WO2022044949A1 - Piezoelectric vibration device - Google Patents

Abstract

This piezoelectric vibration device comprises: a piezoelectric vibration plate having first and second excitation electrodes on the two main surfaces and first and second metal films respectively connected to the first and second excitation electrodes; and first and second sealing members joined to the main surfaces of the piezoelectric vibration plate so as to cover the first and second excitation electrodes of the piezoelectric vibration plate. At least one of the first and second sealing members is a resin film, and in the resin film, a remaining region other than a joined region that is joined to the corresponding main surface of the piezoelectric vibration plate is joined to a part of an inner surface which is contiguous to the main surface to which the resin film is joined.

Description

Piezoelectric vibration device

The present invention relates to a piezoelectric vibration device such as a piezoelectric vibrator.

Surface mount type crystal oscillators are widely used as piezoelectric vibration devices, for example, piezoelectric vibrators. As described in Patent Document 1, for example, this surface-mounted crystal unit is derived from the excitation electrodes on both sides of the crystal vibrating piece to the holding electrode in the box-shaped base having an open upper surface made of ceramic. The crystal vibrating piece is housed and mounted in the base by fixing the electrode to the electrode with a conductive adhesive. In this way, the lid is joined to the opening of the base on which the crystal vibrating piece is mounted so as to be airtightly sealed. Further, a mounting terminal for surface mounting the crystal oscillator is formed on the outer bottom surface of the base.

Japanese Unexamined Patent Publication No. 2005-184325

Most of the above-mentioned piezoelectric vibrators have a package made by joining a metal or ceramic lid to a ceramic base, so that the package is expensive and the piezoelectric vibrator is expensive. It has become.

The present invention has been made in view of the above points, and an object of the present invention is to provide an inexpensive piezoelectric vibration device.

In the present invention, in order to achieve the above object, it is configured as follows.

(1) The piezoelectric vibration device of the present invention has a first excitation electrode formed on one main surface of both main surfaces and a second excitation electrode formed on the other main surface of both main surfaces, and has the above-mentioned The piezoelectric vibrating plate has a piezoelectric vibrating plate having first and second metal films connected to the first and second exciting electrodes, respectively, and the piezoelectric vibrating plate so as to cover the first and second exciting electrodes of the piezoelectric vibrating plate. The piezoelectric vibrating plate is provided with a first and second sealing member to be joined to both main surfaces, respectively, and the piezoelectric vibrating plate has a vibrating portion in which first and second exciting electrodes are formed on both main surfaces and the vibration. The portion side has an inner surface connected to at least one of the two main surfaces, and the thickness of the vibrating portion is formed to be thinner than the thickness of the piezoelectric vibrating plate other than the vibrating portion. At least one sealing member of the second sealing member is a resin film, and the resin film is bonded to the remaining region other than the bonding region bonded to the main surface of the piezoelectric vibrating plate. It is joined to at least a part of at least one of the inner side surface connected to the main surface and the outer side surface of the piezoelectric vibrating plate.

According to the piezoelectric vibration device of the present invention, the first and second sealing members cover the first and second excitation electrodes of the piezoelectric vibration plate having the first and second excitation electrodes formed on both main surfaces. Since the piezoelectric vibrating pieces are joined and sealed, it is not necessary to store and mount the piezoelectric vibrating piece in a box-shaped base having an open upper surface as in the conventional case, and an expensive base is not required.

Further, since at least one of the sealing members of the first and second sealing members is made of a resin film, as compared with the case where both sealing members are made of a metal or ceramic lid. The cost can be reduced.

In a piezoelectric vibration device, the vibrating part needs to have a certain size or more in order to obtain the required vibration characteristics. Therefore, in a small piezoelectric vibration device, it is necessary to join the resin film and the piezoelectric diaphragm. It is not easy to secure a large area.

According to the piezoelectric vibration device of the present invention, the resin film is not only bonded to the main surface of the piezoelectric vibrating plate, but is the residue of the resin film other than the bonding region bonded to the main surface of the piezoelectric vibrating plate. Since the region is bonded to at least a part of the side surface connected to the main surface to which the resin film is bonded, the bonding area between the resin film and the piezoelectric vibration plate can be increased without increasing the size of the piezoelectric vibration device. It can be increased to secure the required joint area.

(2) In a preferred embodiment of the present invention, the piezoelectric diaphragm has an outer frame portion surrounding the vibrating portion, the vibrating portion is thinner than the outer frame portion, and the vibrating portion and the outer frame are formed. The resin film has a penetrating portion between the portions, and the peripheral end portions thereof are joined to at least one main surface of both main surfaces of the outer frame portion.

According to this embodiment, since the peripheral end portion of the resin film is joined to the outer frame portion surrounding the thin-walled vibrating portion, the resin film does not come into contact with the thin-walled vibrating portion, and the vibrating portion is excited. The electrodes can be sealed.

(3) In one embodiment of the present invention, the inner surface connected to the main surface is a side surface connected to the main surface on the inner peripheral side of the outer frame portion surrounding the vibrating portion.

According to this embodiment, the resin film bonded to the side surface connected to the main surface on the inner peripheral side of the outer frame portion is continuously connected to the central side so as to cover the exciting electrode of the vibrating portion on the central side surrounded by the outer frame portion. Therefore, the portion joined to the side surface of the resin film does not have an edge that triggers peeling, and peeling can be effectively prevented.

(4) In another embodiment of the present invention, the residual region of the film faces the vibrating portion surrounded by the outer frame portion and has a gap between the vibrating portion and the vibrating portion.

According to this embodiment, in the resin film, the remaining region other than the bonding region bonded to the main surface of the piezoelectric diaphragm faces the vibrating portion surrounded by the outer frame portion, and is between the vibrating portion and the vibrating portion. Since it has a gap, the resin film does not come into contact with the vibrating portion.

(5) In still another embodiment of the present invention, the inner side surface connected to the main surface to which the resin film is bonded protrudes toward the vibrating portion toward the opposite main surface. It is an inclined inclined surface, and the angle formed by the inner surface surface with respect to the main surface to which the resin film is bonded is an obtuse angle.

According to this embodiment, the inner surface connected to the main surface to which the resin film is bonded is an inclined surface inclined so as to project toward the vibrating portion, and the angle formed with respect to the main surface is an obtuse angle. The resin film bonded to the main surface is bonded over an inclined surface connected to the main surface along a gentle obtuse angle. Therefore, the resin film is more likely to be bonded than in the case of the inner surface where the angle formed by the inclined surface with respect to the main surface is an acute angle.

(6) In another embodiment of the present invention, the piezoelectric diaphragm is a quartz diaphragm.

According to this embodiment, since the piezoelectric diaphragm is a quartz diaphragm, it is connected to the main surface of the quartz diaphragm and forms a blunt angle with respect to the main plane by utilizing the etching anisotropy due to the crystal orientation of the quartz. An inclined surface can be formed, and a resin film can be bonded from the main surface to the inclined surface.

According to the present invention, the first and second sealing members are joined and sealed so as to cover the first and second excitation electrodes formed on both main surfaces of the piezoelectric diaphragm, as in the conventional case. There is no need to store and mount the piezoelectric vibrating piece in a box-shaped base with an open top surface and seal it, eliminating the need for an expensive base.

Further, since at least one of the sealing members of the first and second sealing members is made of a resin film, as compared with the case where both sealing members are made of a metal or ceramic lid. The cost can be reduced.

Further, since the resin film is not only bonded to the main surface of the piezoelectric diaphragm but also to the side surface connected to the main surface, the size of the piezoelectric vibration device is not increased, and the resin film and the piezoelectric film are bonded. The required joint area can be secured by increasing the joint area with the diaphragm.

FIG. 1 is a schematic perspective view of a crystal oscillator according to an embodiment of the present invention. FIG. 2 is a schematic plan view of a quartz diaphragm constituting the crystal oscillator of FIG. 1. FIG. 3 is a schematic cross-sectional view taken along the line AA of the crystal diaphragm of FIG. FIG. 4 is a schematic cross-sectional view taken along the line BB of the crystal diaphragm of FIG. FIG. 5 is a schematic bottom view of the crystal diaphragm constituting the crystal oscillator of FIG. 1. FIG. 6 is a schematic cross-sectional view corresponding to FIG. 3 of the crystal oscillator of FIG. FIG. 7 is a schematic cross-sectional view corresponding to FIG. 4 of the crystal oscillator of FIG. FIG. 8 is an enlarged view of section P1 of FIG. FIG. 9 is an enlarged view of section P2 of FIG. FIG. 10 is an enlarged view of section P3 of FIG. 11A is a schematic cross-sectional view schematically showing a part of the manufacturing process of the crystal oscillator of FIG. 1. 11B is a schematic cross-sectional view schematically showing a part of the manufacturing process of the crystal oscillator of FIG. 1. 11C is a schematic cross-sectional view schematically showing a part of the manufacturing process of the crystal oscillator of FIG. 1. 11D is a schematic cross-sectional view schematically showing a part of the manufacturing process of the crystal oscillator of FIG. 1. 11E is a schematic cross-sectional view schematically showing a part of the manufacturing process of the crystal oscillator of FIG. 1. FIG. 12A is a schematic cross-sectional view schematically showing a part of the heat crimping process of the resin film of FIG. 11D. 12B is a schematic cross-sectional view schematically showing a part of the heat crimping process of the resin film of FIG. 11D. 12C is a schematic cross-sectional view schematically showing a part of the heat crimping process of the resin film of FIG. 11D. FIG. 13 is a schematic plan view of a quartz diaphragm constituting the crystal oscillator according to another embodiment of the present invention. FIG. 14 is a schematic bottom view of the crystal diaphragm of FIG. FIG. 15 is a schematic perspective view corresponding to FIG. 1 of still another embodiment of the present invention. FIG. 16 is a schematic cross-sectional view corresponding to FIG. 6 of the embodiment of FIG.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In this embodiment, it will be described by applying it to a crystal oscillator as a crystal vibration device.

FIG. 1 is a schematic perspective view of a crystal oscillator according to an embodiment of the present invention.

The crystal oscillator 1 of this embodiment has an AT-cut crystal diaphragm 2 on which a metal film is formed, and first and second metal films 27 at both ends on both main surfaces of the front and back surfaces of the crystal diaphragm 2. The first and second resin films 3 and 4 bonded so as to cover the rectangular region excluding 28 (in FIG. 1, only the first resin film 3 bonded to one main surface is shown). It is equipped with.

This crystal oscillator 1 has a rectangular parallelepiped shape and is a rectangular parallelepiped. The crystal oscillator 1 of this embodiment has, for example, 1.2 mm × 1.0 mm and a thickness of 0.2 mm in a plan view, and is aimed at miniaturization and low profile.

The size of the crystal oscillator 1 is not limited to the above, and a different size can be applied.

FIG. 2 is a schematic plan view of the crystal diaphragm 2 constituting the crystal oscillator 1 of FIG. 1, that is, the crystal oscillator 1 in a state where the first and second resin films 3 and 4 are not bonded. 3 is a schematic cross-sectional view of the crystal diaphragm 2 of FIG. 2 along the line AA, FIG. 4 is a schematic cross-sectional view of the crystal diaphragm 2 of FIG. 2 along the line BB, and FIG. 5 is a schematic cross-sectional view. , It is a schematic bottom view of the crystal diaphragm 2. In FIGS. 3 and 4 and FIGS. 11A to 11E and FIGS. 12A to 12C described later, the metal film formed on the quartz diaphragm 2 is exaggerated for convenience of explanation.

The quartz diaphragm 2 of this embodiment is an AT-cut quartz plate processed by rotating a rectangular quartz plate around the X-axis, which is the crystal axis of quartz, by 35 ° 15', and the new rotated axis is Y. It is called the'and Z'axis. In the AT-cut quartz plate, both front and back main surfaces F1 and F2 are XZ'planes.

In this XZ'plane, the short side direction of the rectangular crystal diaphragm 2 in plan view (vertical direction in FIGS. 2 and 5) is the X-axis direction, and the long side direction of the crystal diaphragm 2 (left and right in FIGS. 2 and 5). Direction) is the Z'axis direction.

The crystal diaphragm 2 connects a vibrating portion 21 having a substantially rectangular plan view, an outer frame portion 23 that surrounds the vibrating portion 21 with a penetrating portion 22 interposed therebetween, and the vibrating portion 21 and the outer frame portion 23. It is provided with a connecting portion 24 to be formed. The vibrating portion 21, the outer frame portion 23, and the connecting portion 24 are integrally formed. The vibrating portion 21 and the connecting portion 24 are formed thinner than the outer frame portion 23 surrounding the vibrating portion 21. That is, the vibrating portion 21 is thinner than the outer frame portion 23, which is the other portion.

A pair of first and second excitation electrodes 25 and 26 are formed on both main surfaces F1 and F2 on the front and back of the vibrating portion 21, respectively.

In one of the main surfaces F1 of both main surfaces F1 and F2, as shown in FIG. 2, the first and second resins are formed on the outer frame portions 23 at both ends in the long side direction of the rectangular crystal diaphragm 2 in a plan view. The first and second metal films 27 and 28 that are not covered by the films 3 and 4 are formed along the short side direction of the crystal diaphragm 2, respectively. That is, the first and second metal films 27 and 28 are formed at both ends of the crystal diaphragm 2 in the long side direction (Z'axis direction) with the vibrating portion 21 interposed therebetween. A first sealing pattern 201 formed in a rectangular annular shape so as to surround the vibrating portion 21 is continuously provided on the first metal film 27 formed over both main surfaces F1 and F2.

In the other main surface F2 of both main surfaces F1 and F2, as shown in FIG. 5, the first and second metals are formed on the outer frame portions 23 at both ends in the long side direction of the rectangular crystal diaphragm 2 in a plan view. The films 27 and 28 are formed along the short side direction of the crystal diaphragm 2, respectively. A second sealing pattern 202 formed in a rectangular annular shape so as to surround the vibrating portion 21 is continuously provided on the second metal film 28 formed over both main surfaces F1 and F2.

The first metal film 27 is a region not covered by the rectangular first resin film 3 shown in FIG. 1 and is exposed to the outside. Similarly, the second metal film 28 is a region not covered by the second resin film 4, which will be described later, and is exposed to the outside. These metal films 27 and 28 are used as mounting terminals for mounting the crystal oscillator 1 on a circuit board or the like.

The first metal films 27 and the second metal films 28 on both main surfaces F1 and F2 of the crystal diaphragm 2 are electrically connected to each other. In this embodiment, the first metal films 27 and the second metal films 28 on both main surfaces F1 and F2 are electrically connected to each other by a routing electrode routed on the opposite long side side surfaces of the crystal diaphragm 2. In addition to being connected to each other, the side surfaces of the crystal diaphragm 2 on the opposite short side are electrically connected by a routed electrode.

Since the first metal films 27 and the second metal films 28 on both main surfaces F1 and F2 are electrically connected to each other in this way, the crystal oscillator 1 can be connected to the first and second metal films 27. When mounting the, 28 as a mounting terminal on a circuit board or the like, it can be mounted on either of the front and back main surfaces F1 and F2.

The first metal films 27 and the second metal films 28 on both main surfaces may be electrically connected to each other via a through electrode penetrating both main surfaces, or a side routing electrode may be used. It may be electrically connected via a through electrode and may be electrically connected via a through electrode.

In both main surfaces F1 and F2 of the crystal vibrating plate 2, the inner side surface connected to the main surfaces F1 and F2 on the inner peripheral side surrounding the substantially rectangular vibrating portion 21 is the crystal orientation of the crystal in the outer shape processing by wet etching of the crystal plate. Due to the etching anisotropy due to the above, as shown in FIGS. 3 and 4, the first to sixth inclined surfaces S1 to S6 are inclined.

Further, as shown in FIG. 4, the outer outer surfaces of the outer peripheral side connected to both main surfaces F1 and F2 of the crystal diaphragm 2 and extending along the long side direction of the crystal diaphragm 2 are the seventh to the outer surfaces. The tenth inclined surfaces S7 to S10.

The outer peripheral surface of the vibrating portion 21 surrounded by the first to sixth inclined surfaces S1 to S6 on the inner surface of the outer frame portion 23 is inclined from the eleventh to the eighteenth due to the etching anisotropy due to the crystal orientation of the crystal. The surfaces are S11 to S18. As shown in FIG. 3, the vibrating portion 21 faces the eleventh and twelfth inclined surfaces S11 and S12 facing the first inclined surface S1 of the outer frame portion 23, and the second inclined surface S2 of the outer frame portion 23. It has 13th and 14th inclined surfaces S13 and S14. As shown in FIG. 4, the vibrating portion 21 includes the 15th and 16th inclined surfaces S15 and S16 facing the third and fourth inclined surfaces S3 and S4 of the outer frame portion 23, and the outer frame portion 23. It has 17th and 18th inclined surfaces S17 and S18 facing the 5th and 6th inclined surfaces S5 and S6, respectively.

The first inclined surface S1 shown in FIG. 3 extends along the short side direction of the quartz diaphragm 2 having a rectangular plan view, and the first inclined surface S1 is a side surface on the inner peripheral side which is the vibrating portion 21 side. That is, the inner surface. The first inclined surface S1 is an inclined surface that is continuous with one main surface F1 and is inclined so as to project toward the vibrating portion 21 toward the other main surface F2. The second inclined surface S2 extends along the short side direction of the crystal diaphragm 2, and the second inclined surface S2 is a side surface on the inner peripheral side, that is, an inner side surface, which is the vibrating portion 21 side. The second inclined surface S2 is an inclined surface that is continuous with the other main surface F2 and is inclined so as to project toward the vibrating portion 21 toward the one main surface F1.

The third inclined surface S3 shown in FIG. 4 extends along the long side direction of the crystal diaphragm 2, and the third inclined surface S3 is the inner surface on the inner peripheral side which is the vibrating portion 21 side. The third inclined surface S3 is an inclined surface that is continuous with one main surface F1 and is inclined so as to project toward the vibrating portion 21 toward the other main surface F2, and is continuous with the fourth inclined surface S4. There is. The fourth inclined surface S4 is an inner surface on the vibrating portion 21 side, and is an inclined surface that is continuous with the other main surface F2 and is inclined so as to project toward the vibrating portion 21 toward one main surface F1. be.

The fifth inclined surface S5 extends along the long side direction of the crystal diaphragm 2, and the fifth inclined surface S5 is an inner surface on the vibrating portion 21 side. The fifth inclined surface S5 is an inclined surface that is continuous with one main surface F1 and is inclined so as to project toward the vibrating portion 21 toward the other main surface F2, and is continuous with the sixth inclined surface S6. There is. The sixth inclined surface S6 is an inner surface on the vibrating portion 21 side, and is an inclined surface that is continuous with the other main surface F2 and is inclined so as to project toward the vibrating portion 21 toward one main surface F1. be.

The seventh inclined surface S7 shown in FIG. 4 extends along the long side direction of the crystal diaphragm 2, and the seventh inclined surface S7 is a side surface on the outer peripheral side of the crystal diaphragm 2, that is, an outer surface. be. The seventh inclined surface S7 is an inclined surface that is continuous with one main surface F1 and is inclined so as to project outward toward the other main surface F2, and is continuous with the eighth inclined surface S8. The eighth inclined surface S8 is an outer surface on the outer peripheral side of the crystal diaphragm 2, and is an inclined surface that is continuous with the other main surface F2 and is inclined so as to project outward toward the one main surface F1. Is.

The ninth inclined surface S9 extends along the long side direction of the crystal diaphragm 2, and the ninth inclined surface S9 is an outer surface on the outer peripheral side of the crystal diaphragm 2. The ninth inclined surface S9 is an inclined surface that is continuous with one main surface F1 and is inclined so as to project outward toward the other main surface F2, and is continuous with the tenth inclined surface S10. The tenth inclined surface S10 is an outer surface on the outer peripheral side of the crystal diaphragm 2, and is an inclined surface that is continuous with the other main surface F2 and is inclined so as to project outward toward one main surface F1. Is.

As shown in FIG. 3, the angle formed by the first inclined surface S1 with respect to one main surface F1 is an obtuse angle, and the angle formed by the second inclined surface S2 with respect to the other main surface F2 is an obtuse angle. ..

As shown in FIG. 4, the angle formed by the third inclined surface S3 with respect to one main surface F1 and the angle formed by the fourth inclined surface S4 with respect to the other main surface F2 are both obtuse angles. Further, the angle formed by the fifth inclined surface S5 with respect to one main surface F1 and the angle formed by the sixth inclined surface S6 with respect to the other main surface F2 are both obtuse angles.

As shown in FIG. 4, the angle formed by the seventh inclined surface S7 with respect to one main surface F1 and the angle formed by the eighth inclined surface S8 with respect to the other main surface F2 are both obtuse angles. Further, the angle formed by the ninth inclined surface S9 with respect to one main surface F1 and the angle formed by the tenth inclined surface S10 with respect to the other main surface F2 are both obtuse angles.

As shown in FIG. 2, the rectangular annular first sealing pattern 201 on one main surface F1 side of the crystal diaphragm 2 is one end portion in the long side direction (Z'axis direction) of the crystal diaphragm 2. The connecting portion 201a connected to the first metal film 27 of the above, and the first extending portions 201b and 201b extending from both ends of the connecting portion 201a along the long side direction (Z'axis direction), respectively, and crystal vibration. It is provided with a second extending portion 201c that extends along the short side direction (X-axis direction) of the plate 2 and connects the extending ends of the first extending portions 201b and 201b. The second extension portion 201c is connected to the first extraction electrode 203 drawn from the first excitation electrode 25. Therefore, the first metal film 27 is electrically connected to the first excitation electrode 25 via the first drawer electrode 203 and the first sealing pattern 201. An electrodeless region in which no electrode is formed is provided between the second extending portion 201c extending along the short side direction of the crystal diaphragm 2 and the second metal film 28, and the first sealing is performed. The pattern 201 and the second metal film 28 are insulated from each other.

As shown in FIG. 5, the rectangular annular second sealing pattern 202 on the other main surface F2 side of the crystal diaphragm 2 is the other end portion in the long side direction (Z'axis direction) of the crystal diaphragm 2. 202a connected to the second metal film 28, first extending portions 202b and 202b extending from both ends of the connecting portion 202a along the long side direction, and the short side direction of the crystal diaphragm 2. A second extension portion 202c is provided so as to extend along the above and connect the extension ends of the first extension portions 202b and 202b. The connection portion 202a is connected to the second extraction electrode 204 drawn from the second excitation electrode 26. Therefore, the second metal film 28 is electrically connected to the second excitation electrode 26 via the connection portion 202a of the second extraction electrode 204 and the second sealing pattern 202. An electrodeless region in which no electrode is formed is provided between the second extending portion 202c extending along the short side direction of the crystal diaphragm 2 and the first metal film 27, and the second sealing is provided. The pattern 202 and the first metal film 27 are insulated from each other.

As shown in FIG. 2, the widths of the first extending portions 201b and 201b of the first sealing pattern 201 extending along the long side direction of the crystal diaphragm 2 are along the long side direction. Electrodeless regions are provided on both sides of the first extending portions 201b, 201b in the width direction (vertical direction in FIG. 2), which is narrower than the width of the extending outer frame portion 23, and in which electrodes are not formed.

Of the electrodeless regions on both sides of the first extending portions 201b and 201b, the outer non-electrode regions extend to the first metal film 27, and the second metal film 28 and the second extending portion 201c It is connected to the electrodeless area between them. As a result, the outside of the connection portion 201a, the first extension portion 201b, 201b, and the second extension portion 201c of the first sealing pattern 201 is surrounded by electrodeless regions having substantially the same width. This electrodeless region extends from the outside of one end of the connecting portion 201a extending along the short side direction of the crystal diaphragm 2 along the first extending portion 201b, and extends from the extending end to the second extending portion. It extends along 201c and extends from the extending end to the outside of the other end of the connecting portion 201a along the other first extending portion 201b.

An electrodeless region is formed inside the connection portion 201a of the first sealing pattern 201 in the width direction, and this electrodeless region is continuous with the electrodeless region inside the first extension portions 201b, 201b. There is. An electrodeless region is formed inside the second extending portion 201c in the width direction except for the first drawing electrode 203 of the connecting portion 24, and this electrodeless region is formed in the first extending portions 201b and 201b. It is connected to the inner electrodeless region. As a result, the inside of the connecting portion 201a, the first extending portion 201b, 201b, and the second extending portion 201c of the first sealing pattern 201 in the width direction except for the first drawing electrode 203 of the connecting portion 24. It is surrounded by a rectangular annular electrodeless region in plan view.

As shown in FIG. 5, the widths of the first extending portions 202b and 202b of the second sealing pattern 202 extending along the long side direction of the crystal diaphragm 2 are along the long side direction. Electrodeless regions are provided on both sides of the first extending portions 202b, 202b in the width direction (vertical direction in FIG. 5), which are narrower than the width of the extending outer frame portion 23 and have no electrodes formed.

Of the electrodeless regions on both sides of the first extending portions 202b and 202b, the outer non-electrode regions extend to the second metal film 28, and the first metal film 27 and the second extending portion 202c It is connected to the electrodeless area between them. As a result, the outside of the connection portion 202a, the first extension portion 202b, 202b, and the second extension portion 202c of the second sealing pattern 202 is surrounded by electrodeless regions having substantially the same width. This electrodeless region extends from the outside of one end of the connecting portion 202a extending along the short side direction of the crystal diaphragm 2 along one of the first extending portions 202b, and extends from the extending end to the second extending portion. It extends along 202c and extends from the extending end to the outside of the other end of the connecting portion 201a along the other first extending portion 202b.

An electrodeless region is formed inside the connecting portion 202a of the second sealing pattern 202 in the width direction except for the second drawer electrode 204 of the connecting portion 24, and this electrodeless region is the first extending portion. It is connected to the electrodeless region inside 202b and 202b. An electrodeless region is formed inside the second extending portion 202c in the width direction, and this electrodeless region is continuous with the inner non-electrode region of the first extending portions 202b, 202b. As a result, the inside of the connecting portion 202a, the first extending portion 202b, 202b, and the second extending portion 202c of the second sealing pattern 202 in the width direction except for the second drawing electrode 204 of the connecting portion 24. It is surrounded by a rectangular annular electrodeless region in plan view.

As described above, the first extension portions 201b, 201b; 202b, 202b of the first and second sealing patterns 201, 202 are made narrower than the width of the outer frame portion 23, and the first extension portions 201b, 201b; Electrodeless regions are provided on both sides of 202b and 202b in the width direction, and electrodeless regions are provided inside the connecting portions 201a and 202a and the second extending portions 201c and 202c in the width direction. The electrodeless region is formed by patterning the first and second sealing patterns 201 and 202 that wrap around the side surface of the outer frame portion 23 during sputtering by photolithography technology and removing them by metal etching. .. As a result, it is possible to prevent a short circuit caused by the first and second sealing patterns 201 and 202 wrapping around the side surface of the outer frame portion 23.

In this embodiment, as the first and second sealing members, the first and second excitation electrodes 25 and 26 of the quartz diaphragm 2 are covered on both main surfaces of the quartz diaphragm 2 having the above configuration. 1, The second resin films 3 and 4 are bonded.

6 and 7 are schematic cross-sectional views of the crystal oscillator 1 of FIG. 1, and FIG. 2 shows a state in which the first and second resin films 3 and 4 are bonded to the crystal diaphragm 2 of FIG. It is a schematic cross-sectional view along the line AA and the line BB. The excitation electrodes 25, 26, the metal films 27, 28, etc. are negligibly thinner than the crystal diaphragm 2 and the first and second resin films 3, 4, and are omitted in FIGS. 6 and 7. ing.

The first and second resin films 3 and 4 are rectangular films. The rectangular first and second resin films 3 and 4 have the first and second sealing patterns 201, except for the first and second metal films 27 and 28 at both ends in the longitudinal direction of the crystal diaphragm 2. It is a size that covers a rectangular area including 202, and is joined to the rectangular area.

In this embodiment, the first and second resin films 3 and 4 are made of a heat-resistant resin film, for example, a polyimide resin film. The first and second resin films 3 and 4 have a thermoplastic adhesive layer formed on the entire front and back surfaces. The first and second resin films 3 and 4 have, for example, such that the rectangular peripheral end portion seals the vibrating portion 21 on the outer frame portions 23 of both main surfaces F1 and F2 of the crystal diaphragm 2. , Each is heat-bonded by a heat press.

Since the polyimide resin film has a heat resistance of about 300 ° C., it can withstand the high temperature of the solder reflow process when the crystal oscillator 1 is solder-mounted on a circuit board or the like, and the first and second resin films 3 can be used. , 4 will not be deformed.

The first and second resin films 3 and 4 of this embodiment are transparent, but may be opaque depending on the conditions of heat crimping. The first and second resin films 3 and 4 may be transparent, opaque, or translucent.

The first and second resin films 3 and 4 are not limited to polyimide resins, and resins classified as super engineering plastics, such as polyamide resins and polyether ether ketone resins, may be used.

The first and second excitation electrodes 25 and 26 of the crystal diaphragm 2, the first and second metal films 27 and 28, the first and second sealing patterns 201 and 202, and the first and second extraction electrodes 203, In 204, for example, Au is laminated on a base layer made of, for example, Ti or Cr, and further, for example, Ti, Cr or Ni is laminated and formed.

In this embodiment, the base layer is Ti, and Au and Ti are laminated and formed on the base layer. Since the uppermost layer is Ti in this way, the bonding strength with the polyimide resin film is improved as compared with the case where Au is the uppermost layer.

As described above, the upper layer of the rectangular annular first and second sealing patterns 201 and 202 to which the rectangular first and second resin films 3 and 4 are bonded is made of Ti, Cr or Ni (or oxides thereof). ), So that the bonding strength with the first and second resin films 3 and 4 can be increased as compared with Au and the like.

In the crystal oscillator 1, in order to obtain the required vibration characteristics, the vibrating unit 21 needs to have a size of a certain size or more. Therefore, in the small crystal oscillator 1, an area of a certain size or more is secured in the vibrating portion 21, and further, an area required for joining the first and second resin films 3 and 4 and the crystal diaphragm 2 is secured. Is not easy.

In this embodiment, the bonding area between the first and second resin films 3 and 4 and the crystal diaphragm 2 can be increased without increasing the size of the crystal oscillator 1 so that the required bonding area can be secured. It is configured as follows.

FIG. 8 is an enlarged view of section P1 of FIG.

The first resin film 3 is a part of the first inclined surface S1 in which the remaining region other than the bonding region bonded to one main surface F1 of the crystal diaphragm 2 is an inner surface connected to the one main surface F1. It is joined to S1a. That is, the first resin film 3 is joined not only from one main surface F1 but also from the main surface F1 to a part S1a of the first inclined surface S1.

In FIG. 8, only the first inclined surface S1 extending along the short side direction of the crystal diaphragm 2 is shown, but the second inclined surface also shown in FIG. 6 extending along the short side direction of the crystal diaphragm 2 is shown. The same applies to the surface S2. That is, the second resin film 4 is joined not only from the other main surface F2 but also from the main surface F2 to a part of the second inclined surface S2.

As described above, the angle formed by the first inclined surface S1 with respect to one main surface F1 of the crystal diaphragm 2 and the angle formed by the second inclined surface S2 with respect to the other main surface F2 of the crystal diaphragm 2 are both. It is an obtuse angle. Therefore, the first and second resin films 3 and 4 are joined from the main surfaces F1 and F2 along a gentle obtuse angle over a part of the first and second inclined surfaces S1 and S2.

FIG. 9 is an enlarged view of section P2 of FIG.

The first resin film 3 is a part of a fifth inclined surface S5 in which the remaining region other than the bonding region bonded to one main surface F1 of the crystal diaphragm 2 is an inner surface connected to one main surface F1. It is joined to S5a. That is, the first resin film 3 is bonded not only to one main surface F1 but also from the main surface F1 to a part S5a of the fifth inclined surface S5.

In FIG. 9, only the fifth inclined surface S5 extending along the long side direction of the crystal diaphragm 2 is shown, but the third inclined surface also shown in FIG. 7 extending along the long side direction of the crystal diaphragm 2 is shown. The same applies to the surface S3. That is, the third resin film 3 is joined not only from one main surface F1 but also from the main surface F1 to a part of the third inclined surface S3.

The same applies to the fourth and sixth inclined surfaces S4 and S6 shown in FIG. 7 extending along the long side direction of the crystal diaphragm 2. That is, the second resin film 4 is bonded not only to the other main surface F2 but also from the main surface F2 to a part of the fourth and sixth inclined surfaces S4 and S6.

As described above, the angle formed by the third and fifth obtuse surfaces S3 and S5 with respect to one main surface F1 of the crystal diaphragm 2 and the fourth and sixth obtuse surfaces with respect to the other main surface F2 of the crystal diaphragm 2. The angles formed by S4 and S6 are obtuse angles. Therefore, the first and second resin films 3 and 4 are formed on the third and fifth inclined surfaces S3 and S5 or the fourth and sixth inclined surfaces S4 along a gentle obtuse angle from the main surfaces F1 and F2. Each part of S6 is joined.

As described above, the first and second resin films 3 and 4 are formed from the main surfaces F1 and F2 of the outer frame portion 23 to the inner side surfaces of the third and fifth inclined surfaces S3 and S5, or the fourth and sixth surfaces. Since the first and second resin films 3 and 4 are joined only to each of the inclined surfaces S4 and S6, the first and second resin films 3 and 4 are joined only to the main surfaces F1 and F2. 2 The resin films 3 and 4 are close to the vibrating portion 21 side.

In this embodiment, as shown in FIG. 7, the corners on the outer peripheral side of the vibrating portion 21 are the third and fifth inclined surfaces S3 and S5 of the outer frame portion 23, and the fourth and sixth inclined surfaces S4. The 15th and 17th inclined surfaces S15 and S17 facing S6, and the 16th and 18th inclined surfaces S18, respectively. As a result, the first and second resin films 3 and 4 are the third to sixth inner surfaces of the outer frame portion 23, as compared with the case where the corner portion on the outer peripheral side of the vibrating portion 21 is not an inclined surface. It is possible to increase the separation distance from the portion joined to each part of the inclined surfaces S3 to S6 to the vibrating portion 21. Since the separation distance can be increased in this way, when the first and second resin films 3 and 4 are bent toward the vibrating portion 21, for example, the first and second resin films 3 and 4 and the vibrating portion are formed. It is possible to suppress contact with 21.

FIG. 10 is an enlarged view of section P3 of FIG.

As shown in FIG. 10, the first resin film 3 is an outer surface in which the remaining region other than the bonding region bonded to one main surface F1 of the crystal diaphragm 2 is connected to one main surface F1. It is joined to a part S7a of the seventh inclined surface S7. That is, the first resin film 3 is bonded not only to one main surface F1 but also from the main surface F1 to a part S7a of the seventh inclined surface S7.

In FIG. 10, only the seventh inclined surface S7 extending along the long side direction of the crystal diaphragm 2 is shown, but the ninth inclined surface also shown in FIG. 7 extending along the long side direction of the crystal diaphragm 2 is shown. The same applies to the surface S9. That is, the third resin film 3 is joined not only from one main surface F1 but also from the main surface F1 to a part of the ninth inclined surface S9.

The same applies to the 8th and 10th inclined surfaces S8 and S10 shown in FIG. 7 extending along the long side direction of the crystal diaphragm 2. That is, the second resin film 4 is bonded not only to the other main surface F2 but also from the main surface F2 to a part of the eighth and tenth inclined surfaces S8 and S10, respectively.

As described above, the angles formed by the 7th and 9th obtuse planes S7 and S9 with respect to one main surface F1 of the crystal diaphragm 2 and the 8th and 10th obtuse planes with respect to the other main surface F2 of the crystal diaphragm 2 The angles formed by S8 and S10 are obtuse angles. Therefore, the first and second resin films 3 and 4 have the seventh and ninth inclined surfaces S7 and S9, or the eighth and tenth inclined surfaces S8, along a gentle obtuse angle from the main surfaces F1 and F2. Each part of S10 is joined.

As described above, in the present embodiment, the first and second resin films 3 and 4 are not only the two main surfaces F1 and F2 of the crystal diaphragm 2, but also the first to sixth inner peripheral sides surrounding the vibrating portion 21. Since it is also joined to a part of the inclined surfaces S1 to S6 and a part of the seventh to tenth inclined surfaces S7 to S10 which are outer surfaces, the first one without increasing the size of the crystal oscillator 1. The required bonding area can be secured by increasing the bonding area between the second resin films 3 and 4 and the crystal diaphragm 2.

The first resin film 3 or the second resin film 4 is joined to all the inclined surfaces S1 to S10 of the first to sixth inclined surfaces S1 to S6 and the seventh to tenth inclined surfaces S7 to S10. It does not have to be, and may be joined to a part of at least one inclined surface.

In this embodiment, as shown in FIG. 2, since the vibrating portion 21 having a substantially rectangular plan view is connected to the outer frame portion 23 by a connecting portion 24 provided at one corner of the vibrating portion 21, 2 The stress acting on the vibrating portion 21 can be reduced as compared with the configuration in which the portions are connected at or above.

Further, in this embodiment, the connecting portion 24 protrudes from one side of the inner circumference of the outer frame portion 23 along the X-axis direction and is formed along the Z'axis direction. The first and second metal films 27 and 28 formed at both ends of the crystal diaphragm 2 in the Z'axis direction are used as mounting terminals and are directly bonded to a circuit board or the like by soldering or the like. Therefore, it is conceivable that the contraction stress acts in the long side direction (Z'axis direction) of the crystal oscillator, and the stress propagates to the vibrating portion, so that the oscillation frequency of the crystal oscillator is likely to change. On the other hand, in this embodiment, since the connecting portion 24 is formed in the direction along the contraction stress, it is possible to suppress the contraction stress from propagating to the vibrating portion 21. As a result, it is possible to suppress a change in the oscillation frequency when the crystal oscillator 1 is mounted on the circuit board.

Note that the penetrating portion 22 between the vibrating portion 21 and the outer frame portion 23 may be omitted, and the outer frame portion 23 may be continuously provided to the vibrating portion 21 so as to surround the thin-walled vibrating portion 21.

Next, a method for manufacturing the crystal oscillator 1 of this embodiment will be described.

11A to 11E are schematic cross-sectional views schematically showing a process of manufacturing the crystal oscillator 1.

First, the AT-cut crystal wafer (AT-cut crystal plate) 5 before processing shown in FIG. 11A is prepared. As shown in FIG. 11B, the crystal wafer 5 is subjected to wet etching using a photolithography technique to form an outer shape of a plurality of crystal diaphragm portions 2a and a frame portion (not shown) that supports them. Further, the outer shape of each part such as the outer frame portion 23a and the vibration portion 21a thinner than the outer frame portion 23a is formed on the crystal diaphragm portion 2a. That is, the processing process of the outer shape and the vibrating portion is carried out.

By the wet etching of the crystal wafer 5, the above-mentioned first to tenth inclined surfaces S1 to S10 and the like are formed due to the etching anisotropy due to the crystal orientation of the crystal. In FIGS. 11A to 11E corresponding to FIG. 3, only the first and second inclined surfaces S1 and S2 are shown.

Next, as shown in FIG. 11C, the first and second excitation electrodes 25a and 26a and the first and second excitation electrodes 25a and 26a are placed at predetermined positions of the crystal vibrating plate portion 2a by the sputtering technique or the vapor deposition technique and the photolithography technique. An electrode forming step of forming the metal films 27a, 28a and the like is carried out.

Further, as shown in FIG. 11D, the resin films 3a and 4a are heat-bonded so as to cover both the front and back main surfaces of each crystal diaphragm portion 2a with continuous resin films 3a and 4a, respectively, and each crystal vibration is performed. Each vibrating portion 21a of the plate portion 2a is sealed.

12A to 12C are schematic cross-sectional views schematically showing a step of heat-pressing the resin films 3a and 4a to each quartz diaphragm portion 2a.

First, as shown in FIG. 12A, between the upper pressure heating block 7 and the lower pressure heating block 8, each crystal diaphragm portion whose main surfaces are covered with resin films 3a and 4a, respectively. 2a is set with the protective film 6 interposed above and below.

Next, as shown in FIG. 12B, the first and second resin films 3a and 4a are pressure-heated and pressure-bonded to each crystal diaphragm portion 2a by the upper and lower pressure- heating blocks 7 and 8. By the step of heat-pressing the resin films 3a and 4a to each crystal diaphragm portion 2a, as described above, the resin films 3a and 4a are not only on both main surfaces F1 and F2 of the crystal diaphragm portion 2a but also on the inner surface surface. It is joined to at least a part of the first to sixth inclined surfaces S1 to S6 and the outer surface, the seventh to tenth inclined surfaces S7 to S10.

Next, as shown in FIG. 12C, each crystal diaphragm portion 2a to which the first and second resin films 3a and 4a are bonded is taken out. Then, the protective film 6 is removed in the protective film removing step.

The step of heat-pressing the resin films 3a and 4a to each crystal diaphragm portion 2a is performed in an atmosphere of an inert gas such as nitrogen gas. The step of heat crimping is not limited to the atmosphere of the inert gas, but may be performed in the atmosphere of the atmosphere or the atmosphere of reduced pressure.

Next, as shown in FIG. 11E, the continuous resin films 3a and 4a are cut so as to expose the first and second metal films 27 and 28 so as to correspond to the respective crystal diaphragms 2. Unnecessary parts are removed, and each crystal diaphragm 2 is separated and individualized.

As a result, a plurality of crystal oscillators 1 shown in FIG. 1 can be obtained.

According to the present embodiment, since the first and second resin films 3 and 4 are joined to both the front and back main surfaces F1 and F2 of the crystal diaphragm 2 to form the crystal oscillator 1, an insulating material such as ceramic is formed. An expensive base or lid is not required as in the conventional example in which the crystal vibrating piece is housed in the base having the concave portion and the lid is joined to the base and sealed airtightly.

Thereby, the cost of the crystal oscillator 1 can be reduced, and the crystal oscillator 1 can be provided at a low cost.

In addition, it is possible to reduce the thickness (lower height) compared to the conventional example in which the quartz vibrating piece is stored in the concave portion of the base and sealed with a lid.

In the crystal oscillator 1 of the present embodiment, since the vibrating portion 21 is sealed by the first and second resin films 3 and 4, a metal or ceramic lid is joined to the base and hermetically sealed. The airtightness is inferior to that of the conventional example, and the resonance frequency of the crystal oscillator 1 tends to change over time.

However, for example, in BLE (Bluetooth (registered trademark) Low Energy) among short-range wireless communication applications, standards such as frequency deviation are relatively loose, so in such applications, inexpensive crystals sealed with a resin film are used. It is possible to use the oscillator 1.

In the above embodiment, as shown in FIG. 2, a first sealing pattern 201 to which the first resin film 3 is bonded is substantially formed on one main surface F1 of both main surfaces F1 and F2 of the crystal diaphragm 2. A second resin film 4 is bonded to both main surfaces F1 and F2 of the crystal diaphragm 2 so as to surround the rectangular vibrating portion 21 and to the other main surface F2 as shown in FIG. The second sealing pattern 202 is formed in a rectangular ring shape so as to surround the substantially rectangular vibration portion 21, but the first and second sealing patterns 201 and 202 of the rectangular ring shape may be omitted.

13 and 14 are a schematic plan view and a schematic bottom view of the crystal diaphragm 21 excluding the _first and second sealing patterns 201 and 202.

In the quartz diaphragm 21, as shown in FIG. 13, the _first metal film 27 is electrically connected to the first excitation electrode 25 via the routing electrode 209 and the first extraction electrode 203.

As shown in FIG. 14, the second metal film 28 is electrically connected to the second excitation electrode 26 by extending the second extraction electrode 204.

Other configurations are the same as those in the above embodiment.

In each of the above embodiments, the first and second metal films 27 and 28 of the crystal diaphragms 2 and 2 ₁ function as mounting terminals for mounting the crystal oscillator 1 on a circuit board or the like as described above. have. As another embodiment of the present invention, the first and second mounting terminals are formed separately from the first and second metal films 27 and 28, and the first and second metal films 27 and 28 are formed by the first and first metal films 27 and 28. The two mounting terminals may function as connection electrodes for electrically connecting the first and second excitation electrodes 25 and 26.

The embodiment in which the first and second metal films 27 and 28 function as connection electrodes for electrically connecting the first and second mounting terminals and the first and second excitation electrodes 25 and 26 is shown in the figure. 15 and FIG.

15 and 16 are _a schematic perspective view and a schematic cross-sectional view of the crystal oscillator 11. The external size of the crystal oscillator ₁ of this embodiment is the same as the external size of the crystal oscillator 1 of each of the above embodiments. In FIG. 16, the inclined surface of the crystal is simplified in order to exaggerate the formed region of the metal film.

The crystal vibrating plate 2 ₂ of the crystal oscillator 1 ₁ of this embodiment has a vibrating portion 21 ₁ on which the first and second excitation electrodes 25 ₁ , 26 ₁ are formed and the vibrating portion 21 2 thereof, as in each of the above embodiments. It is provided with an outer frame portion 23 ₁ that surrounds the periphery of the 21 ₁ with the penetrating portion 22 ₁ interposed therebetween, and a connecting portion 24 ₁ that connects the vibrating portion 21 ₁ and the outer frame portion 23 ₁ .

In this embodiment, the first and second resin films 3 ₁ and 4 ₁ are the vibrating portion 21 1 on which the first and second excitation electrodes 25 ₁ and 26 ₁ of the crystal diaphragm 2 ₂ are formed and the rectangle around the vibrating portion 21 ₁ . It is joined so as to cover not only the region of the above but also the entire surfaces of _both main surfaces of the crystal diaphragm 22. That is, the sizes of the first and second resin films 3 ₁ and 4 ₁ are larger than the sizes of the first and second resin films 3 and 4 of each of the above embodiments, and are the same size as the crystal diaphragm 2 ₂ . ..

Therefore, as shown in FIG. 16, of the first and _second metal films 27 ₁ , 28 ₁ formed on the quartz diaphragm 22, the portions formed on both main surfaces are the first and second metal films. It is covered with resin films 3 ₁ and 4 ₁ .

In this embodiment, the first and second resin films 3 are attached to both ends of the crystal diaphragm 2 ₂ in which the first and second resin films 3 ₁ and 4 ₁ are bonded to the entire surfaces of both main surfaces in the long side direction. A conductive paste is applied so as to cover substantially the entire outer surface of ₁ , ₄₁ and the crystal diaphragm 22 and heat-cured to form the first and _second mounting terminals 17 and 18.

Similar to each of the above-described embodiments, the first metal film 27 ₁ is formed on each side surface on the long side facing each other and the short side facing each other on one end of _both ends in the long side direction of the quartz diaphragm 22. It is formed over one side. Since the first mounting terminal 17 is formed on the first metal film 27 ₁ , the first mounting terminal 17 is electrically connected to the first metal film 27 ₁ . Since the first metal film 27 ₁ is electrically connected to the first excitation electrode 25 ₁ as in each of the above embodiments, the first metal film 27 ₁ is the first excitation electrode 25 ₁ and the first. It functions as a connection electrode for electrically connecting to the mounting terminal 17.

Similarly, the second metal film 28 ₁ extends over each side surface on the opposite long side and the other side surface on the opposite short side of the other end of _both ends in the long side direction of the quartz diaphragm 22. Is formed. Since the second mounting terminal 18 is formed on the _second metal film 281, the _second mounting terminal 18 is electrically connected to the second metal film 281. Since the second metal film 28 ₁ is electrically connected to the second excitation electrode 26 ₁ , the second metal film 28 ₁ electrically connects the second excitation electrode 26 ₁ and the second mounting terminal 18. Functions as a connecting electrode to connect.

In this embodiment, the first and second mounting terminals 17 and 18 are formed on the outer surface of the first and _second resin films 3 ₁ and 4 ₁ bonded to the crystal diaphragm 22. Compared with the configuration in which the first and second metal films 27 and 28 formed on the crystal diaphragms 2 and 2 ₁ are used as the first and second mounting terminals as in the above configuration, the first formed on the crystal diaphragm 2 ₂ is performed. , The size of the second metal films 27 ₁ , 28 ₁ can be reduced, and the size of the vibrating portion 21 ₁ sandwiched between the first and second metal films 27 ₁ , 28 ₁ can be increased accordingly. ..

As a result, the vibrating portion 21 ₁ can be lengthened along the long side direction of the crystal diaphragm 2 ₂ to improve the vibration characteristics without increasing the size of the crystal oscillator 1 ₁ itself, and the crystal can be improved. It is possible to secure the junction regions of the _first and second mounting terminals 17 and 18 required for mounting the oscillator 11.

In each of the above embodiments, the connecting portions 24 and 24 ₁ are provided at _one corner of the vibrating portions 21 and 21 ₁ having a substantially rectangular plan view. The number of formations is not limited to this. Further, the widths of the connecting portions 24 and ₂₄₁ do not have to be constant.

Further, it may be applied to an inverted mesa type quartz diaphragm having a thin vibrating portion and a thick peripheral portion without having a penetrating portion.

In each of the above embodiments, the first and second resin films 3, 3 ₁ ; 4, 4 ₁ having a thermoplastic adhesive layer are heat-bonded to the crystal vibrating plates ₂ , 2 ₁ , 22. As another embodiment, a photosensitive resin film, for example, a photosensitive polyimide film is used as the first and second resin films, and the photosensitive resin film is laminated on a crystal vibrating plate and exposed via a photomask. , It may be developed to remove unnecessary portions of the photosensitive resin film and to be cured.

In each of the above embodiments, the first and second resin films 3, 4; 3 ₁ , 4 ₁ are bonded to both main surfaces of the crystal diaphragms 2, 2 ₁ and 2 ₂ to seal the vibrating portion 21. However, instead of the resin film on at least one main surface, a conventional lid may be joined to seal the vibrating portion 21.

The crystal diaphragm may be a substantially rectangular shape in a plan view, and is not limited to the rectangle in a plan view as described above. It may have a shape in which a notch, a rectangle or the like in which an electrode is adhered to the notch, is formed.

The present invention is not limited to the crystal oscillator, and may be applied to other piezoelectric vibration devices such as the crystal oscillator. For example, the crystal oscillator according to the present invention and the integrated circuit element constituting the oscillation circuit together with the crystal oscillator are mounted on a substrate and sealed by covering the substrate with a cover, or the substrate is resin-molded. A crystal oscillator may be configured.

1,1 ₁ Crystal oscillator 2,2 1,2 ₂ Crystal vibrating plate 3,3 _{1 First resin film 4,4 1 Second} resin film 5 Crystal wafer 21,21 ₁ Vibrating part 23,23 ₁ Outer frame part 24 , 24 ₁ Connection part 25, 25 ₁ 1st excitation electrode 26,26 ₁ 2nd excitation electrode 27,27 ₁ 1st metal film 28,28 ₁ 2nd metal film 201 1st sealing pattern 202 2nd sealing pattern

Claims (7)

1. It has a first excitation electrode formed on one main surface of both main surfaces and a second excitation electrode formed on the other main surface of both main surfaces, and is connected to the first and second excitation electrodes, respectively. A piezoelectric diaphragm having first and second metal films,
   A first and second sealing member to be joined to both main surfaces of the piezoelectric diaphragm so as to cover the first and second excitation electrodes of the piezoelectric diaphragm is provided.
   The piezoelectric diaphragm has a vibrating portion in which first and second excitation electrodes are formed on both main surfaces, and an inner surface connected to at least one main surface of the two main surfaces on the vibrating portion side.
   The thickness of the vibrating portion is formed to be thinner than the thickness of the piezoelectric diaphragm other than the vibrating portion.
   At least one of the first and second sealing members is a resin film.
   In the resin film, the remaining region other than the bonding region bonded to the main surface of the piezoelectric diaphragm is connected to the main surface to which the resin film is bonded, the inner surface surface and the outer surface of the piezoelectric diaphragm. Joined to at least part of at least one side of the
   A piezoelectric vibration device characterized by that.
2. The piezoelectric diaphragm has an outer frame portion that surrounds the vibrating portion, the vibrating portion is thinner than the outer frame portion, and has a penetrating portion between the vibrating portion and the outer frame portion. ,
   The peripheral end of the resin film is joined to at least one main surface of both main surfaces of the outer frame portion.
   The piezoelectric vibration device according to claim 1.
3. The inner surface connected to the main surface is a side surface connected to the main surface on the inner peripheral side of the outer frame portion surrounding the vibrating portion.
   The piezoelectric vibration device according to claim 2.
4. The residual region of the film faces the vibrating portion surrounded by the outer frame portion and has a gap between the vibrating portion and the vibrating portion.
   The piezoelectric vibration device according to claim 3.
5. The inner side surface connected to the main surface to which the resin film is bonded is an inclined surface inclined so as to project toward the vibrating portion side toward the main surface on the opposite side.
   The angle formed by the inner surface with respect to the main surface to which the resin film is bonded is an obtuse angle.
   The piezoelectric vibration device according to any one of claims 1 to 4.
6. The piezoelectric diaphragm is a quartz diaphragm.
   The piezoelectric vibration device according to any one of claims 1 to 4.
7. The piezoelectric diaphragm is a quartz diaphragm.
   The piezoelectric vibration device according to claim 5.

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