JP5123080B2 - Lid, piezoelectric vibrator and piezoelectric oscillator for electronic parts - Google Patents

Description

  The present invention relates to a lid for electronic components used for electronic components that require hermetic sealing and protection, and a piezoelectric vibrator and a piezoelectric oscillator using the lid.

In recent years, electronic devices have been reduced in size, and accordingly, electronic components mounted therein have been reduced in size.
Among electronic components mounted on such electronic devices, there is a component that needs to be protected by providing a cover as a cover. With this lid, it is possible to prevent the parts that need to be protected from being affected by foreign matter or the external environment.
One example of an electronic component that requires this protection is a piezoelectric vibration element.
The piezoelectric vibration element is protected by being hermetically sealed with a lid having a recess after being mounted on the substrate body (see, for example, Patent Document 1). Alternatively, the piezoelectric vibration element is mounted in a substrate body having a recess, and is hermetically sealed with a flat lid member to be protected (see, for example, Patent Document 2).

Here, the lid is mainly made of metal, and is formed in a flat plate shape by punching with a sealing material provided on a metal plate as a main material.
Moreover, in the case of the cover body which has a recessed part, it forms by pressing a metal piece.

  The container body is mainly formed of ceramics. In the case where the recess is formed in the container body, it is formed by laminating and firing sheet-like ceramics on which a predetermined wiring pattern is formed. Therefore, the sheet-like ceramics to be laminated are laminated in a state where a plurality of through-hole portions are formed in order to form a frame that is an edge of the recess.

JP 2007-013608 A JP 2007-208470 A

  However, when electronic components are downsized, the lid that protects the components that need protection is also downsized. However, in the case of a lid having a conventional configuration, particularly in the case of a lid having a recess. Therefore, it is necessary to use a metal formed thinner than the conventional one. For this reason, when the concave portion is formed by press working, there is a risk that the portion to be bent may have a tear or the strength may be weakened in the portion that becomes the wall portion.

  Accordingly, an object of the present invention is to solve the above-described problems and provide a lid for an electronic component that is easy to manufacture and secures strength, a piezoelectric vibrator using the lid, and a piezoelectric oscillator.

  In order to solve the above-mentioned problem, the present invention is a lid for an electronic component, and is a substrate member selected from any one of aluminum, Kovar, SUS, and iron-nickel alloy, and a plurality of frame members made of aluminum. The thickness and width values of each of the frame portions are the same as the thickness values of the substrate members, and the recesses are formed by diffusion bonding in a state where the substrate members and the plurality of frame members are stacked. It is formed.

  In the present invention, the thickness and width values of the respective frame members may be the same as the thickness values of the substrate members.

  Further, the present invention may be configured such that the electronic component lid according to claim 1 or 2 is bonded to a substrate body on which a piezoelectric vibration element is mounted.

  According to the present invention, the lid for an electronic component according to claim 1 or 2 is configured such that the piezoelectric vibration element is covered with a container body on which the piezoelectric vibration element and an integrated circuit element having an oscillation circuit are mounted. It may be configured to be joined.

According to such a lid for electronic components, since the substrate member and the plurality of frame members constituting the lid are joined by diffusion bonding, there is no portion that is stretched by pressing or the like, and the strength is ensured. be able to.
In addition, since the substrate member and the plurality of frame members constituting the lid are configured to have the same thickness, they can be easily joined even if they are formed thinner and narrower than before. As a result, productivity can be improved and product costs can be reduced.
The plurality of frame members can be easily manufactured by photolithography technology and etching technology, and the substrate member and the plurality of frame members can be easily joined by diffusion bonding. Therefore, productivity can be improved and the cost of the product can be reduced.

  In addition, according to the piezoelectric vibrator using the lid for the electronic component, the width of the frame member that forms the recess is made narrower than before while ensuring the size of the space that covers the piezoelectric vibration element. The plane area can be reduced.

  Further, according to the piezoelectric oscillator using such a lid for electronic components, the width of the frame member forming the recess is made narrower than that of the conventional one while ensuring the size of the space covering the piezoelectric vibration element. The area can be reduced.

Next, the best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail with reference to the drawings as appropriate. Note that each component is exaggerated for easy understanding of the state.
The electronic component is described as a piezoelectric vibrator.

(First embodiment)
FIG. 1 is a perspective view conceptually showing an example of a lid for an electronic component according to an embodiment of the present invention. 2 is an exploded perspective view of FIG.
The piezoelectric vibrator has, for example, a plate-like shape in which a piezoelectric vibration element having excitation electrodes provided on both main surfaces, a mounting pad for mounting the piezoelectric vibration element, and an external terminal electrically connected thereto are provided. A base portion and a lid that is joined to the base portion and hermetically seals while covering the piezoelectric vibration element.
As shown in FIGS. 1 and 2, a lid 101 for an electronic component according to an embodiment of the present invention used for this piezoelectric vibrator has a substrate member 10, three frame members (a plurality of frame members) 20, and It is composed of

The substrate member 10 is selected from any one of aluminum, kovar, SUS, and iron nickel alloy. In the present embodiment, the material is described as aluminum.
As shown in FIG. 2, the substrate member 10 is formed in a flat plate shape so as to have a rectangular shape in plan view, and a thickness t1 thereof is, for example, 0.05 mm.
In addition, if the material of the board | substrate member 10 is made the same material as the frame member 20, it can be set as a more favorable joining state.
Such a substrate member 10 is manufactured using a photolithography technique and an etching technique.

The three frame members 20 are made of aluminum. As shown in FIG. 2, the frame member 20 is an annular member formed along the edge of the substrate member 10 and within the main surface of the substrate member 10.
The width value of the frame member 20 is the same as the thickness value of the substrate member 10. For example, when the thickness t1 of the substrate member 10 is 0.05 mm, the width value w1 of the frame member 20 is 0.05 mm. The thickness t2 of the frame member 20 may be the same as the thickness t1 of the substrate member 10.
In addition, if the material of the frame member 20 is the same as that of the substrate member 10, a better bonded state can be achieved.
The frame member 20 is manufactured using a photolithography technique and an etching technique in the same manner as the substrate member.

The lid 101 for an electronic component according to the first embodiment of the present invention is in a state of diffusion bonding by overlapping three frame members 20 on one main surface of the substrate member 10 and applying pressure under a predetermined pressure. And joining is performed.
Here, diffusion bonding is a method in which the diffusion of atoms occurring between the bonding surfaces is bonded by applying pressure to the extent that plastic deformation does not occur as much as possible under a temperature condition equal to or lower than the melting point of the matrix with the matrix in close contact. ("JIS Industrial Glossary Dictionary 5th Edition", published by the Japanese Standards Association, P331).

As a result, the three frame members 20 are joined to one main surface of the substrate member 10 to form the recesses K.

According to such a lid 101 for an electronic component, since the substrate member 10 and the plurality of frame members 20 are configured with the same thickness, there is no portion that is stretched by pressing or the like, and the strength is ensured. can do.
Further, the plurality of frame members 20 can be manufactured from a member having a smaller thickness than the conventional one by a photolithography technique and an etching technique and having a smaller width than the conventional one. Further, since the frame member 20 can be formed narrower than in the prior art by the photolithography technique and the etching technique, the entire lid 101 is secured while securing a space for hermetically sealing the piezoelectric vibration element (not shown). Can be made smaller.
Further, the substrate member 10 and the plurality of frame members 20 can be easily joined by diffusion joining. Therefore, even if it is thinner and narrower than before, it can be easily joined, so that productivity can be improved and the cost of the product can be reduced.

(Second embodiment)
FIG. 3 is a conceptual diagram showing an example of a piezoelectric vibrator according to the second embodiment of the present invention.
The piezoelectric vibrator 110 according to the second embodiment of the present invention covers the piezoelectric vibration element 103 mounted on the base portion 102 using the lid 101 for electronic components according to the first embodiment of the present invention. Thus, it is configured to be joined to the base portion 102.

The piezoelectric vibration element 103 is provided with electrodes in the vibration part, and can be selected and used in various ways such as a tuning fork structure, a flat plate structure, a structure in which the vibration part is recessed, and a structure in which the vibration part is formed in a convex shape.
In various structures, a drawing pattern drawn from the electrode to one end of the piezoelectric vibration element is provided.
In the following description, it is assumed that the piezoelectric vibration element 103 has a flat plate structure.

The base portion 102 is formed in a flat plate shape, and a mounting pad P for mounting the piezoelectric vibration element and a metal film M for bonding the lid body 101 are provided on one main surface of the base portion 102. The external terminal G is provided on the other main surface.
The metal film M is formed in an annular shape so as to border the base portion 102, and is formed at a position facing the frame member 20 of the lid body 101.
The mounting pad P is provided inside the metal film M, and is electrically connected to an external terminal G provided on the other main surface through a via hole (not shown). .

The piezoelectric vibration element 102 is mounted on the base portion 210 using the conductive adhesive D.
At this time, the mounting pad P of the base portion 102 and the routing pattern of the piezoelectric vibration element 102 are joined by the conductive adhesive D.

The lid body 101 is joined to the base portion 102 on which the piezoelectric vibration element 103 is mounted. When the lid 101 is bonded to the base portion 102, for example, the bonding is performed in a vacuum atmosphere or in an inert gas.
Here, the frame member 20 of the lid 101 is brought into contact with the metal film M of the base portion 102, and in this state, conventionally known anodic bonding is performed. As a result, the lid 101 is joined to the base portion 102 to complete the piezoelectric vibrator 110.

  Since the piezoelectric vibrator 110 is configured in this manner, the width of the frame member 20 that forms the recess K can be made narrower than the conventional one while ensuring the size of the space where the lid 101 covers the piezoelectric vibration element 103. Therefore, the plane area can be made smaller than before.

(Third embodiment)
FIG. 4 is a conceptual diagram showing an example of a piezoelectric oscillator according to the third embodiment of the present invention.
The piezoelectric oscillator 120 according to the third embodiment of the present invention is an integrated circuit element 105 including a container body 104 having a recess K2 on one main surface and an oscillation circuit mounted in the recess K2 of the container body 104. And the piezoelectric vibration element 103 mounted on the other main surface, and the lid 101 for an electronic component according to the first embodiment of the present invention that hermetically seals the piezoelectric vibration element 103. Yes.

  As in the second embodiment, the piezoelectric vibration element 103 is provided with electrodes in the vibration part, and includes various tuning fork structures, flat plate structures, structures in which the vibration part is recessed, structures in which the vibration part is formed in a convex shape, and the like. It can be selected and used. In various structures, a drawing pattern drawn from the electrode up to one end of the piezoelectric vibration element is provided. In the following description, it is assumed that the piezoelectric vibration element 103 has a flat plate structure.

  The container body 104 has a concave portion K2 on one main surface, and integrated circuit element mounting pads P2 for mounting the integrated circuit element 105 are provided in the concave portion K2, and the electronic substrate is provided at four corners of the one main surface. An external terminal G for joining is provided. On the other main surface of the container body 104, a mounting pad P for mounting the piezoelectric vibration element 103 and a metal film M for bonding the lid body 101 are provided. The external terminal G and the mounting pad P are electrically connected to a predetermined integrated circuit element mounting pad P2.

  The integrated circuit element 105 includes at least an oscillation circuit and is mounted in the recess K2 of the container body 104. The piezoelectric vibration element 103 is mounted on the other main surface of the container body 104 and hermetically sealed with the lid body 101 according to the first embodiment of the present invention. In this way, the piezoelectric oscillator 103 is configured.

  As described above, since the piezoelectric oscillator 103 is configured, the width of the frame member 20 that forms the recess K can be made narrower than the conventional one while ensuring the size of the space where the lid 101 covers the piezoelectric vibration element 103. Therefore, the plane area can be reduced as compared with the conventional case.

(Modification of the third embodiment)
Various modifications can be made in the piezoelectric oscillator according to the third embodiment of the present invention.
For example, in the structure of the container body, two concave portions are formed on one main surface, of which an integrated circuit element is mounted on one concave portion, a piezoelectric vibration element is mounted on the other concave portion, and the other concave portion is formed. You may comprise the cover body 101 so that it may cover.
Further, for example, a concave portion is formed on one main surface of the container body, and a concave portion is further formed in the concave portion, and any one of the concave portions on which the piezoelectric vibration element is mounted is joined so as to be covered with the lid body 101. Also good.
Further, for example, a recess may be formed on both one main surface and the other main surface of the container body, and the recess in which the piezoelectric vibration element is mounted may be joined so as to be covered with the lid body 101.
The piezoelectric oscillator may be configured by connecting the piezoelectric vibrator according to the first embodiment to a container body on which an integrated circuit element is mounted.
Even if comprised in this way, there exists an effect similar to 3rd embodiment.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment. For example, although three frame members have been described, the present invention is not limited to this, and a natural number such as two or four may be used in an overlapping manner.
The piezoelectric vibration element is used for, for example, ST-cut or AT-cut crystal vibration elements, tuning-fork type crystal vibration elements or sensors, bevel processing, complex processing, plano convex processing crystal vibration elements, and SAW devices. It may be a crystal plate.
Moreover, it is good also as a cover body of a piezoelectric oscillator.
Moreover, when using as a cover body of a piezoelectric vibrator, you may join and use a cover body so that the recessed part of the base part in which the recessed part was formed may be covered.

It is a perspective view which shows notionally an example of the cover body for electronic components which concerns on embodiment of this invention. FIG. 2 is an exploded perspective view of FIG. 1. It is a conceptual diagram which shows an example of the piezoelectric vibrator which concerns on 2nd embodiment of this invention. It is a conceptual diagram which shows an example of the piezoelectric oscillator which concerns on 3rd embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate member 20 Frame member 101 Lid body 102 Base part 103 Piezoelectric vibration element 104 Container body 105 Integrated circuit element 110 Piezoelectric vibrator 120 Piezoelectric oscillator K, K2 Concavity M Metal film

Claims (4)

A substrate member selected from any one of aluminum, kovar, SUS, and iron-nickel alloy, and a plurality of frame members made of aluminum,
A lid for electronic parts, wherein the substrate member and the plurality of frame members are diffusion bonded in a state of being overlapped to form a recess.   2. The lid for an electronic component according to claim 1, wherein the thickness and width of each frame member are the same as the thickness of the substrate member. The lid for an electronic component according to claim 1 or 2,
A piezoelectric vibrator characterized by being bonded to a substrate body on which a piezoelectric vibration element is mounted. The lid for an electronic component according to claim 1 or 2,
A piezoelectric oscillator comprising: a piezoelectric body and a container body on which an integrated circuit element having an oscillation circuit is mounted so as to cover the piezoelectric vibration element.

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