JP2004088036A - Electronic device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device in which productivity and reliability can be enhanced. <P>SOLUTION: The electronic device is so constituted that a metallic seal ring 24A is attached on a ceramic base body 2. At the same time, an electronic component element 3 is arranged on the upper face of the ceramic base body 2 positioned inside the seal ring 24A, and the opening part of the seal ring 24A is sealed by joining a metallic lid body 5A on the upper face of the seal ring 24A. A chamfered part 24a is peripherally arranged at a corner on the outer peripheral side on the upper face of the seal ring, and at the same time, a bent part 5a bent inside along the chamfered part 24a is provided to the outer peripheral part of the lid body 5A, and the bent part 5a and the chamfered part 24a are joined by resistance welding. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic device incorporated in an electronic device, a communication device, or the like in a state in which electronic component elements such as a piezoelectric element, a quartz oscillator, and a semiconductor element are hermetically sealed, and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, electronic devices have been used to hermetically seal electronic component elements such as piezoelectric elements, quartz oscillators, and semiconductor elements.
[0003]
As such a conventional electronic device, for example, as shown in FIG. 10, an electronic component element 53 such as a quartz oscillator is accommodated in a cavity 520 provided on an upper surface of a ceramic base 52, and an opening of the cavity 520 is formed. Is sealed with a metal lid 55 to hermetically seal the electronic component element 53 (for example, see Patent Document 1).
[0004]
The ceramic base 52 has a ring-shaped ceramic substrate 522 integrally attached to an upper surface of a plate-shaped ceramic substrate 521, and the cavity 520 is formed inside the ring-shaped ceramic substrate 522.
[0005]
On the bottom surface of the cavity portion 520, that is, on the upper surface of the flat ceramic substrate 521 located inside the ring-shaped ceramic substrate 522, an electrode pad 525 to be joined to the electrode of the electronic component element 53 is provided. By joining the electrode pad 525 and the electrode of the electronic component element 53 with the conductive adhesive 54, the crystal unit 53 is electrically and mechanically connected to the ceramic base 52.
[0006]
Further, a metal seal ring 524 is interposed between the ceramic base 52 and the lid 55. A plating film made of Ni or the like is adhered to the surfaces of the seal ring 524 and the lid 55, and the metallization layer 523 in which the lower surface of the seal ring 524 is adhered to the upper surface of the ring-shaped ceramic substrate 522. Then, the plating film on the surface of the lid and the plating film on the upper surface of the seal ring are melted by a conventionally known resistance welding (seam welding), and the two are joined to join the lid. 55 was attached to the seal ring 524.
[0007]
[Patent Document 1]
JP 2001-77656 A
[0008]
[Problems to be solved by the invention]
However, in the above-described conventional electronic device, when the lid 55 is resistance-welded to the seal ring 524, a discharge spark is generated due to the contact between the roller electrode of the resistance welding device and the lid 55, and the molten metal component ( Foreign matter) may be scattered inside the cavity 520. If such foreign matter adheres to the electronic component element 53, the circuit wiring, and the like in the cavity 520, the characteristics of the electronic component element 53 may change significantly, or a short circuit may occur between the circuit wirings. However, there was a disadvantage that the property was lowered.
[0009]
The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to provide an electronic device capable of improving productivity and reliability and a method of manufacturing the same.
[0010]
[Means for Solving the Problems]
In the electronic device of the present invention, a metal seal ring is mounted on a ceramic substrate, and an electronic component element is disposed on an upper surface of the ceramic substrate located inside the seal ring. In an electronic device in which an opening of a seal ring is sealed by joining a lid made of a resin, a chamfered portion is provided around an outer peripheral side corner of an upper surface of the seal ring, and the chamfer is formed on an outer peripheral portion of the lid. A bent portion bent inward along the portion is provided, and the bent portion and the chamfered portion are joined by resistance welding.
[0011]
Further, the electronic device of the present invention is characterized in that the chamfered portion is a convex curved surface having a radius of curvature of 10 μm to 300 μm.
[0012]
Further, the electronic device according to the present invention is characterized in that the chamfered portion is a plane inclined by 5 ° to 35 ° with respect to the upper surface of the seal ring.
[0013]
Still further, in the electronic device of the present invention, a metal seal ring is attached on the ceramic base, and an electronic component element is disposed on an upper surface of the ceramic base located inside the seal ring. In an electronic device in which a metal lid is joined to seal an opening of a seal ring, an upper surface of the seal ring is formed as an inclined surface having an outer peripheral side lower than an inner peripheral side, A bent portion which is bent inward along the inclined surface is provided on an outer peripheral portion of the lid, and the bent portion and the inclined surface are joined by resistance welding.
[0014]
Still further, in the electronic device of the present invention, a metal seal ring is mounted on the ceramic base, and an electronic component element is disposed on an upper surface of the ceramic base located inside the seal ring. In the electronic device, a metal lid is bonded to the seal ring to seal the opening of the seal ring, a notch is provided around an outer peripheral corner of the upper surface of the seal ring, and an outer peripheral portion of the lid is formed. A bent portion bent toward the inside of the cutout portion, and the bent portion and the surface of the seal ring facing the cutout portion are joined by resistance welding.
[0015]
Still further, the electronic device of the present invention is characterized in that the seal ring and the lid are abutted in a non-joined state in a region inside a joint between the seal ring and the lid. It is.
[0016]
The method of manufacturing an electronic device according to the present invention includes the steps of: attaching a metal seal ring having a chamfered portion to an outer peripheral corner at an upper surface on a ceramic base; and a ceramic base positioned inside the seal ring. Mounting an electronic component element on the upper surface of the device, and mounting a metal lid having a bent portion on the outer periphery on the upper surface of the seal ring such that the bent portion comes into contact with the chamfered portion. And sealing the opening of the seal ring by joining the bent portion of the lid and the chamfered portion of the seal ring by resistance welding.
[0017]
Further, in the method of manufacturing an electronic device according to the present invention, a metal seal ring having a cutout formed in a corner portion on an outer peripheral side of an upper surface is attached to a ceramic base, and a ceramic seal ring located inside the seal ring is provided. A step of mounting an electronic component element on the upper surface of the base; and, on the upper surface of the seal ring, a metal lid having a bent portion on the outer peripheral portion. The bent portion is formed on the surface of the seal ring facing the cutout portion. And a step of sealing the opening of the seal ring by joining the lid and the seal ring by resistance welding at a contact portion between the lid and the seal ring. It is characterized by the following.
[0018]
According to the present invention, a chamfer or a notch is provided around the outer peripheral corner of the upper surface of the seal ring on which the metal lid is placed, and the chamfer or the notch is provided at a location where the chamfer or the notch is provided. Since the lid is resistance-welded to the seal ring, the lid and the seal ring are resistance-welded at a position below the upper surface of the seal ring. Accordingly, when the roller electrode of the resistance welding device is brought into contact with the lid and the lid and the seal ring are resistance-welded, even if the metal component (foreign matter) melted by the discharge spark tries to scatter toward the inside of the seal ring, Since the inside portion of the seal ring, which is not provided with a chamfered portion or a notch portion, serves as a barrier, it is possible to effectively prevent intrusion of foreign matter, and to improve the characteristics of the electronic component element housed inside the seal ring. It is possible to improve the productivity and reliability of the electronic device while maintaining the same and eliminating the short circuit between the circuit wirings due to the foreign matter.
[0019]
Further, according to the present invention, the seal ring and the lid are brought into contact with each other in a non-joined state in a region inside the joint between the seal ring and the lid, so that the seal ring is melted during resistance welding. It is possible to more reliably prevent the metal component from trying to enter the cavity, thereby providing further improvement in productivity and reliability.
[0020]
Further, according to the present invention, before assembling the electronic device, the outer peripheral portion of the lid is provided with a bent portion that is bent inward along a chamfered portion of the seal ring or the like, so that the lid can be assembled at the time of assembling the electronic device. When the electronic component is placed on the seal ring, the lid can be easily and accurately aligned with a predetermined position on the seal ring, so that the productivity of the electronic device can be further improved.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
(First embodiment)
FIG. 1 is a cross-sectional view of an electronic device according to a first embodiment of the present invention, FIG. 2 is a plan view of the electronic device of FIG. 1 with a lid removed and viewed from above, and FIG. FIG. 3B is an enlarged view of a part Z of FIG. 1. In this embodiment, a crystal oscillator using a crystal oscillator as an electronic component element will be described as an example.
[0022]
In the electronic device 1 shown in FIG. 1, a metal seal ring 24A is mounted on a ceramic base 2, and a quartz oscillator 3 is disposed on the upper surface of the ceramic base 2 located inside the seal ring 24A. Further, a metal lid 5A is joined to the upper surface of the seal ring 24A to seal the opening of the seal ring 24A.
[0023]
The ceramic base 2 is formed by integrally attaching a ring-shaped ceramic substrate 22 to an upper surface of a plate-shaped ceramic substrate 21. An inner surface of the ring-shaped ceramic substrate 22 and an upper surface of the plate-shaped ceramic substrate 21 located inside the ring-shaped ceramic substrate 22. A cavity 20 is formed in a region surrounded by
[0024]
The crystal resonator 3 housed inside the cavity 20 includes a rectangular crystal substrate 30 cut along a predetermined crystal axis, excitation electrodes 31 and 33 formed on both main surfaces of the crystal substrate, and the excitation electrodes 31 and 33. And lead electrodes 32, 34 extending toward one end of the quartz substrate from the substrate. The lead electrodes 32, 34 are connected to the electrode pads 25 provided on the upper surface of the flat ceramic substrate 21 via the conductive adhesive material 4. The crystal resonator 3 is electrically and mechanically connected to the ceramic base 2 by joining them together.
[0025]
A metallized layer 221 is formed on the upper surface of the ring-shaped ceramic substrate 22, and the metallized layer 221 and the seal ring 24A are brazed with a brazing material 23 so that the seal ring 24A is mounted on the ceramic base 2. Be worn.
[0026]
Note that, on the lower surface of the ceramic base 2, there are provided terminal electrodes 26 which are electrically connected to the above-mentioned electrode pads 25 via via-hole conductors (not shown) or the like. When mounted on a mounting board such as a motherboard or a module board, it functions as a terminal for connecting the electronic device to an electric circuit on the mounting board.
[0027]
Such a ceramic substrate 2 is manufactured by, for example, a conventionally well-known ceramic green sheet laminating method or press molding using ceramic powder. The electrode pads 25, the terminal electrodes 26, the metallized layer 221 and the like on the ceramic substrate 2 are made of molybdenum or tungsten. A conductive paste containing a high melting point metal material is applied to the surface of the ceramic substrate 2 or the ceramic green sheet by screen printing or the like, which is conventionally known, and is baked at a high temperature.
[0028]
The seal ring 24A and the lid 5A attached on the ceramic base 2 are made of a metal such as 42 alloy, Kovar, phosphor bronze, or the like, and the surface of the seal ring 24A has a Ni plating layer 242 and an Au plating layer. 243 are sequentially deposited, and a Ni plating layer 52 is deposited on the surface of the lid 5A.
[0029]
A convex chamfered portion 24a having a curvature radius of 10 μm to 300 μm is provided around the outer peripheral corner of the upper surface of the seal ring, and is bent inward along the chamfered portion 24a on the outer peripheral portion of the lid 5A. A bent portion 5a is provided, and the seal ring 24A and the lid 5A are joined by resistance welding the bent portion 5a and the chamfered portion 24a.
[0030]
For this reason, the lid 5A and the seal ring 24A are formed by resistance welding at a position below the upper surface of the seal ring 24A, whereby the roller electrode R of the resistance welding device is brought into contact with the lid 5A. When the lid 5A and the seal ring 24A are resistance-welded (see FIG. 4), the chamfered portion 24a is provided even if the metal component (foreign matter) melted by the discharge spark attempts to scatter toward the inside of the seal ring 24A. The inside portion of the seal ring 24A, which does not function as a barrier, can effectively prevent the intrusion of foreign matter, maintain good characteristics of the crystal resonator 3 housed in the cavity 20, and perform circuit wiring due to the foreign matter. There can be no short circuit between them.
[0031]
In this case, the seal ring 24A and the lid 5A are in a region inside the joint (W portion), that is, a region (BF) where the upper surface 24a1 of the seal ring 24A and the flat portion 5b of the lid 5A face each other. (A) in a non-joined state, whereby it is possible to more reliably prevent the metal component melted during resistance welding from trying to enter the cavity 20.
Therefore, the productivity and reliability of the electronic device can be significantly improved.
[0032]
In the case of manufacturing the electronic device of the first embodiment, first, a seal ring 24A having a chamfered portion 24a provided on the outer peripheral corner at the upper surface is attached to the ceramic base 2, and the seal ring 24A is formed. The quartz oscillator 3 is mounted on the upper surface of the ceramic base 2 located inside the cover 5A. Then, the lid 5A having the bent portion 5a provided on the outer peripheral portion thereof is formed on the upper surface of the seal ring 24A. It is placed so as to be in contact with the chamfered portion 5a, and finally, the bent portion 5a of the lid 5A and the chamfered portion 24a of the seal ring 24A are joined by resistance welding, and the opening of the seal ring 24A is sealed. By doing so, an electronic device as a product is completed.
[0033]
In this case, since the bent portion 5a which is bent inward along the chamfered portion 24a of the seal ring 24A is provided in advance on the outer peripheral portion of the cover 5A, the cover 5A is attached to the seal ring 24A when assembling the electronic device. When placed on the top, the lid 24A can be easily and accurately aligned with a predetermined position on the seal ring 5A, which can further improve the productivity of the electronic device.
[0034]
Further, when welding the seal ring 24A and the lid 5A, as shown in FIG. 4, the roller electrode R of the resistance welding device is caused to contact and scan the bent portion 5a of the lid 5A from the outside while scanning the lid 5A. A large current is applied to the seal ring 24A via the roller electrode R to generate a large amount of Joule heat between the bent portion 5a of the lid 5A and the chamfered portion 24a of the seal ring 24A. This is performed by melting the Ni plating layer 52 on the body surface, the Au plating layer 243 and the Ni plating layer 242 on the seal ring surface.
[0035]
When the crystal resonator 3 is used as an electronic component element as in the present embodiment, in order to effectively prevent corrosion and the like of the crystal resonator 3, the inside of the cavity 20 does not contain nitrogen gas or argon gas. Preferably, an active gas is sealed, in which case the above-described welding operation is performed in an inert gas atmosphere.
[0036]
(Second embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS. The same components as those in the first embodiment described above are denoted by the same reference numerals, and redundant description will be omitted.
[0037]
The difference between the electronic device of the second embodiment and the electronic device of the first embodiment is that the chamfered portion 24a of the seal ring 24A in the electronic device of the first embodiment has a convex curved surface, whereas the electronic device of the first embodiment has a convex curved surface. Is that the chamfered portion 24b of the seal ring 24B is planar.
[0038]
The flat chamfered portion 24b is inclined at an angle θ (for example, θ = 2 ° to 45 °) with respect to the upper surface of the seal ring 24B in consideration of workability of welding work and the like. The bent portion 5a of 5A and the chamfered portion 24b of the seal ring 24B are joined in the vicinity of the end of the bent portion 5a (W1 portion), and abutment portions (BS1 portion and BF1 portion) contacting in a non-joined state are provided inside. Is provided.
[0039]
Also in the electronic device of the second embodiment, the lid 5A and the seal ring 24B are formed by resistance welding at a position below the upper surface of the seal ring 24B. At the time of resistance welding, the metal component (foreign matter) melted by the discharge spark hardly adheres to an electronic component element or the like housed in the cavity. Moreover, since the seal ring 24B and the lid 5A are brought into contact with each other at the non-joined portions (BS1 portion and BF1 portion) located inside the joined portion (W1 portion), intrusion of foreign matter is more reliably prevented. As a result, the productivity and reliability of the electronic device are improved.
[0040]
In order to further secure the above-described effects, it is preferable that the inclination angle θ of the chamfered portion 24b with respect to the upper surface of the seal ring 24B is set in a range of 5 ° to 35 °. It is preferable that the width of the contact portion BF1 contacted in the state is 30 μm or more.
[0041]
(Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIGS. Note that the same components as those in the first and second embodiments described above are denoted by the same reference numerals, and redundant description will be omitted.
[0042]
The electronic device of the third embodiment is different from that of the second embodiment in that the planar chamfered portion 24b is partially formed at the outer peripheral corner of the upper surface of the seal ring in the electronic device of the second embodiment. On the other hand, the electronic device of the third embodiment is different from the electronic device of the third embodiment in that the entire upper surface of the seal ring 24C is formed as an inclined surface 24c in which the outer peripheral side is lower than the inner peripheral side.
[0043]
Such an inclined surface 24c and the bent portion 5a of the lid 5A are joined near the end of the bent portion 5a (W2 portion), and a contact portion (BS2 portion) is provided inside the bent portion 5a to be in a non-joined state. Have been.
[0044]
Also in the electronic device of the third embodiment, when the lid 5A and the seal ring 24C are resistance-welded, the metal component (foreign matter) melted by the discharge spark adheres to the electronic component element or the like housed in the cavity. The seal ring 24C and the lid 5A are in contact with each other at a non-joining portion (BS2 portion) located inside the joining portion (W2 portion), so that intrusion of foreign matters can be more reliably performed. This improves the productivity and reliability of the electronic device.
[0045]
In order to ensure the above-described effects, the inclination angle θ of the inclined surface of the seal ring 24B is preferably set in the range of 5 ° to 35 °. It is preferable that the width of the contact portion BS2 to be contacted is 30 μm or more. If the inclination angle θ of the inclined surface is set to 5 ° or more, there is an advantage that the width of the seal ring 24 </ b> C can be further narrowed to provide a smaller overall structure.
[0046]
(Fourth embodiment)
Next, an electronic device according to a fourth embodiment of the present invention will be described with reference to FIGS. The same components as those in the first embodiment described above are denoted by the same reference numerals, and redundant description will be omitted.
[0047]
The difference between the electronic device of the fourth embodiment and that of the first embodiment is that in the electronic device of the first embodiment, a chamfered portion 24a is provided around the outer peripheral corner of the upper surface of the seal ring 24A. 24a and the bent portion 5a of the lid 5A are joined by resistance welding, whereas in the electronic device of the fourth embodiment, a notch 24d is provided around the outer peripheral corner of the upper surface of the seal ring 24D. At the same time, a bent portion 5a bent toward the inside of the cutout portion 24d is provided on the outer peripheral portion of the lid 5A, and the bent portion 5a and the surface of the seal ring 24D facing the cutout portion 24d are joined by resistance welding. It is the point that it did.
[0048]
The surface of the seal ring 24D and the bent portion 5a of the lid 5A are joined at the tip corner (W3 portion) of the bent portion 5a, and the inside thereof is abutted in a non-joined state via the non-contacting BS3 portion. A contact portion (BF3 portion) is provided.
[0049]
Also in the electronic device of the fourth embodiment, the lid 5A and the seal ring 24D are formed by resistance welding at a position lower than the upper surface of the seal ring 24D. At the time of resistance welding, the metal component (foreign matter) melted by the discharge spark hardly adheres to an electronic component element or the like housed in the cavity. Moreover, since the seal ring 24D and the lid 5A are in contact with each other at the non-joining portion (BF3 portion) located inside the joining portion (W3 portion), the intrusion of foreign matter is more reliably prevented. Thus, the productivity and reliability of the electronic device are improved.
[0050]
In the case of manufacturing the electronic device of the fourth embodiment, first, a seal ring 24D having a notch 24d provided on the outer peripheral corner of the upper surface is attached onto the ceramic base 2, and The quartz oscillator 3 is mounted on the upper surface of the ceramic base 2 located inside the seal ring 24D, and then, on the upper surface of the seal ring 24D, a lid 5A provided with a bent portion 5a on the outer periphery in advance is provided. The folded part 5a is placed so as to be in contact with the surface of the seal ring 24D facing the notch 5d, and finally the lid 5A and the seal ring 24D are joined by resistance welding at the contact part between them. The electronic device as a product is completed by sealing the opening of the seal ring 24D.
[0051]
Also in this case, since the bent portion 5a which is bent inward along the cutout portion 24d of the seal ring 24D is provided in advance on the outer peripheral portion of the cover 5A, the cover 5A is sealed when assembling the electronic device. When the lid 24A is placed on the ring 24D, the lid 24A can be easily and accurately aligned with a predetermined position on the seal ring 5D, and the productivity of the electronic device can be further improved.
[0052]
(Fifth embodiment)
Next, an electronic device according to a fifth embodiment of the present invention will be described with reference to FIG. Note that the same components as those in the first and fourth embodiments described above are denoted by the same reference numerals, and redundant description will be omitted.
[0053]
The difference between the electronic device of the fifth embodiment and the electronic device of the fourth embodiment is that in the electronic device of the fourth embodiment, the bent portion 5a of the lid 5 and the seal ring 24D are joined at the corner of the tip of the bent portion. On the other hand, in the electronic device of the fifth embodiment, the bent portion 5ao of the lid 5B and the seal ring 24D are brought into surface contact near the tip of the bent portion 5ao, and the two are joined at this surface contact portion. That is the point.
[0054]
The surface of the seal ring 24D and the bent portion 5ao of the lid 5B are joined at a surface contact portion (W4 portion) near the tip of the bent portion, and the inside thereof is in a non-joined state via a non-contacting BS4 portion. An abutting portion (BF4 portion) that abuts is provided.
[0055]
Also in the electronic device of the fifth embodiment, when the lid 5B and the seal ring 24D are resistance-welded, the metal component (foreign matter) melted by the discharge spark adheres to the electronic component element or the like housed in the cavity. The seal ring 24D and the lid 5B are brought into contact with each other at a non-joining portion (BF4 portion) located inside the joining portion (W4 portion), so that intrusion of foreign matters can be more reliably performed. This improves the productivity and reliability of the electronic device.
[0056]
It should be noted that the present invention is not limited to the above-described first to fifth embodiments, and various changes and improvements can be made without departing from the spirit of the present invention.
[0057]
For example, in the above-described first to fifth embodiments, a quartz oscillator is used as the electronic component element. Instead, a piezoelectric oscillator such as a surface acoustic wave oscillator or the like may be used as the electronic component element. Other electronic component elements such as a semiconductor element and a capacitor may be used. In such a case, the same effects as those of the above-described first to fifth embodiments can be obtained.
[0058]
Further, in the above-described first embodiment and the like, when the lid is welded to the seal ring, a bent portion is formed in advance on the outer peripheral portion of the lid, but instead of this, as shown in FIG. When the lid 5A is welded to the seal ring 24D, first, the flat lid 5A is placed on the seal ring 24D, and when the two are joined by resistance welding, the pressing from the roller electrode R accompanying the welding operation is performed. The outer peripheral portion of the lid 5A may be bent inward along the chamfered portion of the seal ring 24A by pressure.
[0059]
【The invention's effect】
According to the present invention, a chamfer or a notch is provided around the outer peripheral corner of the upper surface of the seal ring on which the metal lid is placed, and the chamfer or the notch is provided at a location where the chamfer or the notch is provided. Since the lid is resistance-welded to the seal ring, the lid and the seal ring are resistance-welded at a position below the upper surface of the seal ring. Accordingly, when the roller electrode of the resistance welding device is brought into contact with the lid and the lid and the seal ring are resistance-welded, even if the metal component (foreign matter) melted by the discharge spark tries to scatter toward the inside of the seal ring, Since the inside portion of the seal ring, which is not provided with a chamfered portion or a notch portion, serves as a barrier, it is possible to effectively prevent intrusion of foreign matter, and to improve the characteristics of the electronic component element housed inside the seal ring. It is possible to improve the productivity and reliability of the electronic device while maintaining the same and eliminating the short circuit between the circuit wirings due to the foreign matter.
[0060]
Further, according to the present invention, the seal ring and the lid are brought into contact with each other in a non-joined state in a region inside the joint between the seal ring and the lid, so that the seal ring is melted during resistance welding. It is possible to more reliably prevent the metal component from trying to enter the cavity, thereby providing further improvement in productivity and reliability.
[0061]
Further, according to the present invention, before assembling the electronic device, the outer peripheral portion of the lid is provided with a bent portion that is bent inward along a chamfered portion of the seal ring or the like, so that the lid can be assembled at the time of assembling the electronic device. When the electronic component is placed on the seal ring, the lid can be easily and accurately aligned with a predetermined position on the seal ring, so that the productivity of the electronic device can be further improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an electronic device according to a first embodiment of the present invention.
FIG. 2 is a plan view of the electronic device of FIG. 1 with a lid removed and viewed from above.
3A is an enlarged view of a main part of a seal ring used in the electronic device of FIG. 1, and FIG. 3B is an enlarged view of a Z part of FIG.
FIG. 4 is a view for explaining a welding operation when the electronic device of the first example is manufactured by the manufacturing method according to the embodiment of FIG. 1;
FIG. 5A is an enlarged view of a main part of a seal ring used in an electronic device according to a second embodiment of the present invention, and FIG. 5B is a cross-sectional view of a main part of the electronic device according to the second embodiment of the present invention. It is.
6A is an enlarged view of a main part of a seal ring used in an electronic device according to a third embodiment of the present invention, and FIG. 6B is a cross-sectional view of a main part of the electronic device according to the third embodiment of the present invention. It is.
7A is an enlarged view of a main part of a seal ring used in an electronic device according to a fourth embodiment of the present invention, and FIG. 7B is a cross-sectional view of a main part of the electronic device according to the fourth embodiment of the present invention; It is.
FIG. 8 is a sectional view of a main part of an electronic device according to a fifth embodiment of the present invention.
FIG. 9 is a diagram for explaining a welding operation when the electronic device of the first example is manufactured by the manufacturing method according to another embodiment of the present invention.
FIG. 10 is a cross-sectional view of a conventional electronic device.
[Explanation of symbols]
1 ... Electronic device (crystal oscillator)
2 ・ ・ ・ Ceramic substrate
21 ... flat ceramic substrate
22 ... Ring-shaped ceramic substrate
3. Electronic component element (quartz oscillator)
24A, 24B, 24C, 24D ... seal ring
24a, 24b, 24c ... chamfered part
24d: Notch
242 ... Ni plating layer
243 ... Au plating layer
5A, 5B ... lid
5a, 5ao ... bending part
20 ... cavity
R: Roller electrode of resistance welding equipment

Claims (8)

A metal seal ring is mounted on the ceramic substrate, an electronic component element is disposed on the upper surface of the ceramic substrate located inside the seal ring, and a metal lid is joined to the upper surface of the seal ring. An electronic device in which the opening of the seal ring is sealed by
A chamfer is provided around the outer peripheral corner of the upper surface of the seal ring, and a bent portion is provided on the outer peripheral portion of the lid along the chamfer, and the bent portion and the chamfer are connected to each other. An electronic device characterized by being joined by welding. The electronic device according to claim 1, wherein the chamfered portion is a convex curved surface having a radius of curvature of 10 μm to 300 μm. 2. The electronic device according to claim 1, wherein the chamfered portion is a plane inclined by 5 ° to 35 ° with respect to an upper surface of the seal ring. 3. A metal seal ring is mounted on the ceramic substrate, an electronic component element is disposed on the upper surface of the ceramic substrate located inside the seal ring, and a metal lid is joined to the upper surface of the seal ring. An electronic device in which the opening of the seal ring is sealed by
The upper surface of the seal ring is formed as an inclined surface having an outer peripheral side lower than the inner peripheral side, and a bent part is provided on the outer peripheral part of the lid body inwardly bent along the inclined surface. An electronic device, wherein the inclined surface is joined by resistance welding. A metal seal ring is mounted on the ceramic substrate, an electronic component element is disposed on the upper surface of the ceramic substrate located inside the seal ring, and a metal lid is joined to the upper surface of the seal ring. An electronic device in which the opening of the seal ring is sealed by
A notch is provided around an outer peripheral corner of the upper surface of the seal ring, and a bent portion is provided on an outer peripheral portion of the lid toward the inside of the notch, and the bent portion and the notch are provided. An electronic device characterized in that a surface of a seal ring facing the device is joined by resistance welding. 6. The seal ring and the lid are abutted in a non-joined state in a region inside a joint portion between the seal ring and the lid. An electronic device according to claim 1. Attaching a metal seal ring having a chamfered portion to the outer peripheral corner of the upper surface on the ceramic substrate, and mounting an electronic component element on the upper surface of the ceramic substrate located inside the seal ring; ,
On the upper surface of the seal ring, a step of placing a metal lid having a bent portion on an outer peripheral portion so that the bent portion comes into contact with the chamfered portion,
Joining the bent portion of the lid and the chamfered portion of the seal ring by resistance welding to seal the opening of the seal ring. A step of attaching a metal seal ring having a notch at the outer peripheral corner of the upper surface to a ceramic substrate and mounting an electronic component element on the upper surface of the ceramic substrate located inside the seal ring. When,
On the upper surface of the seal ring, a metal lid having a bent portion on the outer peripheral portion, a step of placing the bent portion so as to be in contact with the surface of the seal ring facing the cutout portion,
A step of sealing the opening of the seal ring by joining the lid and the seal ring by resistance welding at a contact portion between them.

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