JP2001028484A - Package for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for electronic part which is effective in manufacture. SOLUTION: The package comprises a rectangular substrate 1 in top view, provided with a recess where an element 3 is housed, and a rectangular lid 2 in top view which corresponds to the top surface shape of the substrate and seals it in air-tight, with a sealing material 22 formed at the bonding surface between the lid and the substrate. Here, one corner of the lid is different in shape from other corner. A different-shaped corner of the lid is so arranged as to correspond to a specified corner of the substrate, with the main surface of the lid where a sealing material is formed facing down to contact the bonding surface for the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for electronic parts such as a crystal unit, a crystal filter, and a crystal oscillator, and a method of manufacturing the same. The present invention relates to electronic component packages that need to be distinguished.

[0002]

2. Description of the Related Art Examples of electronic components requiring hermetic sealing include quartz crystal products such as quartz oscillators, quartz filters and quartz oscillators. In each of these, a metal thin-film electrode is formed on the surface of a quartz vibrating plate and hermetically sealed to protect the metal thin-film electrode from the outside air.

In recent years, as disclosed in Japanese Patent Application Laid-Open No. 8-46075, a lid (lid material such as Kovar) is placed over the opening of the base by electron beam welding or laser beam welding, and the lid is formed directly on the lid. A method of easily and inexpensively performing hermetic sealing by melting and joining the sealing materials that have been used has been considered. Further, even in sealing by seam welding, metal plating is formed in the opening of the base without using an expensive seal ring (such as Kovar), and the sealing material formed on the lid is directly melt-bonded to the plating. Thus, a method of performing airtight sealing easily and inexpensively has been considered.

In such a configuration, it is preferable to form a sealing material only in a necessary sealing region, because it is possible to suppress the discharge of excess gas generated at the initial stage of melting. Metal brazing material (silver brazing, silver brazing,
In some cases, those formed with gold brazing, nickel brazing, solder brazing, gold tin brazing, etc., and metal plating (silver plating, gold plating, nickel plating, solder plating, gold tin plating, etc.) are used. Then, on these lids, nickel flash plating is formed on at least the front and back surfaces of the lids to prevent corrosion.

[0005]

However, in the above configuration, it is necessary to distinguish between the exposed surface (the front surface) and the welded surface (the back surface) of the lid at the time of hermetic sealing. Nevertheless, the color tone of the front and back of the lid does not change so much and it is difficult to make the front and back judgment. In particular, in a configuration in which nickel flash plating is formed on the front and back surfaces of the lid, it is extremely difficult to determine the front and back because the front and back colors are exactly the same. Also,
If the finished electronic component has directionality in the terminals (differentiation of input and output terminals, or distinction between input and ground terminals, distinction between output and ground terminals, etc.)
In addition, it was difficult to determine the terminal direction of the product. For this reason,
There is a problem that the image cannot be recognized in the manufacturing apparatus and it is not suitable for automation.

In view of this, there has been proposed a configuration in which a marking is provided at one end on the front side of the lid by printing or the like (see FIG. 14). However, in the above configuration, although the terminal direction can be determined, since the marking is printed after the formation of the sealing material, the determination of the front and back is difficult as described above, and the determination of the front and back is poor in configuration. Was. Inevitably, an increase in the number of steps and an increase in cost are inevitable.

[0007] The present invention has been made to solve the above problems, and without increasing the number of steps and cost.
At the time of hermetic sealing, the exposed surface of the lid and the welded surface can be reliably and easily distinguished, and as a completed electronic component, the directionality of the terminals can be reliably and easily distinguished. It is an object of the present invention to provide an electronic component package that is effective in manufacturing.

[0008]

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve the above-mentioned problems.
A flat rectangular base having a concave portion in which the element is accommodated, and a flat rectangular lid corresponding to the upper surface shape of the base and hermetically sealing the base; In a package for an electronic component in which a sealing material is formed on a joint surface with the base, one corner of the lid is configured to have a shape different from that of another corner, The corners having different body shapes are arranged so as to correspond to predetermined corners of the base, and the main surface of the lid on which the sealing material is formed faces the lower surface and is in contact with the joint surface with the substrate. It is characterized by being done.

According to the above configuration, at the stage of forming the lid, one corner is formed in advance so as to have a different shape from the other corner, and the position of the corner having the different shape with respect to the base is defined in advance. This makes it possible to easily distinguish between the front and back sides of the exposed surface (the front surface) and the welded surface (the back surface) of the lid during hermetic sealing without increasing the number of steps and cost.

According to a second aspect of the present invention, there is provided a substrate having a flat rectangular shape having a concave portion in which an element is accommodated,
A lid having a flat rectangular shape corresponding to the shape of the top surface of the base and hermetically sealing the base, and a sealing material formed on a joint surface of the lid with the substrate. In the component package, two corners on one diagonal of the lid are configured to have the same shape, and have different shapes from two corners on the other diagonal. Two diagonal corners of the same shape of the body are arranged corresponding to a predetermined diagonal of the base, the main surface of the lid on which the sealing material is formed faces the lower surface, and the bonding surface with the substrate is It is characterized by being constituted so that it may touch.

According to the above configuration, at the stage of forming the lid, two corners on one diagonal are formed in advance so that they have the same shape and have different shapes from the two corners on the other diagonal. In addition, by defining the diagonal positions of the two diagonal corners of the same shape with respect to the base body in advance, the exposed surface ( The front and back sides can be easily distinguished between the front side) and the welding side (back side).

A flat rectangular base having a recess in which the element is accommodated,
An electronic component package having a flat rectangular lid corresponding to the top surface shape of the base and hermetically sealing the base, and having an input terminal only at one end in the longitudinal direction of the base; One corner of the body is configured to have a different shape from the other corners, and the input terminal is configured to be disposed at a longitudinal end position on the corner side having a different shape of the lid. It is characterized by becoming.

According to the above configuration, at the stage of forming the lid, one corner is formed in advance so as to have a shape different from that of the other corners.
This serves as a mark indicating the position of the end of the electronic component package where the input terminal exists, without increasing the cost. Therefore, as a completed electronic component, the distinction between the input terminal and the output terminal, or the distinction between the input terminal and the ground terminal,
When the terminals have directionality, such as the distinction between the output terminal and the ground terminal, the terminal direction of the product can be easily determined.

According to a fourth aspect of the present invention, there is provided a flat rectangular base having a concave portion in which the element is accommodated.
An electronic component package having a flat rectangular lid corresponding to the top surface shape of the base and hermetically sealing the base, and having an input terminal only at one end in the longitudinal direction of the base; One corner of the body is configured to have a different shape from the other corners, and an input terminal is arranged at an end position facing a longitudinal end of the corner having a different shape of the lid. It is characterized by being comprised so that.

According to the above configuration, at the stage of forming the lid, one corner is formed in advance so as to have a shape different from that of the other corner, and the number of steps can be increased by changing the position of the corner having the different shape.
This serves as a mark indicating the end position of the electronic component package having no input terminal without increasing the cost. Therefore, as a completed electronic component, the distinction between the input terminal and the output terminal, or the distinction between the input terminal and the ground terminal,
When the terminals have directionality, such as the distinction between the output terminal and the ground terminal, the terminal direction of the product can be easily determined.

According to a fifth aspect of the present invention, there is provided a flat rectangular substrate having a concave portion in which the element is accommodated.
Corresponding to the top surface shape of the base, a flat rectangular lid formed by hermetically sealing the base, and a sealing material is formed on a joint surface of the lid with the base, In the electronic component package having an input terminal only on one end side in the longitudinal direction of the base, one corner of the lid is configured to be different in shape from another corner, and the shape of the lid is The different corners are arranged corresponding to the predetermined corners of the base, and the main surface of the lid on which the sealing material is formed faces the lower surface and is in contact with the joint surface with the substrate, and the shape of the lid The input terminals are arranged at different longitudinal end positions on the side of the corners.

According to the above configuration, at the stage of forming the lid, one corner is formed in advance so as to have a different shape from the other corners, and the position of the corner having the different shape with respect to the substrate is defined in advance. This makes it possible to easily distinguish between the front and back sides of the exposed surface (the front surface) and the welded surface (the back surface) of the lid during hermetic sealing without increasing the number of steps and cost. Moreover, due to the positions of the corners having different shapes,
This serves as a mark indicating the position of the end of the electronic component package where the input terminal is located, without increasing the number of steps and cost. For this reason, as a completed electronic component, if the terminal has directionality, such as the distinction between the input terminal and the output terminal, the distinction between the input terminal and the ground terminal, the distinction between the output terminal and the ground terminal, etc. Can easily be determined.

According to a sixth aspect of the present invention, there is provided a substrate having a flat rectangular shape having a concave portion in which an element is accommodated,
Corresponding to the top surface shape of the base, a flat rectangular lid formed by hermetically sealing the base, and a sealing material is formed on a joint surface of the lid with the base, In the electronic component package having an input terminal only on one end side in the longitudinal direction of the base, one corner of the lid is configured to be different in shape from another corner, and the shape of the lid is The different corners are arranged corresponding to the predetermined corners of the base, and the main surface of the lid on which the sealing material is formed faces the lower surface and is in contact with the joint surface with the substrate, and the shape of the lid The input terminal is arranged at an end position facing a longitudinal end on a different corner side of the input terminal.

According to the above configuration, at the stage of lid production, one corner is formed in advance so as to have a different shape from the other corners, and the position of the corner having the different shape with respect to the substrate is defined in advance. This makes it possible to easily distinguish between the front and back sides of the exposed surface (the front surface) and the welded surface (the back surface) of the lid during hermetic sealing without increasing the number of steps and cost. Moreover, due to the positions of the corners having different shapes,
This is a mark indicating the end position of the electronic component package having no input terminal without increasing the number of processes and cost. For this reason, as a completed electronic component, if the terminal has directionality, such as the distinction between the input terminal and the output terminal, the distinction between the input terminal and the ground terminal, the distinction between the output terminal and the ground terminal, etc. Can easily be determined.

[0020] As described in claim 7, an R surface or a C surface may be formed as a corner having a different shape of the lid. Such a corner shape can be very easily formed, and functions as a reliable mark without extremely narrowing the sealing area and adversely affecting the hermetic sealing of the package. In addition, since the R surface and the C surface can be easily formed at the stage of forming the lid, there is almost no increase in steps and cost.

Further, as described in claim 8, by forming nickel flash plating on at least the front and back main surfaces of the lid on which the sealing material is formed, the corrosion resistance of the lid is improved, A more reliable electronic component package can be obtained.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. 1, 2 and 3 taking a surface mount type crystal unit as an example. FIG. 1 is an exploded perspective view showing a first embodiment of the present invention, and FIG. 2 is a perspective view showing a state where FIG. 1 is assembled.
FIG. 3 is a schematic view illustrating the manufacturing method according to the first embodiment.

The basic configuration is as shown in FIG.
A concave, open-top rectangular, ceramic base 1 having a top open, a quartz vibrating plate 3, which is an electronic element housed in the base, and a flat rectangular, bonded to the opening of the base. , And a metal lid 2.

The substrate 1 having a concave shape in cross section includes a ceramic substrate 10 and a peripheral metal layer 11 formed in an opening around the concave shape. The metal layer 11 includes, for example, a metallized layer made of tungsten or the like, a lower plated layer made of nickel or the like formed thereon, and an upper plated layer made of gold or the like formed thereon.

Although not shown, electrode pads (not shown) are formed on the inner bottom surface of the ceramic base 10, and these electrode pads are connected to input terminals (not shown) on the outer bottom surface at one end in the longitudinal direction of the base through extraction electrodes. Reference numeral 12 denotes an output terminal which is electrically drawn. A rectangular crystal vibrating plate 3 as an electronic element is mounted on the electrode pad. Although not shown, a pair of excitation electrodes are formed on the front and back surfaces of the quartz vibrating plate 3, each of which is led out to the electrode pad and electrically and mechanically connected by a conductive bonding material (not shown). ing.

The lid 2 to be hermetically sealed is made of a metal base material 20 such as Kovar, and has a C surface 21 such that one corner is different in shape from another corner. This metal base material 20
A peripheral silver brazing layer 22 corresponding to the peripheral metal layer 11 is formed as a sealing material on the lower surface of the substrate. Instead of the silver brazing layer 22, another known metal brazing material layer or another known metal plating layer may be used. Further, nickel flash plating for corrosion prevention is formed on the front and back principal surfaces and side surfaces of the lid including the silver brazing layer.

Next, a method of manufacturing the above-described basic structure will be described with reference to FIG.
It will be explained together. In the first step, as shown in FIG. 3A, a C-plane 21 is formed such that one corner of the lid 2 has a different shape from the other three corners. This C surface is preferably formed integrally by press molding or the like when the lid is molded in advance. Note that, at this stage, any of the four corners may be formed.

In the second step, as shown in FIG.
When the longitudinal direction of the lid is arranged on the vertical side, the corner having the C surface 21 of the lid is positioned, for example, at the upper right portion (or the upper left portion, the lower right portion, or the lower left portion). The peripheral silver brazing layer 2 is formed on the opposing main surface of the lid arranged in the above manner.
Form 2 The silver brazing layer 22 is formed by using a rolling technique.

In the third step, as shown in FIG.
Nickel flash plating 23 is formed on the entire surface of the lid obtained in the second step. The upper part of FIG. 3 (c) shows the surface of the lid, and the lower part shows the welding surface of the lid (the opposite main surface). Nickel flash plating means a thickness of 0.
This refers to nickel plating formed with a thickness of 3 μm to 1 μm.

In the fourth step, as shown in FIG.
When the longitudinal direction of the base 1 on which the quartz vibrating plate 3 is mounted is arranged on the vertical side, the end of the base on the input terminal 12 side is positioned at the upper part. Then, as shown in FIG. 3E, when the longitudinal direction of the lid is arranged on the vertical side, the corner having the C surface 21 of the lid is moved to the upper left portion (in the second step, The lid is superimposed and mounted on the opening of the base so as to be located at the upper right, defined as the upper left, lower left at the lower right, and lower right at the lower left. This allows
The main surface of the lid on which the silver brazing layer is formed inevitably faces the base, so that the front and back sides can be clearly distinguished. Further, it is defined such that the input terminal is located at the upper portion which is the end on the C-plane side.

In the fifth step, as shown in FIG.
By irradiating an electron beam or a laser beam from above the lid, the metal layer of the base and the silver solder of the lid are melted, and the base and the lid are welded to be hermetically sealed. .

In the first embodiment, two types of C-plane positions can be defined as long as it is not necessary to distinguish the terminal direction. That is, as shown in FIG. 4 (a plan view showing another first embodiment), when the longitudinal direction of the base 1 is arranged on the vertical side in addition to the above-described C-plane position, the input terminals of the base 1 When the end portion on the 12th side is located in the upper portion and the longitudinal direction of the lid 2 is arranged on the vertical side, the corner having the C surface 21 of the lid is in the lower right portion (the second portion).
In the process of, if it is defined in the upper left, it is lower left,
(If it is the lower left, it may be located at the upper left). Also in this case, the main surface of the lid on which the silver brazing layer is formed necessarily faces the base, so that the front and back sides can be clearly distinguished.

Next, a second embodiment of the present invention will be described with reference to FIG. 5, FIG. 6, and FIG. FIG. 5 is an exploded perspective view showing the second embodiment of the present invention, and FIG. 6 is a perspective view showing a state where FIG. 5 is assembled. FIG. 7 is a schematic view showing a manufacturing method according to the second embodiment. The same parts as those in the first embodiment of the present invention are denoted by the same reference numerals, and a part of the description is omitted.

In the second embodiment, the ceramic base 10
Are electrically drawn out as input terminals 14 and output terminals 15 on the outer side bottom surfaces at both ends in the longitudinal direction. Further, the lid 2 to be hermetically sealed has an R surface 24 configured such that one corner is different in shape from the other corner, and a silver plating layer 25 is formed on the entire lower surface of the metal base material 20. I have. Instead of the silver plating layer 25, another known metal plating layer or another known metal brazing material layer may be used. Further, nickel flash plating 23 for preventing corrosion is formed on the front and back main surfaces and side surfaces of the lid including the silver plating layer.

Next, a method of manufacturing the above-described basic structure will be described with reference to FIG.
It will be explained together. In the first step, as shown in FIG. 7A, the R surface 24 is formed so that one corner of the lid 2 is different in shape from the other three corners. It is preferable that the R surface is integrally formed by press molding or the like when the lid is formed in advance. Note that, at this stage, any of the four corners may be formed.

In the second step, as shown in FIG.
When the longitudinal direction of the lid is arranged on the vertical side, the corner having the R surface 24 of the lid is positioned, for example, at the upper left portion (or the lower left portion, the upper right portion, or the lower right portion). The silver plating layer 25 is formed on the opposing main surface of the lid arranged in the above. The silver plating layer 25 can be easily formed by using a known plating technique.

In the third step, as shown in FIG.
Nickel flash plating 23 is formed on the entire surface of the lid obtained in the second step. The upper part of FIG. 7 (c) shows the surface of the lid, and the lower part shows the welding surface (the opposite main surface) of the lid.

In the fourth step, as shown in FIG.
When the longitudinal direction of the base 1 on which the quartz vibrating plate 3 is mounted is arranged on the vertical side, the end of the base on the input terminal 14 side is positioned at the upper part. Then, as shown in FIG. 7E, when the longitudinal direction of the lid is arranged on the vertical side, the corner having the R surface 24 of the lid is moved to the lower left portion (in the second step, The lid is superimposed on the opening of the base and mounted on the upper left, defined at the upper left, defined at the upper left, defined as the lower right at the upper right, and defined as the upper right at the lower right. This allows
The main surface of the lid on which the silver plating layer is formed inevitably faces the base, so that the front and back sides can be clearly distinguished. In addition, it is defined that the input terminal is located at the upper portion facing the lower portion which is the end on the R surface side.

In the fifth step, as shown in FIG.
In the same manner as in seam welding, the lid travels while pressing the upper ridge portion of the lid with an energizing roller, and the metal layer 11
And the silver plating layer of the lid are melted, and the base and the lid are welded to be hermetically sealed.

In the second embodiment, two types of R-plane positions can be defined as long as it is not necessary to distinguish the terminal direction. That is, as shown in FIG. 8 (a plan view showing another second embodiment), when the longitudinal direction of the base 1 is arranged on the vertical side, in addition to the above-mentioned R-plane position, the input terminals of the base 1 When the end on the 14 side is located in the upper part and the longitudinal direction of the lid 2 is arranged on the vertical side, the corner having the R surface 24 of the lid is in the upper right part (the second section).
In the process of, if it is defined as lower left, it is lower right, if it is upper right, it is
(If it is the lower right, it may be located at the lower left). Also in this case, the main surface of the lid on which the silver plating layer is formed necessarily faces the base, so that the front and back sides can be clearly distinguished.

In the first and second embodiments, the C-plane and the R-plane are formed at one of the four corners, but the C-plane and the R-plane are formed at the three corners. It may be formed. Also,
An R-plane or a C-plane may be formed at three corners, and a C-plane or an R-plane may be formed at the remaining corners.

Next, a third embodiment of the present invention will be described with reference to FIGS. 9 and 10, taking a surface-mount type crystal unit as an example. FIG. 9 is a perspective view showing the third embodiment, and FIG. 10 is a schematic view showing a manufacturing method according to the third embodiment. The same portions as those in the first and second embodiments of the present invention are denoted by the same reference numerals, and a part of the description is omitted.

In the third embodiment, the basic structure is the same as that of the first embodiment. However, the lid 2 to be hermetically sealed has two corners on one diagonal and two on the other diagonal. The C-planes 21 and 21 are configured to have different shapes from the two corners.

Next, a method of manufacturing the above-described basic structure will be described with reference to FIG.
It will be described together with 0. In the first step, as shown in FIG. 10A, of the cover 2, two corners on one diagonal line are different in shape from two corners on the other diagonal line. Surfaces 21 and 21 are formed. This C surface is preferably formed integrally by press molding or the like when the lid is molded in advance. In addition, at this stage, it may be formed at any diagonal corner.

In the second step, as shown in FIG. 10B, when the longitudinal direction of the lid is arranged on the vertical side, a diagonal line having the C faces 21 and 21 of the lid is, for example, shifted to the upper right. The peripheral silver brazing layer 22 is formed on the opposing main surface of the lid placed in this state at the upper left and lower left portions (or upper left and lower right portions). The formation of this silver brazing layer 22
It is formed using a rolling technique.

In the third step, as shown in FIG. 10C, nickel flash plating 23 is formed on the entire surface of the lid obtained in the second step. The upper part of FIG. 10 (c) shows the surface of the lid, and the lower part shows the welding surface of the lid (the opposite main surface).

In the fourth step, as shown in FIG. 10D, the longitudinal direction of the base 1 on which the quartz vibrating plate 3 is mounted is arranged on the vertical side. Then, as shown in FIG.
When the longitudinal direction of the lid is arranged on the vertical side, the diagonal line having the C surfaces 21 and 21 of the lid is placed on the upper left portion and the lower right portion (the upper left portion and the lower right portion in the second step). The lid is superposed and mounted on the opening of the base so as to be positioned at the upper right portion and the lower left portion if defined. As a result, the main surface of the lid on which the silver brazing layer is formed necessarily faces the base, so that the front and back sides can be clearly distinguished.

In a fifth step, as shown in FIG. 10F, an electron beam or a laser beam is irradiated from above the lid to melt the metal layer of the base and the silver solder of the lid. By welding the base and the lid,
Hermetically sealed.

Next, a fourth embodiment of the present invention will be described with reference to FIGS. 11, 12 and 13 by taking a surface-mount type crystal unit as an example. FIG. 11 is an exploded perspective view showing the fourth embodiment of the present invention, and FIG. 12 is a perspective view showing a state where FIG. 11 is assembled. FIG. 13 is a schematic view showing a manufacturing method according to the fourth embodiment. The same parts as those in the first, second and third embodiments of the present invention are denoted by the same reference numerals,
Some explanations have been omitted.

In the fourth embodiment, the ceramic base 10
Terminals 16, 17, 18, and 19 are formed on the side bottom surfaces of the corners, and the input terminal is electrically drawn as 17 and the output terminal 19. Further, the lid 2 to be hermetically sealed has R surfaces 24, 24, 24 formed at three corners, and the C surface 21 is configured such that one corner has a different shape from the other corners,
A silver plating layer 25 is formed on the entire upper and lower surfaces of the metal base material 20. Instead of the silver plating layer 25, another known metal plating layer or another known metal brazing material layer may be used. Further, the front and back principal surfaces of the lid including the silver plating layer,
Nickel flash plating 23 for corrosion prevention is formed on the side surface.

Next, a method of manufacturing the above-described basic structure will be described with reference to FIG.
It will be described together with 3. In the first step, as shown in FIG. 13A, three corners of the lid 2
24, 24 are formed, and the C-plane 21 is formed so that one corner is different in shape from the other three corners. It is preferable that the R surface and the C surface are integrally formed by press molding or the like when the lid is formed in advance. At this stage, the C plane may be formed at any of the four corners.

In the second step, as shown in FIG. 13B, a silver plating layer 25 is formed on the opposing main surface and the other main surface of the lid obtained in the first step. The silver plating layer 25 can be easily formed by using a known plating technique. In addition, the upper drawing of FIG. 13B shows the other main surface of the lid, and the lower drawing shows the opposite main surface of the lid.

In the third step, as shown in FIG. 13C, nickel flash plating 23 is formed on the entire surface of the lid obtained in the second step.

In a fourth step, as shown in FIG. 13D, when the longitudinal direction of the base 1 on which the quartz vibrating plate 3 is mounted is arranged on the vertical side, the input terminal 17 side of the base is arranged. Position the end in the upper part. At this time, the input terminal 17 is located at the upper left portion. Then, as shown in FIG. 13 (e), when the longitudinal direction of the lid is arranged on the vertical side, the corner having the C surface 21 of the lid is positioned at the upper left portion, and Laying the lid on the opening of the base,
Mount. Thus, the input terminal is configured to be located at the corner where the C plane exists.

In the fifth step, as shown in FIG. 13 (f), the lid is run while pressing the upper ridge portion of the lid with an energizing roller by the same method as seam welding, and the metal layer 11 And the silver plating layer of the lid are melted, and the base and the lid are welded to be hermetically sealed.

In the first to fourth embodiments, the C plane, R
The surface should be 0.2 to 0.2 mm from the top of the corner of the lid in order to ensure the sealing performance and not to reduce the function as a mark.
It is preferable in practice to configure the C plane and the R plane at a position of 0.3 mm.

It is to be noted that the present invention is not limited to the embodiment of the present invention, and it is also possible to selectively rearrange and apply the components in the first to fourth embodiments or to apply them in combination. Needless to say. Furthermore, although the present invention has exemplified the surface mount type crystal unit, the present invention may be applied to a package for a crystal filter or a crystal oscillator, or may be applied to other electronic components requiring hermetic sealing. Is also good. In these packages, a ground terminal may be configured in addition to the input terminal and the output terminal. By applying the present invention, the input terminal and the output terminal can be distinguished from each other, or the input terminal and the ground terminal can be connected. The direction of the terminal, such as the distinction between the terminal and the output terminal and the ground terminal, can be easily determined. In the electronic component package of the present invention, a beam sealing method using an electron beam, a laser beam, or the like, or a resistance heating sealing method using seam welding or the like has been described. High-frequency induction heating or the like may be used.

[0058]

According to the present invention, at the stage of lid production, one corner is formed in advance so as to have a different shape from the other corners, and the position of the corner having a different shape is defined. By doing so, it is possible to easily distinguish between the front and back surfaces between the exposed surface (the front surface) and the welded surface (the back surface) of the lid during airtight sealing without increasing the number of steps and cost. .

Alternatively, at the stage of forming the lid, two corners on one diagonal are formed in advance so that they have the same shape and have different shapes from the two corners on the other diagonal.
In addition, by defining the diagonal positions of the two diagonal corners of the same shape with respect to the base body in advance, the exposed surface ( The front and back sides can be easily distinguished between the front side) and the welding side (back side).

The positions of the corners having the different shapes do not increase the number of steps and increase the cost, so that the completed electronic component can be distinguished between the input terminal and the output terminal or the input terminal and the ground. If the terminal has directionality, such as distinction from the terminal, distinction between the output terminal and the ground terminal,
The terminal direction of the product can be easily determined.

Therefore, image recognition in the manufacturing apparatus can be easily performed, automation can be easily performed, and extremely high manufacturability can be obtained, so that an electronic component package effective in manufacturing can be provided.

According to the seventh aspect, the corners such as the R-plane and the C-plane can be formed very easily, and the sealing area is extremely narrowed to adversely affect the hermetic sealing of the package. Function as a reliable landmark. Moreover, these R surface and C surface are in the stage of lid creation,
Since it can be easily formed, there is almost no increase in steps and cost.

According to claim 8, by forming nickel flash plating on at least the front and back main surfaces of the lid on which the sealing material is formed, the corrosion resistance of the lid is improved,
A more reliable electronic component package can be obtained.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view according to a first embodiment.

FIG. 2 is a perspective view according to the first embodiment.

FIG. 3 is a schematic view illustrating a manufacturing method according to the first embodiment.

FIG. 4 is a plan view according to a first other embodiment.

FIG. 5 is an exploded perspective view according to a second embodiment.

FIG. 6 is a perspective view according to a second embodiment.

FIG. 7 is a schematic view showing a manufacturing method according to the second embodiment.

FIG. 8 is a plan view according to a second other embodiment.

FIG. 9 is a perspective view according to a third embodiment.

FIG. 10 is a schematic view illustrating a manufacturing method according to a third embodiment.

FIG. 11 is an exploded perspective view according to the first embodiment.

FIG. 12 is a perspective view according to the first embodiment.

FIG. 13 is a schematic view showing a manufacturing method according to the first embodiment.

FIG. 14 is a diagram showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base 10 ... Ceramic base 11 ... Metal layer 2 ... Lid 20 ... Metal base material 21 ... C surface 24 ... R surface 3 ... Quartz diaphragm ( Electronic components)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4E360 AB02 AB13 AB33 BA03 BC20 BD03 CA10 ED07 EE12 GA29 GA53 GC06 5J108 BB02 CC04 EE03 EE07 GG03 GG09 GG15 GG16

Claims (8)

[Claims] 1. A flat rectangular base having a recess in which an element is accommodated, and a flat rectangular lid corresponding to the top surface shape of the base and hermetically sealing the base. In the electronic component package in which a sealing material is formed on a bonding surface of the lid and the base, one corner of the lid is configured to have a shape different from that of another corner. Corners having different shapes of the lid are arranged corresponding to predetermined corners of the base, and a main surface of the lid on which a sealing material is formed faces a lower surface, and a bonding surface with the substrate. A package for an electronic component, which is configured to be in contact with the electronic component. 2. A flat rectangular base having a recess in which an element is accommodated, and a flat rectangular lid corresponding to the top surface shape of the base and hermetically sealing the base. In the electronic component package in which a sealing material is formed on a bonding surface of the lid with the substrate, two corners on one diagonal line of the lid are configured to have the same shape, and The two corners on the other diagonal are configured to be different in shape, and the two corners on the diagonal with the same shape of the lid are arranged corresponding to the predetermined diagonal of the base, A package for an electronic component, wherein a main surface of a lid on which a sealing material is formed faces a lower surface and is in contact with a bonding surface with a substrate. 3. A flat rectangular base having a concave portion in which an element is accommodated, and a flat rectangular lid corresponding to an upper surface shape of the base and hermetically sealing the base. In the electronic component package having an input terminal only on one end side in the longitudinal direction of the base, one corner of the lid is configured to have a different shape from the other corner, and An electronic component package, wherein input terminals are arranged at longitudinal end positions on corners having different shapes. 4. A flat rectangular base having a concave portion in which an element is accommodated, and a flat rectangular lid corresponding to the top surface shape of the base and hermetically sealing the base. In the electronic component package having an input terminal only on one end side in the longitudinal direction of the base, one corner of the lid is configured to have a different shape from the other corner, and A package for an electronic component, wherein input terminals are arranged at end positions opposed to longitudinal ends on corner sides having different shapes. 5. A flat rectangular base having a concave portion in which an element is accommodated, and a flat rectangular lid corresponding to the top surface shape of the base and hermetically sealing the base. In a package for an electronic component, wherein a sealing material is formed on a joint surface of the lid with the base, and an input terminal is provided only on one end side in the longitudinal direction of the base, one corner of the lid is provided. Is configured so as to have a shape different from that of the other corners, and the corners having a different shape of the lid are arranged corresponding to a predetermined corner of the base to form a sealing material for the lid. The main surface faces the lower surface and is in contact with the bonding surface with the substrate, and the input terminal is arranged at a longitudinal end position on a corner portion having a different shape of the lid. And electronic components package. 6. A flat rectangular base having a concave portion in which an element is accommodated, and a flat rectangular lid corresponding to an upper surface shape of the base and hermetically sealing the base. In a package for an electronic component, wherein a sealing material is formed on a joint surface of the lid with the base, and an input terminal is provided only on one end side in the longitudinal direction of the base, one corner of the lid is provided. Is configured so as to have a shape different from that of the other corners, and the corners having a different shape of the lid are arranged corresponding to a predetermined corner of the base to form a sealing material for the lid. The main surface faces the lower surface and is in contact with the joint surface with the substrate, and the input terminal is arranged at an end position facing a longitudinal end portion on a corner side having a different shape of the lid. A package for electronic components, comprising: 7. The corner having a different shape of the lid may be R
The package for an electronic component according to any one of claims 1 to 6, wherein a surface or a C surface is formed. 8. The electronic device according to claim 1, wherein nickel flash plating is formed on at least the front and back main surfaces of the lid on which the sealing material is formed. Package for parts.