JP5123081B2 - Lid, piezoelectric vibrator and piezoelectric oscillator for electronic parts - Google Patents

Lid, piezoelectric vibrator and piezoelectric oscillator for electronic parts Download PDF

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JP5123081B2
JP5123081B2 JP2008171283A JP2008171283A JP5123081B2 JP 5123081 B2 JP5123081 B2 JP 5123081B2 JP 2008171283 A JP2008171283 A JP 2008171283A JP 2008171283 A JP2008171283 A JP 2008171283A JP 5123081 B2 JP5123081 B2 JP 5123081B2
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lid
piezoelectric
frame member
vibration element
piezoelectric vibration
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JP2010011373A (en
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宏和 小林
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Kyocera Crystal Device Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

本発明は、気密封止や保護が必要な電子部品に用いられる電子部品用の蓋体及びそれを用いた圧電振動子並びに圧電発振器に関する。   The present invention relates to a lid for electronic components used for electronic components that require hermetic sealing and protection, and a piezoelectric vibrator and a piezoelectric oscillator using the lid.

近年より電子機器は小型化が進み、それに伴い、内部に搭載される電子部品の小型化が進んでいる。
このような電子機器に搭載される電子部品には、カバーとなる蓋体を設けて保護する必要がある部品がある。この蓋体により、保護が必要な部品を異物や外部環境からの影響を防ぐことができる。
この保護が必要な電子部品の一つの例として圧電振動素子がある。
この圧電振動素子は、例えば、基板体に搭載された後に凹部を有する蓋体で気密封止して保護される（例えば、特許文献１参照）。又は、圧電振動素子は、凹部を有する基板体内に搭載され、平板状の蓋体で気密封止されて保護される（例えば、特許文献２参照）。 In recent years, electronic devices have been reduced in size, and accordingly, electronic components mounted therein have been reduced in size.
Among electronic components mounted on such electronic devices, there is a component that needs to be protected by providing a cover as a cover. With this lid, it is possible to prevent the parts that need to be protected from being affected by foreign matter or the external environment.
One example of an electronic component that requires this protection is a piezoelectric vibration element.
The piezoelectric vibration element is protected by being hermetically sealed with a lid having a recess after being mounted on the substrate body (see, for example, Patent Document 1). Alternatively, the piezoelectric vibration element is mounted in a substrate body having a recess, and is hermetically sealed with a flat lid member to be protected (see, for example, Patent Document 2).

ここで、蓋体は、主に金属で形成され、主材となる金属板に封止材を設けて打抜き加工により平板状に形成されている。
また、凹部を有する蓋体の場合、金属片をプレス加工することにより形成される。 Here, the lid is mainly made of metal, and is formed in a flat plate shape by punching with a sealing material provided on a metal plate as a main material.
Moreover, in the case of the cover body which has a recessed part, it forms by pressing a metal piece.

また、容器体は、主にセラミックスで形成されている。この容器体に凹部を形成する場合は、所定の配線パターンが形成されたシート状のセラミックスを積層させて、焼成することにより形成される。したがって、積層させるシート状のセラミックスは、凹部の縁である枠となるために、複数の貫通穴部が形成された状態で積層されることとなる。   The container body is mainly formed of ceramics. In the case where the recess is formed in the container body, it is formed by laminating and firing sheet-like ceramics on which a predetermined wiring pattern is formed. Therefore, the sheet-like ceramics to be laminated are laminated in a state where a plurality of through-hole portions are formed in order to form a frame that is an edge of the recess.

特開２００７−０１３６０８号公報JP 2007-013608 A 特開２００７−２０８４７０号公報JP 2007-208470 A

しかしながら、電子部品を小型化する場合、保護が必要な部品を保護する蓋体も小型化されることとなるが、従来のような構成の蓋体の場合、特に凹部を有する蓋体の場合は、従来よりも薄く形成された金属を用いなくてはならなくなる。そのため、プレス加工で凹部を形成すると、曲げられる部分で裂け目が入ったり、壁部となる部分において、強度が弱くなる恐れがある。   However, when electronic components are downsized, the lid that protects the components that need protection is also downsized. However, in the case of a lid having a conventional configuration, particularly in the case of a lid having a recess. Therefore, it is necessary to use a metal formed thinner than the conventional one. For this reason, when the concave portion is formed by press working, there is a risk that the portion to be bent may have a tear or the strength may be weakened in the portion that becomes the wall portion.

そこで、本発明では、前記した問題を解決し、製造が容易で強度を確保した電子部品用の蓋体を提供することを課題とする。   Therefore, an object of the present invention is to provide a lid for an electronic component that solves the above-described problems and is easy to manufacture and secures strength.

前記課題を解決するため、本発明は、電子部品用の蓋体であって、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されてなる基板部材と、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されてなる複数の枠部材と、銀ロウからなる第二の枠部材とを備え、前記基板部材と前記複数の枠部材と前記第二の枠部材とが重ねられた状態で拡散接合されて凹部を形成していることを特徴とする。   In order to solve the above problems, the present invention is a lid for an electronic component, and is a substrate member selected from any one of Kovar, SUS, and iron-nickel alloy, and any one of Kovar, SUS, and iron-nickel alloy. A plurality of frame members selected from the above, and a second frame member made of silver wax, and the substrate member, the plurality of frame members, and the second frame member are diffusion bonded together. The concave portion is formed.

また、本発明は、それぞれの前記枠部材の厚みと幅の値が前記基板部材の厚みの値とが同じとなっていても良い。   In the present invention, the thickness and width values of the respective frame members may be the same as the thickness values of the substrate members.

また、本発明は、請求項１又は請求項２に記載の電子部品用の蓋体が、圧電振動素子が搭載された基板体に接合されて構成しても良い。   Further, the present invention may be configured such that the electronic component lid according to claim 1 or 2 is bonded to a substrate body on which a piezoelectric vibration element is mounted.

また、本発明は、請求項１又は請求項２に記載の電子部品用の蓋体が、圧電振動素子と発振回路を有する集積回路素子とを搭載した容器体に前記圧電振動素子を覆うように接合されて構成しても良い。   According to the present invention, the lid for an electronic component according to claim 1 or 2 is configured such that the piezoelectric vibration element is covered with a container body on which the piezoelectric vibration element and an integrated circuit element having an oscillation circuit are mounted. It may be configured to be joined.

このような電子部品用の蓋体によれば、蓋体を構成する基板部材と複数の枠部材とが拡散接合により接合されているため、プレス加工などで引き伸ばされる部分がなくなり、強度を確保することができる。
また、蓋体を構成する基板部材と複数の枠部材のそれぞれの厚みとは同一の厚みで構成されるため、従来よりも薄く、また、幅が狭く形成されていても容易に接合することができるので、生産性が向上し、製品のコストダウンに貢献することができる。
また、複数の枠部材は、フォトリソグラフィ技術とエッチング技術により容易に製作でき、また、基板部材と複数の枠部材と第二の枠部材とは、拡散接合により容易に接合できる。そのため、生産性が向上し、製品のコストダウンに貢献することができる。
また、複数の枠部材のうち、基板部材より最も離れた枠部材に銀ロウからなる第二の枠部材を接合したことにより、圧電振動素子を気密封止する際の接合される側の部品との接合を容易にすることができる。 According to such a lid for electronic components, since the substrate member and the plurality of frame members constituting the lid are joined by diffusion bonding, there is no portion that is stretched by pressing or the like, and the strength is ensured. be able to.
In addition, since the substrate member and the plurality of frame members constituting the lid are configured to have the same thickness, they can be easily joined even if they are formed thinner and narrower than before. As a result, productivity can be improved and product costs can be reduced.
The plurality of frame members can be easily manufactured by photolithography technology and etching technology, and the substrate member, the plurality of frame members, and the second frame member can be easily joined by diffusion bonding. Therefore, productivity can be improved and the cost of the product can be reduced.
Further, among the plurality of frame members, by joining the second frame member made of silver solder to the frame member farthest from the substrate member, the parts to be joined when the piezoelectric vibration element is hermetically sealed Can be easily joined.

また、このような電子部品用の蓋体を用いた圧電振動子によれば、圧電振動素子を覆う空間の大きさを確保しつつ、凹部を形成する枠部材の幅を従来よりも狭くして平面積を小さくすることができる。   In addition, according to the piezoelectric vibrator using the lid for the electronic component, the width of the frame member that forms the recess is made narrower than before while ensuring the size of the space that covers the piezoelectric vibration element. The plane area can be reduced.

また、このような電子部品用の蓋体を用いた圧電発振器によれば、圧電振動素子を覆う空間の大きさを確保しつつ、凹部を形成する枠部材の幅を従来よりも狭くして平面積を小さくすることができる。   Further, according to the piezoelectric oscillator using such a lid for electronic components, the width of the frame member forming the recess is made narrower than that of the conventional one while ensuring the size of the space covering the piezoelectric vibration element. The area can be reduced.

次に、本発明を実施するための最良の形態（以下、「実施形態」という。）について、適宜図面を参照しながら詳細に説明する。なお、各構成要素について、状態をわかりやすくするために、誇張して図示している。
また、電子部品を圧電振動子として説明する。 Next, the best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail with reference to the drawings as appropriate. Note that each component is exaggerated for easy understanding of the state.
The electronic component is described as a piezoelectric vibrator.

（第一の実施形態）
図１は本発明の実施形態に係る電子部品用の蓋体の一例を概念的に示す斜視図である。図２は図１の分解斜視図である。
圧電振動子は、例えば、励振電極を両主面に設けた圧電振動素子と、圧電振動素子を搭載するための搭載パッドとこれと電気的に接続する外部端子とが設けられている平板状のベース部と、このベース部に接合されて圧電振動素子を覆いつつ気密封止する蓋体とから構成されている。
この圧電振動子に用いられる本発明の実施形態に係る電子部品用の蓋体１０１は、図１及び図２に示すように、基板部材１０と、３つの枠部材（複数の枠部材）２０と第二の枠部３０とから構成されている。 (First embodiment)
FIG. 1 is a perspective view conceptually showing an example of a lid for an electronic component according to an embodiment of the present invention. 2 is an exploded perspective view of FIG.
The piezoelectric vibrator has, for example, a plate-like shape in which a piezoelectric vibration element having excitation electrodes provided on both main surfaces, a mounting pad for mounting the piezoelectric vibration element, and an external terminal electrically connected thereto are provided. A base portion and a lid that is joined to the base portion and hermetically seals while covering the piezoelectric vibration element.
As shown in FIGS. 1 and 2, a lid 101 for an electronic component according to an embodiment of the present invention used for this piezoelectric vibrator has a substrate member 10, three frame members (a plurality of frame members) 20, and The second frame portion 30 is configured.

基板部材１０は、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されて用いられる。なお、本実施形態においては、材質をコバールとして説明する。
この基板部材１０は、図２に示すように、平面視矩形形状となるように平板状に形成されており、その厚みｔ１は、例えば、０．０５ｍｍとなっている。
このような基板部材１０は、フォトリソグラフィ技術とエッチング技術とを用いて製造される。 The substrate member 10 is selected from any one of Kovar, SUS, and iron-nickel alloy. In the present embodiment, description will be made assuming that the material is Kovar.
As shown in FIG. 2, the substrate member 10 is formed in a flat plate shape so as to have a rectangular shape in plan view, and a thickness t1 thereof is, for example, 0.05 mm.
Such a substrate member 10 is manufactured using a photolithography technique and an etching technique.

３つの枠部材２０は、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されて用いられる。なお、本実施形態においては、材質をコバールとして説明する。
この枠部材２０は、図２に示すように、基板部材１０の縁を沿うように、かつ、基板部材１０の主面内に収まるように形成される環状の部材である。
この枠部材２０の幅の値は、基板部材１０の厚みの値と同じとなっている。例えば、基板部材１０の厚みｔ１が０．０５ｍｍの場合、枠部材２０の幅の値ｗ１は、０．０５ｍｍとなる。なお、枠部材２０の厚みｔ２を基板部材１０の厚みｔ１と同じ厚みとしてもよい。
なお、枠部材２０の材質を基板部材１０と同じ材質とすれば、より良好な接合状態とすることができる。
枠部材２０は、基板部材１０と同様に、フォトリソグラフィ技術とエッチング技術とを用いて製造される。 The three frame members 20 are selected from one of Kovar, SUS, and iron-nickel alloy. In the present embodiment, description will be made assuming that the material is Kovar.
As shown in FIG. 2, the frame member 20 is an annular member formed along the edge of the substrate member 10 and within the main surface of the substrate member 10.
The width value of the frame member 20 is the same as the thickness value of the substrate member 10. For example, when the thickness t1 of the substrate member 10 is 0.05 mm, the width value w1 of the frame member 20 is 0.05 mm. The thickness t2 of the frame member 20 may be the same as the thickness t1 of the substrate member 10.
In addition, if the material of the frame member 20 is the same as that of the substrate member 10, a better bonded state can be achieved.
The frame member 20 is manufactured using a photolithography technique and an etching technique in the same manner as the substrate member 10.

第二の枠部材３０は、銀ロウが用いられる。この第二の枠部材３０は、図２に示すように、枠部材２０と同一の形状となるように形成されている。
例えば、枠部材２０の幅の値ｗ１が０．０５ｍｍの場合、第二の枠部材３０の幅の値ｗ２は、０．０５ｍｍとなる。なお、第二の枠部材３０の厚みｔ３を枠部材２０の厚みｔ２と同じ厚みとしてもよい。
第二の枠部材３０は、基板部材１０、枠部材２０と同様に、フォトリソグラフィ技術とエッチング技術とを用いて製造される。 Silver solder is used for the second frame member 30. As shown in FIG. 2, the second frame member 30 is formed to have the same shape as the frame member 20.
For example, when the width value w1 of the frame member 20 is 0.05 mm, the width value w2 of the second frame member 30 is 0.05 mm. The thickness t3 of the second frame member 30 may be the same as the thickness t2 of the frame member 20.
Similar to the substrate member 10 and the frame member 20, the second frame member 30 is manufactured using a photolithography technique and an etching technique.

この本発明の第一の実施形態に係る電子部品用の蓋体１０１は、基板部材１０の一方の主面に３つの枠部材２０を重ね、さらに、第二の枠部材３０を重ねて、所定の圧力下で加圧して拡散接合の状態にして接合がなされる。
ここで、拡散接合とは、母材を密着させた状態で母材の融点以下の温度条件で、塑性変形をできるだけ生じない程度に加圧して、接合面間に生じる原子の拡散を接合する方法をいう（「ＪＩＳ工業用語大辞典第５版」、財団法人日本規格協会発行、Ｐ３３１）。
これにより、基板部材１０の一方の主面に３つの枠部材２０が接合され、さらに第二の枠部材３０が接合されて凹部Ｋが形成される。 In the electronic component lid 101 according to the first embodiment of the present invention, three frame members 20 are overlapped on one main surface of the substrate member 10, and further, a second frame member 30 is overlapped. Bonding is performed in a state of diffusion bonding by pressurizing under the above pressure.
Here, diffusion bonding is a method in which the diffusion of atoms occurring between the bonding surfaces is bonded by applying pressure to the extent that plastic deformation does not occur as much as possible under a temperature condition equal to or lower than the melting point of the matrix with the matrix in close contact. ("JIS Industrial Glossary Dictionary 5th Edition", published by the Japanese Standards Association, P331).
Thereby, the three frame members 20 are joined to one main surface of the substrate member 10, and the second frame member 30 is further joined to form the recess K.

このような電子部品用の蓋体１０１によれば、基板部材１０と複数の枠部材２０のそれぞれとは同一の厚みで構成されることとなるため、プレス加工などで引き伸ばされる部分がなくなり、強度を確保することができる。
また、複数の枠部材２０と第二の枠部材３０とは、フォトリソグラフィ技術とエッチング技術により、厚みが従来よりも薄い部材から従来より幅を狭くして製造することできる。また、枠部材２０と第二の枠部材３０とは、フォトリソグラフィ技術とエッチング技術により幅が従来よりも狭く形成できるため、圧電振動素子（図示せず）を気密封止する空間を確保しつつ、蓋体１０１の全体を従来よりも小さくすることができる。
また、基板部材１０と複数の枠部材２０と第二の枠部材３０とは、拡散接合により容易に接合できる。そのため、従来よりも薄く、また、幅が狭く形成されていても容易に接合することができるので、生産性が向上し、製品のコストダウンに貢献することができる。
また、第二の枠部材３０を銀ロウで構成したので、電子部品用の蓋体１０１と、これと接合される部品との接合を容易に行わせることができる。 According to such a lid 101 for an electronic component, since the substrate member 10 and each of the plurality of frame members 20 are configured with the same thickness, there is no portion that is stretched by pressing or the like, and the strength is increased. Can be secured.
In addition, the plurality of frame members 20 and the second frame member 30 can be manufactured from a member having a smaller thickness than the conventional one by using a photolithography technique and an etching technique. Further, since the frame member 20 and the second frame member 30 can be formed narrower than conventional by the photolithography technique and the etching technique, a space for hermetically sealing the piezoelectric vibration element (not shown) is secured. The entire lid 101 can be made smaller than before.
Moreover, the board | substrate member 10, the some frame member 20, and the 2nd frame member 30 can be easily joined by diffusion joining. Therefore, even if it is thinner and narrower than before, it can be easily joined, so that productivity can be improved and the cost of the product can be reduced.
Further, since the second frame member 30 is made of silver solder, it is possible to easily join the electronic component lid 101 and the component to be joined thereto.

（第二の実施形態）
図３は、本発明の第二の実施形態に係る圧電振動子の一例を示す概念図である。
本発明の第二の実施形態に係る圧電振動子１１０は、本発明の第一の実施形態に係る電子部品用の蓋体１０１を用いて、ベース部１０２に搭載された圧電振動素子１０３を覆うように、当該ベース部１０２に接合されて構成されている。 (Second embodiment)
FIG. 3 is a conceptual diagram showing an example of a piezoelectric vibrator according to the second embodiment of the present invention.
The piezoelectric vibrator 110 according to the second embodiment of the present invention covers the piezoelectric vibration element 103 mounted on the base portion 102 using the lid 101 for electronic components according to the first embodiment of the present invention. Thus, it is configured to be joined to the base portion 102.

圧電振動素子１０３は、振動部に電極を設けており、音叉構造、平板構造、振動部を凹ませた構造、振動部を凸状に形成した構造等、種々選択して用いることができる。
各種構造において、圧電振動素子の一方の端部まで電極から引回された引回パターンが設けられている。
なお、圧電振動素子１０３を平板構造で設けられているものとして説明する。 The piezoelectric vibration element 103 is provided with electrodes in the vibration part, and can be selected and used in various ways such as a tuning fork structure, a flat plate structure, a structure in which the vibration part is recessed, and a structure in which the vibration part is formed in a convex shape.
In various structures, a drawing pattern drawn from the electrode to one end of the piezoelectric vibration element is provided.
In the following description, it is assumed that the piezoelectric vibration element 103 has a flat plate structure.

ベース部１０２は、平板状に形成されており、このベース部１０２の一方の主面に圧電振動素子を搭載するための搭載パッドＰと蓋体１０１を接合するための金属膜Ｍとが設けられ、他方の主面に外部端子Ｇが設けられている。
金属膜Ｍは、ベース部１０２を縁取るように環状に形成され、かつ、蓋体１０１の枠部材２０と対向する位置に形成されている。
搭載パッドＰは、金属膜Ｍで囲まれた内部に設けられており、他方の主面に設けられた外部端子Ｇとビアホール（図示せず）を介して電気的に接続した状態となっている。 The base portion 102 is formed in a flat plate shape, and a mounting pad P for mounting the piezoelectric vibration element and a metal film M for bonding the lid body 101 are provided on one main surface of the base portion 102. The external terminal G is provided on the other main surface.
The metal film M is formed in an annular shape so as to border the base portion 102, and is formed at a position facing the frame member 20 of the lid body 101.
The mounting pad P is provided inside the metal film M, and is electrically connected to an external terminal G provided on the other main surface through a via hole (not shown). .

このベース部２１０に圧電振動素子１０２を導電性接着剤Ｄを用いて搭載する。
このとき、ベース部１０２の搭載パッドＰと圧電振動素子１０２の引回しパターンとを導電性接着剤Ｄで接合する。 The piezoelectric vibration element 102 is mounted on the base portion 210 using the conductive adhesive D.
At this time, the mounting pad P of the base portion 102 and the routing pattern of the piezoelectric vibration element 102 are joined by the conductive adhesive D.

圧電振動素子１０３が搭載されたベース部１０２に蓋体１０１を接合する。蓋体１０１をベース部１０２に接合する際は、例えば、真空雰囲気中、又は、不活性ガス中で接合が行われる。
ここで、蓋体１０１の第二の枠部材３０をベース部１０２の金属膜Ｍに当接させ、この状態で、従来周知のシーム溶接を行う。これにより、蓋体１０１がベース部１０２に接合されて圧電振動子１１０が完成する。 The lid body 101 is joined to the base portion 102 on which the piezoelectric vibration element 103 is mounted. When the lid 101 is bonded to the base portion 102, for example, the bonding is performed in a vacuum atmosphere or in an inert gas.
Here, the second frame member 30 of the lid 101 is brought into contact with the metal film M of the base portion 102, and in this state, conventionally well-known seam welding is performed. As a result, the lid 101 is joined to the base portion 102 to complete the piezoelectric vibrator 110.

このように、圧電振動子１１０を構成したので、蓋体１０１が圧電振動素子１０３を覆う空間の大きさを確保しつつ、凹部Ｋを形成する枠部材２０の幅を従来よりも狭くすることができるので、従来よりも平面積を小さくすることができる。   Since the piezoelectric vibrator 110 is configured in this manner, the width of the frame member 20 that forms the recess K can be made narrower than the conventional one while ensuring the size of the space where the lid 101 covers the piezoelectric vibration element 103. Therefore, the plane area can be made smaller than before.

（第三の実施形態）
図４は、本発明の第三の実施形態に係る圧電発振器の一例を示す概念図である。
本発明の第三の実施形態に係る圧電発振器１２０は、一方の主面に凹部Ｋ２を有する容器体１０４と、この容器体１０４の凹部Ｋ２内に搭載される発振回路を備えた集積回路素子１０５と、他方の主面に搭載される圧電振動素子１０３と、この圧電振動素子１０３を気密封止する本発明の第一の実施形態に係る電子部品用の蓋体１０１とから主に構成されている。 (Third embodiment)
FIG. 4 is a conceptual diagram showing an example of a piezoelectric oscillator according to the third embodiment of the present invention.
The piezoelectric oscillator 120 according to the third embodiment of the present invention is an integrated circuit element 105 including a container body 104 having a recess K2 on one main surface and an oscillation circuit mounted in the recess K2 of the container body 104. And the piezoelectric vibration element 103 mounted on the other main surface, and the lid 101 for an electronic component according to the first embodiment of the present invention that hermetically seals the piezoelectric vibration element 103. Yes.

圧電振動素子１０３は、第二の実施形態と同様に、振動部に電極を設けており、音叉構造、平板構造、振動部を凹ませた構造、振動部を凸状に形成した構造等、種々選択して用いることができる。各種構造において、圧電振動素子の一方の端部まで電極から引回された引回パターンが設けられている。なお、圧電振動素子１０３を平板構造で設けられているものとして説明する。   As in the second embodiment, the piezoelectric vibration element 103 is provided with electrodes in the vibration part, and includes various tuning fork structures, flat plate structures, structures in which the vibration part is recessed, structures in which the vibration part is formed in a convex shape, and the like. It can be selected and used. In various structures, a drawing pattern drawn from the electrode up to one end of the piezoelectric vibration element is provided. In the following description, it is assumed that the piezoelectric vibration element 103 has a flat plate structure.

容器体１０４は、一方の主面に凹部Ｋ２を有し、この凹部Ｋ２内に集積回路素子１０５を搭載するための集積回路素子搭載パッドＰ２が設けられ、一方の主面の四隅に電子基板へ接合するための外部端子Ｇが設けられている。また、容器体１０４の他方の主面には、圧電振動素子１０３を搭載するための搭載パッドＰと蓋体１０１と接合するための金属膜Ｍが設けられている。外部端子Ｇと搭載パッドＰは、所定の集積回路素子搭載パッドＰ２と電気的に接続されている。   The container body 104 has a concave portion K2 on one main surface, and integrated circuit element mounting pads P2 for mounting the integrated circuit element 105 are provided in the concave portion K2, and the electronic substrate is provided at four corners of the one main surface. An external terminal G for joining is provided. On the other main surface of the container body 104, a mounting pad P for mounting the piezoelectric vibration element 103 and a metal film M for bonding the lid body 101 are provided. The external terminal G and the mounting pad P are electrically connected to a predetermined integrated circuit element mounting pad P2.

集積回路素子１０５は、少なくとも発振回路を備え、容器体１０４の凹部Ｋ２内に搭載される。また、圧電振動素子１０３は、容器体１０４の他方の主面に搭載され、本発明の第一実施形態に係る蓋体１０１で気密封止される。このとき、容器体１０４の金属膜Ｍと第一実施形態に係る蓋体１０１の第二の枠部材３０とを当接させ、この状態で、従来周知のシーム溶接を行う。これにより、圧電発振器１０３が完成される。   The integrated circuit element 105 includes at least an oscillation circuit and is mounted in the recess K2 of the container body 104. The piezoelectric vibration element 103 is mounted on the other main surface of the container body 104 and hermetically sealed with the lid body 101 according to the first embodiment of the present invention. At this time, the metal film M of the container body 104 and the second frame member 30 of the lid body 101 according to the first embodiment are brought into contact with each other, and conventionally well-known seam welding is performed. Thereby, the piezoelectric oscillator 103 is completed.

このように、圧電発振器１０３を構成したので、蓋体１０１が圧電振動素子１０３を覆う空間の大きさを確保しつつ、凹部Ｋを形成する枠部材２０の幅を従来よりも狭くすることができるので、従来よりも平面積を小さくすることができる。   As described above, since the piezoelectric oscillator 103 is configured, the width of the frame member 20 that forms the recess K can be made narrower than the conventional one while ensuring the size of the space where the lid 101 covers the piezoelectric vibration element 103. Therefore, the plane area can be reduced as compared with the conventional case.

（第三の実施形態の変形例）
なお、本発明の第三の実施形態に係る圧電発振器において、種々の変更が可能である。
例えば、容器体の構造は、一方の主面に２つの凹部が形成され、そのうち、一方の凹部に集積回路素子を搭載し、他方の凹部に圧電振動素子を搭載して、この他方の凹部を覆うように蓋体１０１を接合して構成しても良い。
また、例えば、容器体の一方の主面に凹部が形成され、その凹部の中にさらに凹部が形成され、圧電振動素子が搭載されるいずれかの凹部を蓋体１０１で覆うように接合しても良い。
また、例えば、容器体の一方の主面と他方の主面の両方に凹部が形成され、圧電振動素子が搭載される凹部を蓋体１０１で覆うように接合しても良い。
また、集積回路素子が搭載された容器体に、第一の実施形態に係る圧電振動子を接続して圧電発振器を構成しても良い。
このように構成しても第三の実施形態と同様の効果を奏する。 (Modification of the third embodiment)
Various modifications can be made in the piezoelectric oscillator according to the third embodiment of the present invention.
For example, in the structure of the container body, two concave portions are formed on one main surface, of which an integrated circuit element is mounted on one concave portion, a piezoelectric vibration element is mounted on the other concave portion, and the other concave portion is formed. You may comprise the cover body 101 so that it may cover.
Further, for example, a concave portion is formed on one main surface of the container body, and a concave portion is further formed in the concave portion, and any one of the concave portions on which the piezoelectric vibration element is mounted is joined so as to be covered with the lid body 101. Also good.
Further, for example, a recess may be formed on both one main surface and the other main surface of the container body, and the recess in which the piezoelectric vibration element is mounted may be joined so as to be covered with the lid body 101.
The piezoelectric oscillator may be configured by connecting the piezoelectric vibrator according to the first embodiment to a container body on which an integrated circuit element is mounted.
Even if comprised in this way, there exists an effect similar to 3rd embodiment.

以上、本発明の実施形態について説明したが、本発明は前記実施形態には限定されない。例えば、枠部材を３つとして説明したがこれに限定されず、２つや４つなどの自然数となる数を重ねて用いても良い。
また、圧電振動素子は、例えば、ＳＴカットやＡＴカットされた水晶振動素子、音叉型の水晶振動素子又はセンサ、ベベル加工やコンペックス加工やプラノコンベックス加工された水晶振動素子、ＳＡＷデバイスに用いられる水晶板などであっても良い。
また、圧電発振器の蓋体としても良い。 As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment. For example, although three frame members have been described, the present invention is not limited to this, and a natural number such as two or four may be used in an overlapping manner.
The piezoelectric vibration element is used for, for example, ST-cut or AT-cut crystal vibration elements, tuning-fork type crystal vibration elements or sensors, bevel processing, complex processing, plano convex processing crystal vibration elements, and SAW devices. It may be a crystal plate.
Moreover, it is good also as a cover body of a piezoelectric oscillator.

本発明の実施形態に係る電子部品用の蓋体の一例を概念的に示す斜視図である。It is a perspective view which shows notionally an example of the cover body for electronic components which concerns on embodiment of this invention. 図１の分解斜視図である。FIG. 2 is an exploded perspective view of FIG. 1. 本発明の第二の実施形態に係る圧電振動子の一例を示す概念図である。It is a conceptual diagram which shows an example of the piezoelectric vibrator which concerns on 2nd embodiment of this invention. 本発明の第三の実施形態に係る圧電発振器の一例を示す概念図である。It is a conceptual diagram which shows an example of the piezoelectric oscillator which concerns on 3rd embodiment of this invention.

符号の説明Explanation of symbols

１０ 基板部材
２０ 枠部材
３０ 第二の枠部材
１０１ 蓋体
１０２ ベース部
１０３ 圧電振動素子
１０４ 容器体
１０５ 集積回路素子
１１０ 圧電振動子
１２０ 圧電発振器
Ｋ、Ｋ２ 凹部
Ｍ 金属膜 DESCRIPTION OF SYMBOLS 10 Board | substrate member 20 Frame member 30 2nd frame member 101 Lid body 102 Base part 103 Piezoelectric vibration element 104 Container body 105 Integrated circuit element 110 Piezoelectric vibrator 120 Piezoelectric oscillator K, K2 Recessed part M Metal film

Claims (4)

コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されてなる基板部材と、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されてなる複数の枠部材と、銀ロウからなる第二の枠部材とを備え、
前記基板部材と前記複数の枠部材と前記第二の枠部材とが重ねられた状態で拡散接合されて凹部を形成していることを特徴とする電子部品用の蓋体。 A substrate member selected from any one of Kovar, SUS, and iron-nickel alloy, a plurality of frame members selected from any one of Kovar, SUS, and iron-nickel alloy, and a second frame member made from silver solder With
A lid for electronic parts, wherein the substrate member, the plurality of frame members, and the second frame member are diffusion bonded together to form a recess. それぞれの前記枠部材の厚みと幅の値が前記基板部材の厚みの値とが同じとなっていることを特徴とする請求項１に記載の電子部品用の蓋体。   2. The lid for an electronic component according to claim 1, wherein the thickness and width of each frame member are the same as the thickness of the substrate member. 請求項１又は請求項２に記載の電子部品用の蓋体が、
圧電振動素子が搭載された基板体に接合されて構成されていることを特徴とする圧電振動子。 The lid for an electronic component according to claim 1 or 2,
A piezoelectric vibrator characterized by being bonded to a substrate body on which a piezoelectric vibration element is mounted. 請求項１又は請求項２に記載の電子部品用の蓋体が、
圧電振動素子と発振回路を有する集積回路素子とを搭載した容器体に前記圧電振動素子を覆うように接合されて構成されていることを特徴とする圧電発振器。 The lid for an electronic component according to claim 1 or 2,
A piezoelectric oscillator comprising: a piezoelectric body and a container body on which an integrated circuit element having an oscillation circuit is mounted so as to cover the piezoelectric vibration element.
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