  Further, as shown in FIG. 3 (B), the lid plate 11 sandwiches short connecting portions provided near the corners of each lid 10 so that both sides define the outer shape 13 of each lid 10. A plurality of narrow grooves 14 having a constant width extending in the vertical direction or the horizontal direction. Further, the outer shape 15 of the base 1 corresponding to each lid 10 passes through the center of each narrow groove 14.

  In order to hermetically seal each base with a lid, as shown in FIG. 4, the base plate 2 is disposed at a predetermined position with the cavity 7 side facing upward, and the lid plate 11 is placed on the metal brazing material 12 side. Overlapping with facing down. In this embodiment, each base 1 and lid 10 can be aligned by aligning the base plate 2 and the lid plate 11, so that it is necessary to align the individual bases and lids as in the prior art. There is no. Therefore, handling is easy, work is easy, and productivity is improved.

  In this embodiment, an urging means 16 comprising a spring for urging each lid 10 of the lid plate 11 downward is provided. The base plate 2 made of a laminate of ceramic sheets is actually difficult to manufacture completely flat, and has some bending depending on its position in the plane. In this embodiment, each lid 10 of the lid plate 11 is provided with the narrow groove 14 so as to surround the outer periphery thereof, so that it can be slightly displaced downward by the action of the urging means 16. Thereby, the bending of the base plate 2 can be absorbed for each base 1, and the lid 10 can be pressed and brought into contact with each base 1 almost uniformly. In another embodiment, the biasing means 16 can be replaced with an elastic body such as rubber or a pressurizing means using fluid pressure such as air.

  In this state, the base plate 2 and the lid plate 11 are transported into the sealing device. After the inside of the sealing device is depressurized to a vacuum or further replaced with a nitrogen atmosphere, a laser beam A is irradiated to a portion where the upper end surface of each base 1 and the corresponding lower surface of the lid 10 are joined from above. Thereby, the metal brazing material 12 on the surface of the lid plate 11 is melted, and each base 1 and the lid 10 are sequentially joined and hermetically sealed.

  Next, the connecting portions remaining between the narrow grooves 14 of the lid plate 11 are irradiated with the laser beam B, cut, and the lids 10 are separated into pieces while being joined to the base 1. At this time, it is preferable to perform laser irradiation while cooling the entire base plate 2 and the lid 10 so that the metal brazing filler metal 12 once welded is not melted again at a high temperature of the laser beam. By cutting the lid plate 11 by laser irradiation in this way, the cut surface where the base material is exposed can be oxidized by the high heat of the laser beam, so that a rust prevention effect is obtained.

  The base plate 2 to which the lid 10 is bonded in this way is cut into pieces by dicing along the outline of the base 1. Thereby, the predetermined number of piezoelectric vibrators each hermetically sealed are obtained. In another embodiment, in addition to dicing, the base plate 2 may be cut into pieces by another means such as a sandblast method.

  FIG. 5A shows a lid plate 11 according to a modification of the present embodiment. In the lid plate 11, the connecting portion between the narrow grooves 14 extending in the vertical direction in the drawing is partially pressed, and a recess 17 a is formed on the back side of the portion 17, that is, on the joint surface side with the base 1. Yes. The dent 17a has a short groove shape that crosses the narrow groove 14 in the vertical direction. As shown in FIG. 5B, when the lid plate 11 is joined to the base plate 2, a slight space is formed by the recess 17a between the upper end surface thereof. A gas generated from the metal brazing material 12 by trapping the laser beam in this space can be trapped and exhausted to the outside when the connecting portion is cut. In particular, when solder is used for the metal brazing material 12, undesirable gas is generated if it remains in the cavity 7, but this is preferable because it can be eliminated.

  In the second embodiment of the present invention, instead of the base plate 2 of the first embodiment, as shown in FIG. 6, a base 18 that has been separated into predetermined external dimensions in advance is used. Similarly to the base 1 of the first embodiment, the base 18 has a two-layer structure of ceramic sheets 18a and 18b, and is provided with electrodes and wiring patterns 19 for mounting the piezoelectric vibrating reed and a cavity 20, and the top. A metal plating layer 8 is formed on the end face. In the same manner as in the prior art, a piezoelectric vibrating piece 21 is mounted on the base 18 in the cavity 20 and is connected and fixed to the electrode.

  In the present embodiment, as in the first embodiment, the lid plate 11 of FIG. 3 in which a predetermined number of lids 10 are integrally formed is used. As shown in FIG. 7, a predetermined number of bases 18 are arranged, and the lid plate 11 is overlaid with the lids 10 aligned with the respective bases 18. On the lid plate 11, urging means 16 for urging each lid 10 downward is arranged in the same manner as in the first embodiment, and the lid 10 is pressed and brought into contact with each base 1 substantially uniformly.

  In this state, the base 2 and the lid plate 11 are transported into the sealing device, the inside of the sealing device is depressurized to a vacuum, or further replaced with a nitrogen atmosphere, and then the lid corresponding to the upper end surface of each base 1 from above. The laser beam A is irradiated to the portion where the lower surface of 10 is joined. Thereby, the metal brazing material 12 on the surface of the lid plate 11 is melted, and each base 1 and the lid 10 are sequentially joined and hermetically sealed. Next, the connecting portion remaining between the narrow grooves 14 of the lid plate 11 is cut by irradiation with the laser beam B to separate each lid 10 into individual piezoelectric vibrators.

  In each of the above-described embodiments, since the base 1 and the lid 10 can be joined and the lid 10 can be singulated using a single laser device, it is advantageous. However, according to the present invention, the base 1 and the lid 10 can be joined using an electron beam or seam welding.

  The preferred embodiments of the present invention have been described above in detail, but the present invention can be implemented by adding various modifications and changes to the above embodiments within the technical scope thereof. For example, the base of each of the above embodiments has a two-layer structure of ceramic sheets, but can have a three-layer structure or more if necessary, and can be made of various known materials other than ceramic materials. Can be formed. Moreover, although the said Example is a manufacturing method of a piezoelectric vibrator, this invention is applied to the manufacturing method of various electronic devices which airtightly seal various electronic components, such as an IC chip, in a package besides a piezoelectric vibrating piece. Can do.

(A) The figure is a perspective view which shows the base board used for 1st Example of this invention, (B) The figure is the sectional drawing. (A) The figure is a perspective view which shows the process of manufacturing the base board of FIG. 1, (B) The figure is the elements on larger scale which show the ceramic sheet of the 1st layer which comprises a base board. (A) is a perspective view showing a lid plate used in the first embodiment of the present invention, and (B) is a partially enlarged plan view thereof. Sectional drawing which shows the point which joins a base board and a lid board with a laser beam in 1st Example. (A) The figure is the elements on larger scale which show the lid board used for the modification of this invention, (B) The figure is sectional drawing in the VV line. The partially broken perspective view which shows the base used for 2nd Example of this invention, and the piezoelectric vibration piece mounted in this. Sectional drawing which shows the point which joins a base board and a lid board with a laser beam in 2nd Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,18 ... Base, 2 ... Base board, 3, 4, 18a, 18b ... Ceramic sheet, 5, 19 ... Electrode and wiring pattern, 6 ... Opening, 7, 20 ... Cavity, 8 ... Metal plating layer, 9, 21 DESCRIPTION OF SYMBOLS ... Piezoelectric vibrating piece, 10 ... Lid, 11 ... Lid plate, 12 ... Metal brazing material, 13, 15 ... External shape, 14 ... Fine groove, 16 ... Energizing means, 17 ... Part, 17a ... Recess

Claims (5)

Forming a base plate composed of a plurality of bases each having a cavity opened on one surface thereof, an electrode and a wiring pattern, and fixing and electrically connecting an electronic component in the cavity of each base; ,
Forming a metal lid plate composed of a plurality of lids having a predetermined outer dimension, attaching a metal brazing material to one surface thereof, and forming a plurality of fine grooves defining the outer shape of the lid;
The one surface of the lid plate is overlapped with the one surface of the base plate while aligning the bases and the lids, and pressing the lids to the corresponding bases, the metal brazing Melting the material and sealingly sealing the lid to each of the bases; and
Cutting the base plate and the lid plate along the outer shape of the base and the lid, and dividing the electronic device into individual pieces. Forming a plurality of bases having cavities open on one surface thereof, electrodes and wiring patterns, and fixing and electrically connecting electronic components in the cavities of the respective bases;
Forming a lid plate composed of a plurality of lids having a predetermined outer dimension, and attaching a metal brazing material to one surface thereof;
The one surface of each base is overlapped with the one surface of the lid plate while aligning the base and the lid, and pressing the lid against the corresponding base while the metal brazing is performed. Melting the material and sealingly sealing the lid to each of the bases; and
And cutting the lid plate along the outer shape of the lid to divide the electronic device into pieces.   3. The method of manufacturing an electronic device according to claim 1, wherein the metal brazing material is melted and hermetically bonded and sealed to each of the bases by laser beam, electron beam, or seam welding.   The method for manufacturing an electronic device according to claim 1, wherein the lid plate is cut by a laser beam.   The method of manufacturing an electronic device according to claim 1, wherein the electronic component is a piezoelectric vibrating piece.

Images